Patents by Inventor Raschid J. Bezama
Raschid J. Bezama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10242931Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.Type: GrantFiled: November 10, 2015Date of Patent: March 26, 2019Assignee: International Business Machines CorporationInventors: Raschid J. Bezama, David C. Long, Govindarajan Natarajan, Thomas Weiss
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Patent number: 10177075Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.Type: GrantFiled: June 20, 2016Date of Patent: January 8, 2019Assignee: International Business Machines CorporationInventors: Raschid J. Bezama, David C. Long, Govindarajan Natarajan, Thomas Weiss
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Patent number: 9574283Abstract: An electroplating/etch apparatus including a fluid jet and a dryer present over the tank containing the electrolyte for the electroplating/etch process. The fluid jet and the dryer remove excess liquids, such as electrolyte, from the component being plated or etched, e.g., working electrode. The working electrode is present on a holder that traverses from a first position within the tank during a plating or etch operation to a second position that is outside the containing the plating electrolyte. The fluid jet rinses the working electrode when the holder is in the second position, and the forced air dryer blows any remaining fluid from the fluid jet and the electrolyte from the working electrode into the tank.Type: GrantFiled: November 21, 2015Date of Patent: February 21, 2017Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama, Hariklia Deligianni
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Publication number: 20160300780Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.Type: ApplicationFiled: June 20, 2016Publication date: October 13, 2016Inventors: Raschid J. Bezama, David C. Long, Govindarajan Natarajan, Thomas Weiss
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Publication number: 20160076165Abstract: An electroplating/etch apparatus including a fluid jet and a dryer present over the tank containing the electrolyte for the electroplating/etch process. The fluid jet and the dryer remove excess liquids, such as electrolyte, from the component being plated or etched, e.g., working electrode. The working electrode is present on a holder that traverses from a first position within the tank during a plating or etch operation to a second position that is outside the containing the plating electrolyte. The fluid jet rinses the working electrode when the holder is in the second position, and the forced air dryer blows any remaining fluid from the fluid jet and the electrolyte from the working electrode into the tank.Type: ApplicationFiled: November 21, 2015Publication date: March 17, 2016Inventors: Charles L. Arvin, Raschid J. Bezama, Hariklia Deligianni
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Publication number: 20160076167Abstract: An electroplating/etch apparatus including a fluid jet and a dryer present over the tank containing the electrolyte for the electroplating/etch process. The fluid jet and the dryer remove excess liquids, such as electrolyte, from the component being plated or etched, e.g., working electrode. The working electrode is present on a holder that traverses from a first position within the tank during a plating or etch operation to a second position that is outside the containing the plating electrolyte. The fluid jet rinses the working electrode when the holder is in the second position, and the forced air dryer blows any remaining fluid from the fluid jet and the electrolyte from the working electrode into the tank.Type: ApplicationFiled: November 21, 2015Publication date: March 17, 2016Applicants: International Business Machines Corporation, International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama, Hariklia Deligianni
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Publication number: 20160064306Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.Type: ApplicationFiled: November 10, 2015Publication date: March 3, 2016Inventors: Raschid J. Bezama, David C. Long, Govindarajan Natarajan, Thomas Weiss
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Patent number: 9222194Abstract: An electroplating/etch apparatus including a fluid jet and a dryer present over the tank containing the electrolyte for the electroplating/etch process. The fluid jet and the dryer remove excess liquids, such as electrolyte, from the component being plated or etched, e.g., working electrode. The working electrode is present on a holder that traverses from a first position within the tank during a plating or etch operation to a second position that is outside the containing the plating electrolyte. The fluid jet rinses the working electrode when the holder is in the second position, and the forced air dryer blows any remaining fluid from the fluid jet and the electrolyte from the working electrode into the tank.Type: GrantFiled: August 19, 2010Date of Patent: December 29, 2015Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama, Hariklia Deligianni
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Patent number: 9035459Abstract: Interconnect structures and methods of fabricating the same are provided. The interconnect structures provide highly reliable copper interconnect structures for improving current carrying capabilities (e.g., current spreading). The structure includes an under bump metallurgy formed in a trench. The under bump metallurgy includes at least: an adhesion layer; a plated barrier layer; and a plated conductive metal layer provided between the adhesion layer and the plated barrier layer. The structure further includes a solder bump formed on the under bump metallurgy.Type: GrantFiled: April 10, 2009Date of Patent: May 19, 2015Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama, Harry D. Cox, Timothy H. Daubenspeck, Krystyna W. Semkow, Timothy D. Sullivan
