Abstract: The present invention relates to a winding and a method for preparing a winding of inductive devices. The winding includes at least a plurality of layers, where each layer includes at least one conductive loop; the conductive loops are electrically connected to form a winding; and the conductive loop or the portion of the conductive loop of at least one layer is not spatially aligned with the conductive loop or the portion of the conductive loop of at least one another layer. The winding may be prepared by adopting a PCB process or semiconductor process, which can effectively consume less of surface area on the integration substrate, have a symmetric trace and reduce the parasitic coupling capacitance while acquiring a high Q-factor value. The windings of the present invention may be used for making an inductor or a transformer.

Abstract: The present invention relates to a winding and a method for preparing a winding of inductive devices. The winding includes at least a plurality of layers, where each layer includes at least one conductive loop; the conductive loops are electrically connected to form a winding; and the conductive loop or the portion of the conductive loop of at least one layer is not spatially aligned with the conductive loop or the portion of the conductive loop of at least one another layer. Preferably, except for the conductive loop that includes a center tap, other conductive loops are each divided into 2N loop sections, each loop section is electrically connected to a corresponding loop section of another layer through a pair of crossover conductive via plugs, so as to form N windings, where N is an integer greater than or equal to 1.