Patents by Inventor Raquel Consuelo Hellin Rico

Raquel Consuelo Hellin Rico has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for encapsulating a device in a microcavity
    Patent number: 7803665
    Abstract: Manufacturing a semiconductor device involves forming (200) a sacrificial layer where a micro cavity is to be located, forming (210) a metal layer of thickness greater than 1 micron over the sacrificial layer, forming (220) a porous layer from the metal layer, the porous layer having pores of length greater than ten times their breadth, and having a breadth in the range 10 nm-500 nanometers. The pores can be created by anodising, electrodeposition or dealloying. Then the sacrificial layer can be removed (230) through the porous layer, to form the micro cavity, and pores can be sealed (240). Encapsulating MEMS devices with a porous layer can reduce costs by avoiding using photolithography for shaping the access holes since the sacrificial layer is removed through the porous membrane.
    Type: Grant
    Filed: February 6, 2006
    Date of Patent: September 28, 2010
    Assignees: IMEC, Katholieke Universiteit Leuven, K.U. Leuven R&D
    Inventors: Ann Witvrouw, Chris Van Hoof, Raquel Consuelo Hellin Rico, Anthony Joseph Muscat, Jan Fransaer, Jean-Pierre Celis
  • Method for Encapsulating a Device in a Microcavity
    Publication number: 20100210073
    Abstract: Manufacturing a semiconductor device involves forming (200) a sacrificial layer where a micro cavity is to be located, forming (210) a metal layer of thickness greater than 1 micron over the sacrificial layer, forming (220) a porous layer from the metal layer, the porous layer having pores of length greater than ten times their breadth, and having a breadth in the range 10 nm-500 nanometers. The pores can be created by anodising, electrodeposition or dealloying. Then the sacrificial layer can be removed (230) through the porous layer, to form the micro cavity, and pores can be sealed (240). Encapsulating MEMS devices with a porous layer can reduce costs by avoiding using photolithography for shaping the access holes since the sacrificial layer is removed through the porous membrane.
    Type: Application
    Filed: May 3, 2010
    Publication date: August 19, 2010
    Applicants: IMEC, KATHOLIEKE UNIVERSITEIT LEUVEN, K.U. LEUVEN R&D
    Inventors: Ann Witvrouw, Chris Van Hoof, Jan Fransaer, Jean-Pierre Celis, Raquel Consuelo Hellin Rico, Anthony Joseph Muscat
  • Method For Encapsulating A Device In A Microcavity
    Publication number: 20080135998
    Abstract: Manufacturing a semiconductor device involves forming (200) a sacrificial layer where a micro cavity is to be located, forming (210) a metal layer of thickness greater than 1 micron over the sacrificial layer, forming (220) a porous layer from the metal layer, the porous layer having pores of length greater than ten times their breadth, and having a breadth in the range 10 nm-500 nanometers. The pores can be created by anodising, electrodeposition or dealloying. Then the sacrificial layer can be removed (230) through the porous layer, to form the micro cavity, and pores can be sealed (240). Encapsulating MEMS devices with a porous layer can reduce costs by avoiding using photolithography for shaping the access holes since the sacrificial layer is removed through the porous membrane.
    Type: Application
    Filed: February 6, 2006
    Publication date: June 12, 2008
    Applicants: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC), KATHOLIEKE UNIVERSITEIT LEUVEN
    Inventors: Ann Witvrouw, Chris Van Hoof, Jan Fransaer, Jean-Pierre Celis, Anthony Joseph Muscat, Raquel Consuelo Hellin Rico