Patents by Inventor Raquel FUNDAN

Raquel FUNDAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT (IC) PACKAGE WITH A GROUNDED ELECTRICALLY CONDUCTIVE SHIELD LAYER AND ASSOCIATED METHODS
    Publication number: 20170263565
    Abstract: An integrated circuit (IC) package includes a substrate and an IC die carried by the substrate. An encapsulated body is over the IC die. At least one grounding wire is within the encapsulated body and has a proximal end coupled to the substrate and a distal end exposed on an outer surface of the encapsulated body. An electrically conductive shield layer is on the outer surface of the encapsulated body and in contact with the exposed distal end of the at least one grounding wire.
    Type: Application
    Filed: March 14, 2016
    Publication date: September 14, 2017
    Inventors: Loic Pierre Louis RENARD, Raquel FUNDAN