Abstract: Examples of printed circuit boards (PCBs) with board configuration blocks and board edge projections are described. In one example, a PCB includes a core material and a metal layer comprising a plurality of metal traces on the core material. The plurality of metal traces can include component interconnect traces and a board configuration block. The board configuration block can include a plan diagram for the PCB, an operational diagram for the PCB, or a combination of plan and operational diagrams. In other examples, a PCB can include a core material having a peripheral edge. The peripheral edge can include one or more board edge scheme projections positioned within projection edge regions of the peripheral edge. The scheme projections have a projection shape based on operational characteristics for the PCB. In some cases, the board configuration blocks can be located on the board edge scheme projections.

Abstract: An acoustic wave resonator has a first conductive layer, piezoelectrical material formed over the first conductive layer, and second conductive layer formed over the piezoelectric material. An alignment of the first conductive layer, piezoelectric material and second conductive area defines an active region of the resonator and the active region includes a core area and a plurality of fractals extending from or recessed into the core area. The fractals maximize a perimeter-to-area ratio of the active region of the resonator. The fractals increase electromechanical coupling and a quality factor of the resonator. The fractals can have a star shape, rounded shape, asymmetric shape, or other shape that optimizes the perimeter-to-area ratio of the active region to maximize performance of the resonator. A frame can be disposed over or within the piezoelectric material. The frame is raised above the second conductive layer or recessed below the second conductive layer.

Abstract: Aspects of acoustic resonators and methods of manufacture of acoustic resonators are described, including acoustic resonators with thinner layers of piezoelectric material. In one example, a method of manufacturing an acoustic resonator includes providing a substrate, depositing a layer of piezoelectric material over the substrate by atomic layer deposition (ALD), and forming an electrode in contact with the layer of piezoelectric material. ALD is used to deposit highly uniform and conformal thin films of piezoelectric material and, in some cases, electrodes and encapsulation layers. The acoustic resonators described herein are better suited for the demands of new radio frequency (RF) filters, duplexers, transformers, and other components in front-end radio electronics and other applications.

Abstract: Techniques regarding forming flip chip interconnects are provided. For example, one or more embodiments described herein can comprise a three-dimensionally printed flip chip interconnect that includes an electrically conductive ink material that is compatible with a three-dimensional printing technology. The three-dimensionally printed flip chip interconnect can be located on a metal surface of a semiconductor chip.