Patents by Inventor Ravi Bhatkal

Ravi Bhatkal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stretchable Interconnects for Flexible Electronic Surfaces
    Publication number: 20240029916
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Application
    Filed: October 5, 2023
    Publication date: January 25, 2024
    Inventors: Narahari PUJARI, Bawa SINGH, Ravi BHATKAL, Siuli SARKAR, Anubhav RUSTOGI
  • Stretchable interconnects for flexible electronic surfaces
    Patent number: 11830640
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: November 28, 2023
    Assignee: Alpha Assembly Solutions, Inc.
    Inventors: Narahari Pujari, Bawa Singh, Ravi Bhatkal, Siuli Sarkar, Anubhav Rustogi
  • LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
    Publication number: 20230330788
    Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.
    Type: Application
    Filed: June 5, 2023
    Publication date: October 19, 2023
    Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh
  • SINTERING POWDER
    Publication number: 20220169905
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Application
    Filed: October 4, 2021
    Publication date: June 2, 2022
    Applicant: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • Stretchable Interconnects for Flexible Electronic Surfaces
    Publication number: 20210350949
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Application
    Filed: July 22, 2021
    Publication date: November 11, 2021
    Inventors: Narahari PUJARI, Bawa SINGH, Ravi BHATKAL, Siuli SARKAR, Anubhav RUSTOGI
  • Sintering paste
    Patent number: 11162007
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: November 2, 2021
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • Stretchable interconnects for flexible electronic surfaces
    Patent number: 11139089
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: October 5, 2021
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Narahari Pujari, Bawa Singh, Ravi Bhatkal, Siuli Sarkar, Anubhav Rustogi
  • Lead-free and antimony-free tin solder reliable at high temperatures
    Patent number: 11090768
    Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: August 17, 2021
    Assignee: ALPHA ASSEMBLY SOLUTIONS INC.
    Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh
  • Stretchable Interconnects for Flexible Electronic Surfaces
    Publication number: 20200294686
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Application
    Filed: May 29, 2020
    Publication date: September 17, 2020
    Inventors: Narahari PUJARI, Bawa SINGH, Ravi BHATKAL, Siuli SARKAR, Anubhav RUSTOGI
  • Stretchable interconnects for flexible electronic surfaces
    Patent number: 10672531
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: June 2, 2020
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Narahari Pujari, Bawa Singh, Ravi Bhatkal, Siuli Sarkar, Anubhav Rustogi
  • Sintering Powder
    Publication number: 20190194517
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Application
    Filed: March 1, 2019
    Publication date: June 27, 2019
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana de Avila Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • Sintering powder
    Patent number: 10259980
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: April 16, 2019
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • Stretchable Interconnects for Flexible Electronic Surfaces
    Publication number: 20170200527
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Application
    Filed: July 14, 2015
    Publication date: July 13, 2017
    Inventors: Narahari PUJARI, Bawa SINGH, Ravi BHATKAL, Siuli SARKAR, Anubhav RUSTOGI
  • LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
    Publication number: 20160023309
    Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt. % of silver, 2.5 to 4 wt. % of bismuth, 0.3 to 0.8 wt. % of copper, 0.03 to 1 wt. % nickel, 0.005 to 1 wt. % germanium, and a balance of tin, together with any unavoidable impurities.
    Type: Application
    Filed: October 8, 2015
    Publication date: January 28, 2016
    Applicant: ALPHA METALS, INC.
    Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh
  • SINTERING POWDER
    Publication number: 20150353804
    Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
    Type: Application
    Filed: October 29, 2013
    Publication date: December 10, 2015
    Applicant: ALPHA METALS, INC.
    Inventors: Shamik Ghosal, Ranjit Pandher, Oscar Khaselev, Ravi Bhatkal, Rahul Raut, Bawa Singh, Morgana Ribas, Siuli Sarkar, Sutapa Mukherjee, Sathish Kumar, Remya Chandran, Pavan Vishwanath, Ashok Pachamuthu, Monnir Boureghda, Nitin Desai, Anna Lifton, Nirmalya Kumar Chaki
  • LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
    Publication number: 20150266137
    Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt. % of silver, 2.5 to 4 wt. % of bismuth, 0.3 to 0.8 wt. % of copper, 0.03 to 1 wt. % nickel, 0.005 to 1 wt. % germanium, and a balance of tin, together with any unavoidable impurities.
    Type: Application
    Filed: October 9, 2013
    Publication date: September 24, 2015
    Applicant: ALPHA METALS, INC.
    Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh
  • LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
    Publication number: 20150224604
    Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.
    Type: Application
    Filed: April 28, 2015
    Publication date: August 13, 2015
    Applicant: ALPHA METALS, INC.
    Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh