Abstract: Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

Abstract: A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.

Abstract: A cooler includes a base layer, a cooling layer including at least one inlet slot and at least one outlet slot for flowing a coolant across a cooling structure including a plurality of staggered fins arranged in rows and columns, wherein fins of adjacent columns are staggered, and at least one manifold layer disposed on the cooling layer for flowing the coolant from a cooler inlet to the at least inlet slot and from the at least one outlet slot to a cooler outlet, the at least one manifold layer having a top layer comprising the cooler inlet and the cooler outlet.

Abstract: A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.

Abstract: A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.

Abstract: Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

Abstract: Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

Abstract: A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.

Abstract: Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

Abstract: A cooler includes a base layer, a cooling layer including at least one inlet slot and at least one outlet slot for flowing a coolant across a cooling structure including a plurality of staggered fins arranged in rows and columns, wherein fins of adjacent columns are staggered, and at least one manifold layer disposed on the cooling layer for flowing the coolant from a cooler inlet to the at least inlet slot and from the at least one outlet slot to a cooler outlet, the at least one manifold layer having a top layer comprising the cooler inlet and the cooler outlet.

Abstract: A solder mold for transferring solder to a wafer includes a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels formed between the plurality of solder cavities.

Abstract: A method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate. A plurality of ventilation channels are etched on the substrate connecting the plurality of solder cavities.

Abstract: Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices. Apparatus for microchannel cooling include integrated microchannel heat sink devices and fluid distribution manifold structures that are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths.

Abstract: Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices having a non-uniform power density distribution, which are mounted face down on a package substrate. For example, integrated microchannel cooler devices (or microchannel heat sink devices) for cooling IC chips are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths, as well as provide variable localized cooling capabilities for high power density regions (or “hot spots”) of IC chips with higher than average power densities.

Abstract: An apparatus in which opposed nozzle assemblies are utilized to clean residual material, such as a metallic paste, from an article, such as a screening mask. Each of the nozzle assemblies has a first set of nozzles for spraying a cleaning agent onto the article in a first pattern to first chemically and mechanically remove residual material from the article. At least one of the nozzle assemblies has a second set of nozzles for spraying a cleaning agent onto the article in a second pattern while simultaneously applying a voltage between the second set of nozzles and the article to then chemically and electrolytically remove the remaining residual material from the article.

Abstract: A method to control the post sinter distortion of free sintered multilayer ceramic substrates by placing a discrete non-densifying structure in the green ceramic laminate prior to sintering. One or several discrete non-densifying structures are placed on one or more ceramic greensheets which are then stacked and laminated to form a green ceramic laminate. The laminate is then sintered and the discrete non-densifying structure will locally control the dimensions of the free sintered multilayer ceramic substrate. The method can be used to control post sinter dimensions in MLC substrates manufactured as either single or multi-up substrates by placing the discrete non-densifying structure in the active area or in the kerf area between the individual product ups prior to sintering.

Abstract: An apparatus in which opposed nozzle assemblies are utilized to clean residual material, such as a metallic paste, from an article, such as a screening mask. Each of the nozzle assemblies has a first set of nozzles for spraying a cleaning agent onto the article in a first pattern to first chemically and mechanically remove residual material from the article. At least one of the nozzle assemblies has a second set of nozzles for spraying a cleaning agent onto the article in a second pattern while simultaneously applying a voltage between the second set of nozzles and the article to then chemically and electrolytically remove the remaining residual material from the article.

Abstract: A method to control the post sinter distortion of free sintered multilayer ceramic substrates by placing a discrete non-densifying structure in the green ceramic laminate prior to sintering. One or several discrete non-densifying structures are placed on one or more ceramic greensheets which are then stacked and laminated to form a green ceramic laminate. The laminate is then sintered and the discrete non-densifying structure will locally control the dimensions of the free sintered multilayer ceramic substrate. The method can be used to control post sinter dimensions in MLC substrates manufactured as either single or multi-up substrates by placing the discrete non-densifying structure in the active area or in the kerf area between the individual product ups prior to sintering.

Abstract: A punch tool for punching a slug from a workpiece. The punch of the punch tool has a reciprocating travel path with a transition region where the punch changes direction. A die plate of the punch tool has an aperture. A support bushing disposed in the aperture of the die plate provides support for the workpiece and has an underside and an opening through which the punch and the slug pass. A nozzle disposed in the aperture of the die plate provides an internal passage for the removal of punch slugs from the tool. The nozzle has a top and a side wall with a hole disposed in the side wall adjacent the transition region of the reciprocating travel path of the punch. The nozzle, the support bushing, and the die plate are integrated to form a flow path delivering a gas flow to the hole in the nozzle. The flow path and the hole direct the gas flow on a slug attached to the punch in the transition region of the reciprocating travel path of the punch to remove the slug from the punch.

Abstract: The present invention relates generally to a new apparatus and method for forming cavities without using an insert. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic) without using inserts.