Patents by Inventor Ravi Chandar

Ravi Chandar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200074143
    Abstract: Unmanned aerial device for smoke and fire detection and method to monitor occupants are provided. The unmanned aerial device which is operatively coupled with at least one electromagnetic device includes a plurality of sensors configured to sense at least one of smoke and fire and to sense a temperature of at least one of one or more users and one or more objects within the pre-defined area. The unmanned aerial device also includes an image capturing device configured to capture one or more images and to capture one or more attributes associated with the corresponding at least one of the one or more users and the one or more objects, a thermal image capturing device configured to detect occupancy of the smoke and fire by an infrared sensor within the pre-defined area and to generate one or more thermal images.
    Type: Application
    Filed: March 7, 2019
    Publication date: March 5, 2020
    Inventors: Vipin Vangara, Ravi Chandar Vangara
  • Patent number: 7149723
    Abstract: A method of public access computing comprises providing a computer system for accessing computer software applications, and selectively permitting access to the computer system with an electronic payment mechanism. A selective access computer system comprises a computing workstation having at least one software application and a selective access mechanism connected to the workstation. The selective access mechanism is configured for obtaining electronic payment authorization for a user's financial instrument and for permitting selective access to the computer workstation upon payment authorization for the user.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: December 12, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ravi Chandar, Makarand Madhukar Jogalekar
  • Patent number: 6911909
    Abstract: An object locating system for automatically locating a hidden or lost wireless object. This is applicable to objects such as remote controls for TVs and VCRs and the like. An ambient light photosensor is located on the object. The object locating system also includes an alarm located on the wireless object, which is electrically connected to the ambient light photosensor. The ambient light photosensor senses ambient lighting conditions. The alarm is actuated when the ambient light photosensor detects ambient light below a predetermined level.
    Type: Grant
    Filed: May 21, 2003
    Date of Patent: June 28, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Ravi Chandar
  • Publication number: 20030197610
    Abstract: An object locating system for automatically locating a hidden or lost wireless object. This is applicable to objects such as remote controls for TVs and VCRs and the like. An ambient light photosensor is located on the object. The object locating system also includes an alarm located on the wireless object, which is electrically connected to the ambient light photosensor. The ambient light photosensor senses ambient lighting conditions. The alarm is actuated when the ambient light photosensor detects ambient light below a predetermined level.
    Type: Application
    Filed: May 21, 2003
    Publication date: October 23, 2003
    Inventor: Ravi Chandar
  • Patent number: 6590497
    Abstract: An object locating system for automatically locating a hidden or lost wireless object. This is applicable to objects such as remote controls for TVs and VCRs and the like. An ambient light photosensor is located on the object. The object locating system also includes an alarm located on the wireless object, which is electrically connected to the ambient light photosensor. The ambient light photosensor senses ambient lighting conditions. The alarm is actuated when the ambient light photosensor detects ambient light below a predetermined level.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: July 8, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Ravi Chandar
  • Patent number: 6581446
    Abstract: A method for determining the adhesion strength of any HVOF-coating/substrate system. This method applies a spherical indentor to the coated part in a loading-unloading cycle. During the loading phase, the substrate deforms plastically. During the unloading phase, the elastic-plastic mismatch between coating and substrate material properties gives rise to a tensile stress normal to the interface. This leads to delamination for a sufficient indentation load. A hybrid numerical-experimental approach calculates the interfacial adhesion. The threshold load for delamination is found experimentally. A finite element model calculates the corresponding adhesion stress for delamination. This method enables the quantitative evaluation of the adhesion for any coating/substrate interface, regardless of bond strength.
    Type: Grant
    Filed: October 11, 2001
    Date of Patent: June 24, 2003
    Assignee: The University of Houston
    Inventors: Loic Deneuville, Kenneth W. White, Krishnaswamy Ravi-Chandar
  • Publication number: 20030001738
    Abstract: An object locating system for automatically locating a hidden or lost wireless object. This is applicable to objects such as remote controls for TVs and VCRs and the like. An ambient light photosensor is located on the object. The object locating system also includes an alarm located on the wireless object, which is electrically connected to the ambient light photosensor. The ambient light photosensor senses ambient lighting conditions. The alarm is actuated when the ambient light photosensor detects ambient light below a predetermined level.
