Abstract: An apparatus including first and second substrates. The first and second substrates each include a base and at least one peripheral wall extending from the base. One of the at least one peripheral walls of the first or second substrates includes at least one well, and the other of the at least one peripheral walls of the first or the seconds substrate that does not include a well is mechanically anchored to the well. The apparatus includes a stack having a first and second end, and the stack is disposed on the base of the first and/or the second substrates at the first and/or second ends. The stack includes at least one element configured to generate energy. A method of assembling the apparatus by contacting the substrates.

Abstract: An apparatus for testing a wafer or chip comprising a photonic integrated circuit comprises: an electrical signal interface module comprising an array of movable conducting structures; a photonic signal interface module attached to the electrical signal interface module, the photonic signal interface module comprising one or more optical fiber interfaces, and a first set of grating couplers arranged over at least a first plane of the photonic signal interface module; and one or more electrical signal connections between the electrical signal interface module and the photonic signal interface module.

Abstract: A stress compensating pick-up tool for aligning a companion chip with a host chip includes a tool tip and an actuator. The tool tip holds the companion chip, and includes a first tip portion and a second tip portion. The actuator applies a force to the tool tip, wherein the force causes the first tip portion and the second tip portion to rotate in opposite directions with respect to one another to optically align a portion of the companion chip with a corresponding portion of the host chip.

Abstract: A stress compensating pick-up tool for aligning a companion chip with a host chip includes a tool tip and an actuator. The tool tip holds the companion chip, and includes a first tip portion and a second tip portion. The actuator applies a force to the tool tip, wherein the force causes the first tip portion and the second tip portion to rotate in opposite directions with respect to one another to optically align a portion of the companion chip with a corresponding portion of the host chip.

Abstract: Disclosed herein is an apparatus that includes a housing including a first opening and a second opening. The first opening forms a suction connection with a transportable component. The apparatus includes a valve connected with the second opening a channel defined within the housing. The channel extends between the first opening and the second opening. The apparatus includes a vacuum maintaining mechanism disposed within the channel, and the vacuum maintaining mechanism holds a partial vacuum within the channel.

Abstract: A method including disposing a structural adhesive onto an elevated surface of a first chip that includes a cavity disposed below the elevated surface. The method includes contacting a carrier with the structural adhesive. The carrier includes a second chip that optically aligns with a lateral surface of the cavity. The method includes curing the structural adhesive so that the carrier and host chip are mechanically anchored. An apparatus includes a first chip including a cavity located between lateral walls of the first chip and a carrier mechanically anchored with the first chip at a top portion of the lateral walls. The carrier includes a second chip that optically aligns with the first chip at a side portion of one of the lateral walls. The first and second chips are free of contact at a bottom surface of the second chip and a bottom surface of the cavity.

Abstract: Disclosed herein is an apparatus that includes a housing including a first opening and a second opening. The first opening forms a suction connection with a transportable component. The apparatus includes a valve connected with the second opening a channel defined within the housing. The channel extends between the first opening and the second opening. The apparatus includes a vacuum maintaining mechanism disposed within the channel, and the vacuum maintaining mechanism holds a partial vacuum within the channel.

Abstract: An apparatus for assembling a photonic system comprising a photonic integrated circuit (PIC) includes: a support structure configured to support the PIC; and a rigid structure surrounding a hollow passage that extends to an opening at a distal end of the rigid structure. The rigid structure includes an optically transmissive portion configured to transmit at least about 50% of a received beam of ultraviolet light, and configured such that at least a portion of the ultraviolet light transmitted through the rigid structure is incident upon an edge surface of the PIC at an angle of incidence that is less than about 60 degrees.

Abstract: The present disclosure concerns an adjustable mammal leg brace comprising: an elongated brace support having a lower portion and a longitudinal direction; a hoof-supporting base engaged with the lower portion of the elongated brace support and extending rearwardly therefrom; and at least one leg-abutting block comprising a leg-receiving surface and being engaged with the elongated brace support above the hoof-supporting base, the at least one leg-abutting block being at least one of pivotably mounted to and translatable along the elongated brace support. It also concerns a brace-receiving stand to receive and support a horse leg brace, comprising: a supporting base having a ground-contacting surface; and a brace-receiving portion pivotably mounted to the supporting base and having a brace-receiving surface. It also concerns a mammal leg brace assembly comprising such an adjustable mammal leg brace and a brace receiving stand, and a kit for forming the same.

Abstract: A stress compensating pick-up tool for aligning a companion chip with a host chip includes a tool tip and an actuator. The tool tip holds the companion chip, and includes a first tip portion and a second tip portion. The actuator applies a force to the tool tip, wherein the force causes the first tip portion and the second tip portion to rotate in opposite directions with respect to one another to optically align a portion of the companion chip with a corresponding portion of the host chip.

Abstract: An apparatus for assembling a photonic system comprising a photonic integrated circuit (PIC) includes: a support structure configured to support the PIC; and a rigid structure surrounding a hollow passage that extends to an opening at a distal end of the rigid structure. The rigid structure includes an optically transmissive portion configured to transmit at least about 50% of a received beam of ultraviolet light, and configured such that at least a portion of the ultraviolet light transmitted through the rigid structure is incident upon an edge surface of the PIC at an angle of incidence that is less than about 60 degrees.

Abstract: A shoulder orthosis is provided for maintenance of a patients arm in a postoperative shoulder immobilization posture in the context of tearing of rotator cuff muscles. The orthosis comprises a belt, an arm splint, and a column member with axial mechanical spring continuously adjustable by a manual adjustment handle and interconnecting the belt to the splint and biasing the splint to an abduction upper limit position. The orthosis provides stable support for the patients forearm around a horizontal plane, while allowing pivoting movement of the patients injured arm about a vertical axis intersecting the patients elbow and approaching the patients torso in a transverse plane. This orthosis also allows a cyclical back and forth movement of the splint, the free downward movement of the patients arm by his healthy muscles, assisted by the adductor muscles against the bias of the adjustable spring without active movement of the rotator cuff.