Patents by Inventor Raphael Morency

Raphael Morency has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11105611
    Abstract: A method and apparatus for non-contact measurement of stress in a thin-film deposited on a substrate is disclosed. The method may include positioning a substrate on a plurality of support-elements, the substrate having a thin-film deposited thereupon. A first-polynomial may be defined for representing a surface of the substrate that is in contact with the support elements. A second-polynomial may be determined based on an optimization determination of potential-energy acting upon the substrate. A finite-order polynomial may be created by calculating a product of the first and second polynomials to represent a shape of the surface of the substrate as a model of the surface. Thereafter, stress in the substrate may be determined based on fitting the model of the surface with a measured topographical data of the surface.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: August 31, 2021
    Assignee: APPLEJACK 199 L.P.
    Inventors: Wojciech J Walecki, Wei-Chun Hung, Raphael Morency
  • Publication number: 20190353475
    Abstract: A method and apparatus for non-contact measurement of stress in a thin-film deposited on a substrate is disclosed. The method may include positioning a substrate on a plurality of support-elements, the substrate having a thin-film deposited thereupon. A first-polynomial may be defined for representing a surface of the substrate that is in contact with the support elements. A second-polynomial may be determined based on an optimization determination of potential-energy acting upon the substrate. A finite-order polynomial may be created by calculating a product of the first and second polynomials to represent a shape of the surface of the substrate as a model of the surface. Thereafter, stress in the substrate may be determined based on fitting the model of the surface with a measured topographical data of the surface.
    Type: Application
    Filed: May 15, 2018
    Publication date: November 21, 2019
    Inventors: Wojciech J. WALECKI, Wei-Chun HUNG, Raphael Morency