Abstract: The present invention provides a method and apparatus for providing variable signal delays through stacked resistor pads. Stacked resistor pads include resistor pads mounted on both sides of a module where at least certain resistor pads on one side of the module are electrically connected to certain other resistor pads on the other side of the module through shared vias. Stacked resistor pads reduce the number of connections and vias required by conventional resistor pad combinations. Reducing connections and vias reduces the capacitance added to the delayed signal, which reduces potential signal degradation, especially at high-speeds. In addition, connections and vias lower the potential for manufacturing defects and errors due to missing or broken parts. Moreover, stacked resistor pads consumes significantly less module surface space than currently available resistor pad combinations.