Patents by Inventor Ravi Chandar
Ravi Chandar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200074143Abstract: Unmanned aerial device for smoke and fire detection and method to monitor occupants are provided. The unmanned aerial device which is operatively coupled with at least one electromagnetic device includes a plurality of sensors configured to sense at least one of smoke and fire and to sense a temperature of at least one of one or more users and one or more objects within the pre-defined area. The unmanned aerial device also includes an image capturing device configured to capture one or more images and to capture one or more attributes associated with the corresponding at least one of the one or more users and the one or more objects, a thermal image capturing device configured to detect occupancy of the smoke and fire by an infrared sensor within the pre-defined area and to generate one or more thermal images.Type: ApplicationFiled: March 7, 2019Publication date: March 5, 2020Inventors: Vipin Vangara, Ravi Chandar Vangara
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Patent number: 7149723Abstract: A method of public access computing comprises providing a computer system for accessing computer software applications, and selectively permitting access to the computer system with an electronic payment mechanism. A selective access computer system comprises a computing workstation having at least one software application and a selective access mechanism connected to the workstation. The selective access mechanism is configured for obtaining electronic payment authorization for a user's financial instrument and for permitting selective access to the computer workstation upon payment authorization for the user.Type: GrantFiled: June 29, 2001Date of Patent: December 12, 2006Assignee: Hewlett-Packard Development Company, L.P.Inventors: Ravi Chandar, Makarand Madhukar Jogalekar
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Patent number: 6911909Abstract: An object locating system for automatically locating a hidden or lost wireless object. This is applicable to objects such as remote controls for TVs and VCRs and the like. An ambient light photosensor is located on the object. The object locating system also includes an alarm located on the wireless object, which is electrically connected to the ambient light photosensor. The ambient light photosensor senses ambient lighting conditions. The alarm is actuated when the ambient light photosensor detects ambient light below a predetermined level.Type: GrantFiled: May 21, 2003Date of Patent: June 28, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventor: Ravi Chandar
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Publication number: 20030197610Abstract: An object locating system for automatically locating a hidden or lost wireless object. This is applicable to objects such as remote controls for TVs and VCRs and the like. An ambient light photosensor is located on the object. The object locating system also includes an alarm located on the wireless object, which is electrically connected to the ambient light photosensor. The ambient light photosensor senses ambient lighting conditions. The alarm is actuated when the ambient light photosensor detects ambient light below a predetermined level.Type: ApplicationFiled: May 21, 2003Publication date: October 23, 2003Inventor: Ravi Chandar
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Patent number: 6590497Abstract: An object locating system for automatically locating a hidden or lost wireless object. This is applicable to objects such as remote controls for TVs and VCRs and the like. An ambient light photosensor is located on the object. The object locating system also includes an alarm located on the wireless object, which is electrically connected to the ambient light photosensor. The ambient light photosensor senses ambient lighting conditions. The alarm is actuated when the ambient light photosensor detects ambient light below a predetermined level.Type: GrantFiled: June 29, 2001Date of Patent: July 8, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventor: Ravi Chandar
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Patent number: 6581446Abstract: A method for determining the adhesion strength of any HVOF-coating/substrate system. This method applies a spherical indentor to the coated part in a loading-unloading cycle. During the loading phase, the substrate deforms plastically. During the unloading phase, the elastic-plastic mismatch between coating and substrate material properties gives rise to a tensile stress normal to the interface. This leads to delamination for a sufficient indentation load. A hybrid numerical-experimental approach calculates the interfacial adhesion. The threshold load for delamination is found experimentally. A finite element model calculates the corresponding adhesion stress for delamination. This method enables the quantitative evaluation of the adhesion for any coating/substrate interface, regardless of bond strength.Type: GrantFiled: October 11, 2001Date of Patent: June 24, 2003Assignee: The University of HoustonInventors: Loic Deneuville, Kenneth W. White, Krishnaswamy Ravi-Chandar
