Abstract: Embodiments herein relate to air-fried snack food products and related methods. In an embodiment, a method of preparing a reduced fat fried snack product is included. The method can include preparing discrete units of a snack product, par frying the snack product in an oil fryer, wherein par frying the snack product in the oil fryer reduces moisture in the snack product to approximately 2 to 8 weight percent, and frying the snack product in a centrifuge air fryer, wherein frying the snack product in the centrifuge air fryer reduces moisture in the snack product to 1.5 to 2.5 weight percent and reduces fat content of the snack product to 12 to 38 weight percent. Other embodiments are also included herein.

Abstract: Embodiments herein include processing systems for food products and related methods. In an embodiment, a food processing system is included with a continuous processing channel divided into a come-up chamber, a main electromagnetic wave (such as microwave) heating chamber, and a cool-down chamber. The continuous processing channel can define at least two separate portions oriented for vertical product movement. In various embodiments, the come-up chamber, the main electromagnetic wave heating chamber, and the cool-down chamber are at least partially filled with liquid. The system can further include a product conveyor mechanism to convey food products to be processed continuously along a conveyance path passing from the come-up chamber through the main electromagnetic wave heating chamber and to the cool-down chamber. The system can further include an electromagnetic wave energy emitting apparatus configured to emit electromagnetic wave energy into the main heating chamber.

Abstract: Embodiments herein relate to multilayer recyclable films for food packaging. In an embodiment, a multilayer packaging film is included with a first polymeric layer, a second polymeric layer, and a third polymeric layer. The first layer and the third layer can directly contact opposite sides of the second layer. The first layer and the third layer can be directly bonded to the second layer via a welding process. The first polymeric layer, the second polymeric layer, and the third polymeric layer can each contain the same thermoplastic polymer. The second polymeric layer can include an amount of a functional additive that is different than the first and third polymeric layers. Other embodiments are also included herein.

Abstract: Embodiments herein relate to systems and methods for thermally processing packaged food products with highly-uniform electromagnetic energy fields. In an embodiment, a method of thermally processing a packaged food product is included herein. The method can include placing the packaged food product in a heating chamber, the packaged food product comprising a hermetically sealed package and a food material disposed within the package. The method can further include applying electromagnetic energy to the packaged food product from a first electromagnetic energy source from a first direction. The electromagnetic energy can be sufficient to raise the temperature of the food material by at least 50 degrees Fahrenheit with a spatial temperature variation of less than 25 degrees Fahrenheit in less than 120 seconds. Other embodiments are also included herein.

Abstract: Embodiments herein include processing systems for food products and related methods. In an embodiment, the processing system includes a housing and a product conveyor. The housing defines a processing channel that includes an electromagnetic wave heating chamber. The electromagnetic wave heating chamber is at least partially filled with a fluid, such as a fluid. The conveyor mechanism can convey food products continuously along a conveyance path including a serpentine pathway that includes a plurality of hairpin corners where a direction of the conveyance path is reversed and a depth of the conveyance path is increased. The electromagnetic wave emitting apparatus emits electromagnetic energy into the pathway. The average pressure in the electromagnetic wave heating chamber changes along the conveyor mechanism. The orientation of products along the conveyance path varies minimally along at least portions of the conveyance path. Other embodiments are also included herein.

Abstract: Embodiments herein include processing systems for food products and related methods. In an embodiment, a food processing system is included with a continuous processing channel divided into a come-up chamber, a main electromagnetic wave (such as microwave) heating chamber, and a cool-down chamber. The continuous processing channel can define at least two separate portions oriented for vertical product movement. In various embodiments, the come-up chamber, the main electromagnetic wave heating chamber, and the cool-down chamber are at least partially filled with liquid. The system can further include a product conveyor mechanism to convey food products to be processed continuously along a conveyance path passing from the come-up chamber through the main electromagnetic wave heating chamber and to the cool-down chamber. The system can further include an electromagnetic wave energy emitting apparatus configured to emit electromagnetic wave energy into the main heating chamber.

Abstract: A system is provided for heating a comestible. The system includes a container and a flexible vented package containing a liquid, semi-solid or liquid/solid combination comestible. The package is positioned within the container in a manner that hinders the comestible from escaping through the package's vent(s). The container is penetrable to microwaves and is adapted to not experience heat-induced damage when subjected to a heating cycle in a combination microwave and convection oven. The container is adapted to protect the package from heat-induced damage when the container is subjected to a heating cycle in a combination microwave and convection oven.

Abstract: A system is provided for heating a comestible. The system includes a container and a flexible vented package containing a liquid, semi-solid or liquid/solid combination comestible. The package is positioned within the container in a manner that hinders the comestible from escaping through the package's vent(s). The container is penetrable to microwaves and is adapted to not experience heat-induced damage when subjected to a heating cycle in a combination microwave and convection oven. The container is adapted to protect the package from heat-induced damage when the container is subjected to a heating cycle in a combination microwave and convection oven.

Abstract: Systems and methods for monitoring various process parameters, primarily in connection with processes for the sterilization of particulate foods in a continuous thermal process, make use of application specific integrated circuits (ASIC) that provide process-related data for batch or continuous thermal treatment when the circuit is embedded in a particle subjected to such treatment. The preferred methods are described in connection with process design, and with at least near real-time process control using process data provided by such circuits.

Abstract: A system is provided for heating a comestible. The system includes a container and a flexible vented package containing a liquid, semi-solid or liquid/solid combination comestible. The package is positioned within the container in a manner that hinders the comestible from escaping through the package's vent(s). The container is penetrable to microwaves and is adapted to not experience heat-induced damage when subjected to a heating cycle in a combination microwave and convection oven. The container is adapted to protect the package from heat-induced damage when the container is subjected to a heating cycle in a combination microwave and convection oven.

Abstract: Systems and methods for monitoring various process parameters, primarily in connection with processes for the sterilization of particulate foods in a continuous thermal process, make use of application specific integrated circuits (ASIC) that provide process-related data for batch or continuous thermal treatment when the circuit is embedded in a particle subjected to such treatment. The preferred methods are described in connection with process design, and with at least near real-time process control using process data provided by such circuits.

Abstract: The present invention relates to novel compounds representated by formula (I), where R, R1, R2, R3, X, Y, m, n are as defined. The present invention relates to compounds of the general formula I their derivatives, their analogs, their tautomeric forms, their stereoisomers, their diastereomers, their bioisosteres, their polymorphs, their pharmaceutically acceptable salts and pharmaceutically acceptable compositions containing them which are predominantly dipeptidyl peptidase IV inhibitors. The present invention also relates to the processes for the preparation of novel compounds of formula (I) and their use in treating type II diabetes and diabetic complications thereof and also for treating dislipidemia, hypercholesterolemia, obesity and hyperglycemia.