Abstract: In example embodiments, techniques are provided for using a combination of multiple ML models and signal processing to extract links and connectivity from a schematic diagram in an image-only format. A first ML model (i.e. link segmenter) may produce a first set of predictions about the positions of link segments in the schematic diagram (e.g., in the form of a segmentation map). A second ML model (i.e. keypoint detector) may produce a second set of predictions about starting and stopping points of link segments in the schematic diagram (e.g., in the form of one or more heatmaps). A signal processing module may combine the first set of predictions and the second set of predictions to produce a description of links and connectivity they provide (e.g., combining the segmentation map with data from the one or more heatmaps). The results of the combining may be saved as a graph connectivity matrix.