Abstract: Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

Abstract: Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

Abstract: Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

Abstract: Described are systems and methods for optical characterization of inclusions, such as solids and liquids, in liquid samples. An inclusion characterization system may include a radiation source, a radiation detector, a sample optical cell, and a sample delivery mechanism. The radiation detector may be configured to perform time resolved measurements. The sample may be delivered to the sample optical cell by the sample delivery mechanism at a flow rate set for preserving the sample integrity (i.e., the transport rate). The inclusion characterization in the sample may be performed at flow rates set for sample analysis (i.e., the analysis rate). The analysis rate may differ from the transport rate. The rate difference may be achieved by diverting only a portion of the overall sample into the sample optical cell. Also provided are examples of disengagement of sample transport and analysis flow rates.

Abstract: Described are systems and methods for optical characterization of inclusions, such as solids and liquids, in liquid samples. An inclusion characterization system may include a radiation source, a radiation detector, a sample optical cell, and a sample delivery mechanism. The radiation detector may be configured to perform time resolved measurements. The sample may be delivered to the sample optical cell by the sample delivery mechanism at a flow rate set for preserving the sample integrity (i.e., the transport rate). The inclusion characterization in the sample may be performed at flow rates set for sample analysis (i.e., the analysis rate). The analysis rate may differ from the transport rate. The rate difference may be achieved by diverting only a portion of the overall sample into the sample optical cell. Also provided are examples of disengagement of sample transport and analysis flow rates.

Abstract: Described are systems and methods for optical characterization of inclusions, such as solids and liquids, in liquid samples. An inclusion characterization system may include a radiation source, a radiation detector, a sample optical cell, and a sample delivery mechanism. The radiation detector may be configured to perform time resolved measurements. The sample may be delivered to the sample optical cell by the sample delivery mechanism at a flow rate set for preserving the sample integrity (i.e., the transport rate). The inclusion characterization in the sample may be performed at flow rates set for sample analysis (i.e., the analysis rate). The analysis rate may differ from the transport rate. The rate difference may be achieved by diverting only a portion of the overall sample into the sample optical cell. Also provided are examples of disengagement of sample transport and analysis flow rates.

Abstract: Described are systems and methods for optical characterization of inclusions, such as solids and liquids, in liquid samples. An inclusion characterization system may include a radiation source, a radiation detector, a sample optical cell, and a sample delivery mechanism. The radiation detector may be configured to perform time resolved measurements. The sample may be delivered to the sample optical cell by the sample delivery mechanism at a flow rate set for preserving the sample integrity (i.e., the transport rate). The inclusion characterization in the sample may be performed at flow rates set for sample analysis (i.e., the analysis rate). The analysis rate may differ from the transport rate. The rate difference may be achieved by diverting only a portion of the overall sample into the sample optical cell. Also provided are examples of disengagement of sample transport and analysis flow rates.

Abstract: Described are systems and methods for optical characterization of inclusions, such as solids and liquids, in liquid samples. An inclusion characterization system may include a radiation source, a radiation detector, a sample optical cell, and a sample delivery mechanism. The radiation detector may be configured to perform time resolved measurements. The sample may be delivered to the sample optical cell by the sample delivery mechanism at a flow rate set for preserving the sample integrity (i.e., the transport rate). The inclusion characterization in the sample may be performed at flow rates set for sample analysis (i.e., the analysis rate). The analysis rate may differ from the transport rate. The rate difference may be achieved by diverting only a portion of the overall sample into the sample optical cell. Also provided are examples of disengagement of sample transport and analysis flow rates.

Abstract: A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias profile across a processing area, thereby controlling processing rates between two or more conductive portions of the substrate.

Abstract: A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias profile across a processing area, thereby controlling processing rates between two or more conductive portions of the substrate.

Abstract: A method and apparatus for retaining electrolyte on a rotating platen using directional air flow is provided. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a processing pad and disposed on a stationary base so that the platen assembly may rotate relative to the base; and an air knife coupled to the base and extended over a portion of the surface, the air knife operable to deliver a stream of air toward the pad to divert at least a portion of a fluid disposed on the pad toward a center of the pad.

Abstract: Systems and methods are disclosed for particle monitoring. An exemplary method includes confining a flowable sample which is opaque to at least a first range of wavelengths of light waves; measuring transparency of the flowable sample; compressing the flowable sample in a first direction while confining the sample in a second direction parallel to a flow direction of the flowable sample and orthogonal to the first direction, while elongating the sample in a third direction orthogonal to the first and second directions. When the sample is compressed in the first direction, the sample becomes transparent to at least one of the wavelengths in the first range of wavelengths, and the method can include identifying characteristics of particles contained in the sample which has been compressed.

Abstract: Systems and methods are disclosed for particle monitoring. An exemplary method includes confining a flowable sample which is opaque to at least a first range of wavelengths of light waves; measuring transparency of the flowable sample; compressing the flowable sample in a first direction while confining the sample in a second direction parallel to a flow direction of the flowable sample and orthogonal to the first direction, while elongating the sample in a third direction orthogonal to the first and second directions. When the sample is compressed in the first direction, the sample becomes transparent to at least one of the wavelengths in the first range of wavelengths, and the method can include identifying characteristics of particles contained in the sample which has been compressed.

Abstract: Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a cell for polishing a substrate includes a processing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper planarizing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk processing cell and a residual processing cell. The residual processing cell includes a biased conductive planarizing surface. In further embodiments, the conductive element is protected from attack by process chemistries.

Abstract: Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a contact assembly for electrochemically processing a substrate includes a housing having a ball disposed in a passage formed through the housing. The ball is adapted to extend partially from the housing to contact the substrate during processing. The housing includes a fluid inlet that is positioned to cause fluid, entering the housing through the inlet, to sweep the entire passage. In another embodiment, a method for electrochemically processing includes flowing a processing fluid through a passage retaining a conductive element. The flow sweeps the entire passage of the housing. A first electrical bias is applied to the conductive element in contact with the substrate relative an electrode electrically coupled to the substrate by the processing fluid.

Abstract: Systems and methods are disclosed for particle monitoring. An exemplary method includes confining a flowable sample which is opaque to at least a first range of wavelengths of light waves; measuring transparency of the flowable sample; compressing the flowable sample in a first direction while confining the sample in a second direction parallel to a flow direction of the flowable sample and orthogonal to the first direction, while elongating the sample in a third direction orthogonal to the first and second directions. When the sample is compressed in the first direction, the sample becomes transparent to at least one of the wavelengths in the first range of wavelengths, and the method can include identifying characteristics of particles contained in the sample which has been compressed.

Abstract: A retaining ring for electrochemical mechanical processing is described. The ring has a conductive portion having an upper surface and a lower surface and an insulating portion. The insulating portion has one or more openings extending therethrough, exposing the lower surface of the conductive portion. An upper surface of the insulating portion contacts the lower surface of the conductive portion. In an electrochemical mechanical polishing process, the retaining ring can be biased separately from a substrate being polished.

Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

Abstract: Systems and methods for electrochemically processing a substrate. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.

Abstract: Systems and methods for electrochemically processing. In one embodiment, a plurality of grooves are formed in a polishing surface of a polishing pad. The grooves are adapted to facilitate the flow of polishing fluid over the polishing pad. Conductive layers are respectively formed in the grooves, wherein the conductive layers are in electrical communication with each other.