Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed for socket interconnect structures and related methods. An example socket interconnect apparatus includes a housing defining a plurality of first openings and a plurality of second openings and a ground structure coupled to the housing. The ground structure defines a plurality of third openings. The third openings of the ground structure align with the second openings of the housing when the ground structure is coupled to the housing. A plurality of ground pins are located in respective ones of the second openings and third openings. The ground structure is to electrically couple the ground pins. A plurality of signal pins are located in respective ones of the first openings of the housing. The signal pins are electrically isolated from the ground structure.

Abstract: An electrical circuit board assembly (ECBA) preferably having at least one LED component and having a substrate that includes a plurality of raised pads formed such that open channels are formed therebetween, and such that the upper surfaces of the pads are preferably substantially coplanar. Such intra-pad channels facilitate heat transfer and cooling of the substrate and the ECBA. Further, such raised pads provide for alternate methods of electrically conductive track manufacturing so as to avoid the necessity of chemical etching which requires the use of hazardous toxic chemicals. Such alternate methods of electrically conductive track construction include adhesive conductive sheet application, conductive ink screen printing, and conductive ink painting.

Abstract: A thermally conductive efficient substrate for use in an electrical circuit board assembly (ECBA) preferably having at least one LED component. The substrate is constructed of a thermally conductive efficient material such that the substrate functions both as a substrate and as a heat sink for the PCB. The substrate allows a PCB to function without a dedicated auxiliary heat sink. The substrate preferably includes a plurality of raised pads formed such that open channels are formed therebetween, and such that the upper surfaces of the pads are preferably substantially coplanar. Such intra-pad channels facilitate heat transfer and cooling of the substrate and the ECBA.

Abstract: An electrical circuit board assembly (ECBA) preferably having at least one LED component and having a substrate that includes a plurality of raised pads formed such that open channels are formed therebetween, and such that the upper surfaces of the pads are preferably substantially coplanar. Such intra-pad channels facilitate heat transfer and cooling of the substrate and the ECBA. Further, such raised pads provide for alternate methods of electrically conductive track manufacturing so as to avoid the necessity of chemical etching which requires the use of hazardous toxic chemicals. Such alternate methods of electrically conductive track construction include adhesive conductive sheet application, conductive ink screen printing, and conductive ink painting.