    Type: Application
    Filed: June 29, 2001
    Publication date: January 2, 2003
    Inventor: Ravi Chandar
  • Publication number: 20030004738
    Abstract: Systems for screening an applicant are provided. A representative system includes an applicant evaluation system that is configured to provide an applicant with at least one test question via a Web-site. Such a test question is associated with the job about which the applicant is inquiring. The applicant evaluation system also is configured to enable the applicant to apply for the job if the applicant correctly answers the test question(s). This can be accomplished via the Web-site. Other systems and methods also are provided.
    Type: Application
    Filed: June 28, 2001
    Publication date: January 2, 2003
    Inventor: Ravi Chandar
  • Publication number: 20030004886
    Abstract: A method of public access computing comprises providing a computer system for accessing computer software applications, and selectively permitting access to the computer system with an electronic payment mechanism. A selective access computer system comprises a computing workstation having at least one software application and a selective access mechanism connected to the workstation. The selective access mechanism is configured for obtaining electronic payment authorization for a user's financial instrument and for permitting selective access to the computer workstation upon payment authorization for the user.
    Type: Application
    Filed: June 29, 2001
    Publication date: January 2, 2003
    Inventors: Ravi Chandar, Makarand Madhukar Jogalekar
  • Publication number: 20010011066
    Abstract: The fabrication of superconducting wires and rods having desired and consistent electrical and mechanical properties, in particular those based on Yttrium Barium Copper Oxide (YBCO) and Bismuth Strontium Calcium Copper Oxide (BSCCO), is disclosed. The first fabrication step is to form an extrudable paste by mixing YBCO or BSCCO superconducting powder with a set of organic additives, which include binder, plasticizers lubricant, dispersant, and a solvent. The following additional steps are performed on both YBCO and BSCCO based wires or rods: (i) using a piston extruder to extrude the superconducting wire or rod; (ii) drying the wire or rod to remove the solvent; and (iii) subjecting the wire or rod to a binder burn-out treatment to remove the remaining organic additives. In addition, YBCO wires and rods also require a sintering step, while BSCCO wires and rods also require cold isostatic pressing and heat treatment steps.
    Type: Application
    Filed: January 19, 2001
    Publication date: August 2, 2001
    Applicant: UNIVERSITY OF HOUSTON
    Inventors: Krishnaswamy Ravi-Chandar, Devamanohar Ponnusamy, Kamel Salama
  • Patent number: 6191074
    Abstract: The fabrication of superconducting wires and rods having desired and consistent electrical and mechanical properties, in particular those based on Yttrium Barium Copper Oxide (YBCO) and Bismuth Strontium Calcium Copper Oxide (BSCCO), is disclosed. The first fabrication step is to form an extrudable paste by mixing YBCO or BSCCO superconducting powder with a set of organic additives, which include binder, plasticizer, lubricant, dispersant, and a solvent. The following additional steps are performed on both YBCO and BSCCO based wires or rods: (i) using a piston extruder to extrude the superconducting wire or rod; (ii) drying the wire or rod to remove the solvent; and (iii) subjecting the wire or rod to a binder burn-out treatment to remove the remaining organic additives. In addition, YBCO wires and rods also require a sintering step, while BSCCO wires and rods also require cold isostatic pressing and heat treatment steps.
    Type: Grant
    Filed: April 2, 1997
    Date of Patent: February 20, 2001
    Assignee: University of Houston
    Inventors: Krishnaswamy Ravi-Chandar, Devamanohar Ponnusamy, Kamel Salama
  • Patent number: 5656574
    Abstract: The fabrication of superconducting wires and rods having desired and consistent electrical and mechanical properties, in particular those based on Yttrium Barium Copper Oxide (YBCO) and Bismuth Strontium Calcium Copper Oxide (BSCCO), is disclosed. The first fabrication step is to form an extrudable paste by mixing YBCO or BSCCO superconducting powder with a set of organic additives, which include binder, plasticizer, lubricant, dispersant, and a solvent. The following additional steps are performed on both YBCO and BSCCO based wires or rods: (i) using a piston extruder to extrude the superconducting wire or rod; (ii) drying the wire or rod to remove the solvent; and (iii) subjecting the wire or rod to a binder burn-out treatment to remove the remaining organic additives. In addition, YBCO wires and rods also require a sintering step, while BSCCO wires and rods also require cold isostatic pressing and heat treatment steps.
    Type: Grant
    Filed: January 13, 1995
    Date of Patent: August 12, 1997
    Assignee: University of Houston
    Inventors: Krishnaswamy Ravi-Chandar, Devamanohar Ponnusamy, Kamel Salama