Abstract: Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.

Abstract: An apparatus and method are disclosed for the optical characterization of particles in highly concentrated systems (i.e. suspensions and dispersions, hereinafter referred to as the “sample”), such as solid-particle slurries and liquid-in-liquid (e.g. oil-in-water) emulsions, which do not require dilution of the samples. Reduction of the optical transparency of the sample, which is required to avoid the influence of multiple light scattering, is achieved by forming the sample into a sheet flow with controlled thickness. The sample transparency is measured by using a light extinction method and the sample thickness in the optical cell is controlled in order to keep the sample transparency within a range of predetermined values. By this means, an improved efficiency of single-particle detection is achieved and the usual reduction of signal quality due to multiple light scattering is avoided.

Abstract: An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coated with a conductive material, conductive fillers, or combinations thereof, and adapted to polish the substrate. In another aspect, a polishing article includes a body having a surface adapted to polish the substrate and at least one conductive element embedded in the polishing surface, the conductive element comprising dielectric or conductive fibers coated with a conductive material, conductive fillers, or combinations thereof. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. A plurality of perforations and a plurality of grooves may be formed in the articles to facilitate flow of material through and around the polishing article.

Abstract: A method and apparatus for plating metal onto a substrate including positioning an anode spacer including a anode surface and a substrate contact surface with the substrate contact surface immediate a deposition surface of a substrate. The apparatus generally includes a plating cell configured to contain a plating solution therein, an anode disposed in the plating solution, and an anode spacer positioned in the plating cell, the anode spacer having an anode surface, and a substrate contact surface positioned immediate a deposition surface of the substrate, the anode spacer configured to communicated the plating solution therethrough. The method generally includes positioning a substrate in a plating cell, positioning an anode spacer immediate a deposition surface of the substrate, and flowing a plating solution through the anode spacer to plate a metal onto the deposition surface.

Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

Abstract: An apparatus for detecting the presence of powdered materials in envelopes comprises a container with an envelope-positioning unit, envelope corner or edge cutter, a powder excitation and extracting means for shaking the contents of the envelope, and a powder detector with a particle intake device, and air circulation system for circulation of the particle-containing air through the powder detector. The detector can be placed inside or outside of the sealed container and is connected to the cutting zone via the particle suction device. In operation, the envelope is placed into the envelope-positioning unit. Either a corner or an edge of the envelope is cut off or perforated so as to allow a part of the powdered material to leave the envelope while maintaining the other contents, except for small particulates, intact and inside the envelope. The envelope is then subjected to vibration or impacts under the effect of the excitation means.

Abstract: Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric constant material disposed thereon including polishing a substrate at a polishing pressures of about 2 psi or less and at platen rotational speeds of about 200 cps or greater. The polishing process may use an abrasive-containing polishing composition having up to about 1 wt. % of abrasives. The polishing process may be integrated into a multi-step polishing process.

Abstract: The invention generally provides methods and compositions for planarizing a substrate surface having underlying dielectric materials. Aspects of the invention provide compositions and methods using a combination of low polishing pressures, polishing compositions, various polishing speeds, selective polishing pads, and selective polishing temperatures, for removing barrier materials by a chemical mechanical polishing technique with minimal residues and minimal seam damage. Aspects of the invention are achieved by employing a strategic multi-step process including sequential CMP at low polishing pressure to remove the deposited barrier materials.

Abstract: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

Abstract: A method and apparatus for quickly detecting the surface characteristics of a surface, such as features, anomalies or contaminants are disclosed. The method and apparatus use heterogeneous condensation of a vapor on a surface and evaporation to reveal the surface characteristics of the surface and thereby enable the detection of such features.

Abstract: A modified mixing-type condensation nuclei counter for measuring the size and number of small particles is presented. A gas stream is saturated with respect to a working fluid. The saturated gas at a first temperature is mixed in a growth chamber with a sample gas at a second temperature that is lower than the first temperature. The mixture of the saturated gas and the sample gas at different temperatures results in supersaturation of the mixed gas with respect to the working fluid. Particles in the sample gas act as nucleation sites for condensation of the working fluid. The particles are thus grown to a larger size and therefore are more easily measured by known light-scattering particle detection methods. The efficiency of the supersaturation process is made even more efficient by cooling the growth chamber to a third temperature which is lower than the second temperature or by turbulently mixing the saturated gas and the sample gas.