Patents by Inventor Ravi Anekal Radhakrishnan

Ravi Anekal Radhakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Standoff for circuit board having temperature-variable electrical element
    Patent number: 11324110
    Abstract: A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: May 3, 2022
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: NSV Sarveswara Sarma A, Saravanakumar Mahalingam, Rama Kumar Mayil, Ravi Anekal Radhakrishnan
  • STANDOFF FOR CIRCUIT BOARD HAVING TEMPERATURE-VARIABLE ELECTRICAL ELEMENT
    Publication number: 20210282259
    Abstract: A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.
    Type: Application
    Filed: April 28, 2020
    Publication date: September 9, 2021
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: NSV Sarveswara Sarma A, Saravanakumar Mahalingam, Rama Kumar Mayil, Ravi Anekal Radhakrishnan
  • Support structure for electronics having fluid passageway for convective heat transfer
    Patent number: 10178800
    Abstract: A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: January 8, 2019
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Saravana Mahalingam, Abhay Naik, Yathiraj Kasal, Rakesh Hota, Rajendra Prasad Vrukshavai, Mathews Leslie Kuriakose, Ravi Anekal Radhakrishnan
  • SUPPORT STRUCTURE FOR ELECTRONICS HAVING FLUID PASSAGEWAY FOR CONVECTIVE HEAT TRANSFER
    Publication number: 20180288900
    Abstract: A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.
    Type: Application
    Filed: March 30, 2017
    Publication date: October 4, 2018
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Saravana Mahalingam, Abhay Naik, Yathiraj Kasal, Rakesh Hota, Rajendra Prasad Vrukshavai, Mathews Leslie Kuriakose, Ravi Anekal Radhakrishnan