Abstract: Method for connecting the conductive surfaces of circuit boards, especially a circuit board equipped with at least two conductive surfaces separated by an insulator layer and with holes, or for creating conductors on a board in a manner that conducts electricity. In the method, a metal or metal alloy, in a powder form, is fed into and the powder is sintered using a laser in order to create a unified conductive structure.

Abstract: A method for dismantling electronic devices equipped with cathode-ray tubes and for recycling the materials, including stages, in which the casing is removed from the device, the detachable auxiliary device components are stripped from the tube, and the materials are cleaned and sorted. According to the invention, a point laser is used to form a groove at the splitting point, which is situated towards the front part, at a distance from the joint between the front part and the conical part, and a temperature difference is created on the different sides of the said groove to ensure the splitting of the parts, and the components thus detached are used for further purpose. If desired, the laser source is also used to remove impurities, such a glue, labels, and similar, from the outer surface of the tube.