Abstract: A thermal management circuit board comprises a heat sink, at least one insulating layer and at least one electronic circuit. The heat sink comprises a heat conducting material having tooling holes disposed therethrough and raised portions disposed on at least one surface thereof. The raised portions of the heat sink provide mounting surfaces for heat producing electronic components on a plane above a chemically etched surface of the heat sink. The electronic circuit comprises a prepreg and a circuit material wherein the circuit material is laminated to the prepreg, has a photoresist laid thereupon with at least one circuit image printed thereupon. The photoresist is then developed and the circuit material is chemically etched to define a circuit trace of the electronic circuit. The insulating layer comprises a thermally and electrically resistant material and has apertures disposed therethrough corresponding in size and shape to the raised portions of the heat sink.

Abstract: A method of making a thermal management material for a circuit board panel comprising the steps of cutting a thermally conductive, rigid substrate from a larger sheet of heat conducting material, degreasing the thermally conductive substrate, mechanically abrading at least one surface of the thermally conductive substrate, acid cleaning the at least one abraded surface of the thermally conductive substrate, rinsing the thermally conductive substrate, passivating the at least one abraded surface of the thermally conductive substrate to render the at least one surface chemically inert, rinsing the thermally conductive substrate, drying the thermally conductive substrate and baking the thermally conductive substrate at an elevated temperature.