Patents by Inventor Rashid K. ABU AL-RUB

Rashid K. ABU AL-RUB has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11874070
    Abstract: Heat transfer devices, components thereof, and related methods are provided. Embodiments include heat transfer devices and/or heat transfer components including a spinodal structure having a bi-continuous topology obtained by modeling a spinodal decomposition process, wherein the spinodal structure having the bi-continuous topology is a spinodal shell structure or a spinodal solid structure. Embodiments include methods of making heat transfer devices and/or heat transfer components using additive manufacturing. Other further embodiments are provided in the present disclosure.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: January 16, 2024
    Assignee: KHALIFA UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Rashid K. Abu Al-Rub, Oraib Al-Ketan
  • Patent number: 11828541
    Abstract: Heat transfer devices, components thereof, and related methods are provided. Embodiments include heat transfer devices and/or heat transfer components including a spinodal structure having a bi-continuous topology obtained by modeling a spinodal decomposition process, wherein the spinodal structure having the bi-continuous topology is a spinodal shell structure or a spinodal solid structure. Embodiments include methods of making heat transfer devices and/or heat transfer components using additive manufacturing. Other further embodiments are provided in the present disclosure.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: November 28, 2023
    Assignee: KHALIFA UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Rashid K. Abu Al-Rub, Oraib Al-Ketan
  • Publication number: 20230009377
    Abstract: Heat transfer devices, components thereof, and related methods are provided. Embodiments include heat transfer devices and/or heat transfer components including a spinodal structure having a bi-continuous topology obtained by modeling a spinodal decomposition process, wherein the spinodal structure having the bi-continuous topology is a spinodal shell structure or a spinodal solid structure. Embodiments include methods of making heat transfer devices and/or heat transfer components using additive manufacturing. Other further embodiments are provided in the present disclosure.
    Type: Application
    Filed: November 25, 2020
    Publication date: January 12, 2023
    Inventors: Rashid K. ABU AL-RUB, Oraib AL-KETAN