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Patent number: 9018760Abstract: A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall.Type: GrantFiled: November 19, 2013Date of Patent: April 28, 2015Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama, Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad, Wolfgang Sauter, Timothy D. Sullivan, Brian R. Sundlof
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Patent number: 8926820Abstract: An electroplating apparatus including a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.Type: GrantFiled: September 12, 2012Date of Patent: January 6, 2015Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama, Glen N. Biggs, Hariklia Deligianni, Tracy A. Tong
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Patent number: 8803317Abstract: Interconnect structures and methods of fabricating the same are provided. The interconnect structures provide highly reliable copper interconnect structures for improving current carrying capabilities (e.g., current spreading). The structure includes an under bump metallurgy formed in a trench. The under bump metallurgy includes at least: an adhesion layer; a plated barrier layer; and a plated conductive metal layer provided between the adhesion layer and the plated barrier layer. The structure further includes a solder bump formed on the under bump metallurgy.Type: GrantFiled: March 29, 2012Date of Patent: August 12, 2014Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama, Harry D. Cox, Timothy H. Daubenspeck, Krystyna W. Semkow, Timothy D. Sullivan
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Patent number: 8784618Abstract: An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.Type: GrantFiled: August 19, 2010Date of Patent: July 22, 2014Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama, Glen N. Biggs, Hariklia Deligianni, Tracy A. Tong
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Publication number: 20140077367Abstract: A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall.Type: ApplicationFiled: November 19, 2013Publication date: March 20, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. Arvin, Raschid J. Bezama, Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad, Wolfgang Sauter, Timothy D. Sullivan, Brian R. Sundlof
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Patent number: 8674506Abstract: Structures and methods to reduce maximum current density in a solder ball are disclosed. A method includes forming a contact pad in a last wiring level and forming a plurality of wires of the contact pad extending from side edges of the contact pad to respective ones of a plurality of vias. Each one of the plurality of wires has substantially the same electrical resistance.Type: GrantFiled: April 30, 2013Date of Patent: March 18, 2014Assignee: International Business Machines CorporationInventors: Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra, George J. Scott, Krystyna W. Semkow, Timothy D. Sullivan, Robin A. Susko, Thomas A. Wassick, Xiaojin Wei, Steven L. Wright
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Patent number: 8637392Abstract: A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall.Type: GrantFiled: February 5, 2010Date of Patent: January 28, 2014Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama, Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad, Wolfgang Sauter, Timothy D. Sullivan, Brian R. Sundlof
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Patent number: 8623194Abstract: Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.Type: GrantFiled: September 6, 2012Date of Patent: January 7, 2014Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama, Harry D. Cox, Krystyna W. Semkow
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Patent number: 8551303Abstract: Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.Type: GrantFiled: February 28, 2012Date of Patent: October 8, 2013Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama, Harry D. Cox, Krystyna W. Semkow
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Publication number: 20130234329Abstract: Structures and methods to reduce maximum current density in a solder ball are disclosed. A method includes forming a contact pad in a last wiring level and forming a plurality of wires of the contact pad extending from side edges of the contact pad to respective ones of a plurality of vias. Each one of the plurality of wires has substantially the same electrical resistance.Type: ApplicationFiled: April 30, 2013Publication date: September 12, 2013Applicant: Intetnational Business Machines CorporationInventors: Raschid J. BEZAMA, Timothy H. DAUBENSPECK, Gary LaFONTANT, Ian D. MELVILLE, Ekta MISRA, George J. SCOTT, Krystyna W. SEMKOW, Timothy D. SULLIVAN, Robin A. SUSKO, Thomas A. WASSICK, Xiaojin WEI, Steven L. WRIGHT
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Patent number: 8450619Abstract: Solutions for improving current spreading in organic substrates are disclosed. In one aspect, a packaging substrate is disclosed, the packaging substrate comprising: a substrate base having a first surface and a second surface; and a controlled collapse chip connect (C4) pad over a portion of the first surface, the C4 pad including: an electrolessly plated copper (Cu) layer over the first surface; an electrolytic nickel (Ni) portion over the first electrolytic Cu portion; and a first electrolytic Cu portion over the electrolytic Ni portion; wherein the electrolessly plated Cu layer has a portion extending in one direction away from the C4 pad.Type: GrantFiled: January 7, 2010Date of Patent: May 28, 2013Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Raschid J. Bezama