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Publication number: 20030001738Abstract: An object locating system for automatically locating a hidden or lost wireless object. This is applicable to objects such as remote controls for TVs and VCRs and the like. An ambient light photosensor is located on the object. The object locating system also includes an alarm located on the wireless object, which is electrically connected to the ambient light photosensor. The ambient light photosensor senses ambient lighting conditions. The alarm is actuated when the ambient light photosensor detects ambient light below a predetermined level.Type: ApplicationFiled: June 29, 2001Publication date: January 2, 2003Inventor: Ravi Chandar
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Publication number: 20030004738Abstract: Systems for screening an applicant are provided. A representative system includes an applicant evaluation system that is configured to provide an applicant with at least one test question via a Web-site. Such a test question is associated with the job about which the applicant is inquiring. The applicant evaluation system also is configured to enable the applicant to apply for the job if the applicant correctly answers the test question(s). This can be accomplished via the Web-site. Other systems and methods also are provided.Type: ApplicationFiled: June 28, 2001Publication date: January 2, 2003Inventor: Ravi Chandar
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Publication number: 20030004886Abstract: A method of public access computing comprises providing a computer system for accessing computer software applications, and selectively permitting access to the computer system with an electronic payment mechanism. A selective access computer system comprises a computing workstation having at least one software application and a selective access mechanism connected to the workstation. The selective access mechanism is configured for obtaining electronic payment authorization for a user's financial instrument and for permitting selective access to the computer workstation upon payment authorization for the user.Type: ApplicationFiled: June 29, 2001Publication date: January 2, 2003Inventors: Ravi Chandar, Makarand Madhukar Jogalekar
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Publication number: 20010011066Abstract: The fabrication of superconducting wires and rods having desired and consistent electrical and mechanical properties, in particular those based on Yttrium Barium Copper Oxide (YBCO) and Bismuth Strontium Calcium Copper Oxide (BSCCO), is disclosed. The first fabrication step is to form an extrudable paste by mixing YBCO or BSCCO superconducting powder with a set of organic additives, which include binder, plasticizers lubricant, dispersant, and a solvent. The following additional steps are performed on both YBCO and BSCCO based wires or rods: (i) using a piston extruder to extrude the superconducting wire or rod; (ii) drying the wire or rod to remove the solvent; and (iii) subjecting the wire or rod to a binder burn-out treatment to remove the remaining organic additives. In addition, YBCO wires and rods also require a sintering step, while BSCCO wires and rods also require cold isostatic pressing and heat treatment steps.Type: ApplicationFiled: January 19, 2001Publication date: August 2, 2001Applicant: UNIVERSITY OF HOUSTONInventors: Krishnaswamy Ravi-Chandar, Devamanohar Ponnusamy, Kamel Salama
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Patent number: 6191074Abstract: The fabrication of superconducting wires and rods having desired and consistent electrical and mechanical properties, in particular those based on Yttrium Barium Copper Oxide (YBCO) and Bismuth Strontium Calcium Copper Oxide (BSCCO), is disclosed. The first fabrication step is to form an extrudable paste by mixing YBCO or BSCCO superconducting powder with a set of organic additives, which include binder, plasticizer, lubricant, dispersant, and a solvent. The following additional steps are performed on both YBCO and BSCCO based wires or rods: (i) using a piston extruder to extrude the superconducting wire or rod; (ii) drying the wire or rod to remove the solvent; and (iii) subjecting the wire or rod to a binder burn-out treatment to remove the remaining organic additives. In addition, YBCO wires and rods also require a sintering step, while BSCCO wires and rods also require cold isostatic pressing and heat treatment steps.Type: GrantFiled: April 2, 1997Date of Patent: February 20, 2001Assignee: University of HoustonInventors: Krishnaswamy Ravi-Chandar, Devamanohar Ponnusamy, Kamel Salama
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Patent number: 5656574Abstract: The fabrication of superconducting wires and rods having desired and consistent electrical and mechanical properties, in particular those based on Yttrium Barium Copper Oxide (YBCO) and Bismuth Strontium Calcium Copper Oxide (BSCCO), is disclosed. The first fabrication step is to form an extrudable paste by mixing YBCO or BSCCO superconducting powder with a set of organic additives, which include binder, plasticizer, lubricant, dispersant, and a solvent. The following additional steps are performed on both YBCO and BSCCO based wires or rods: (i) using a piston extruder to extrude the superconducting wire or rod; (ii) drying the wire or rod to remove the solvent; and (iii) subjecting the wire or rod to a binder burn-out treatment to remove the remaining organic additives. In addition, YBCO wires and rods also require a sintering step, while BSCCO wires and rods also require cold isostatic pressing and heat treatment steps.Type: GrantFiled: January 13, 1995Date of Patent: August 12, 1997Assignee: University of HoustonInventors: Krishnaswamy Ravi-Chandar, Devamanohar Ponnusamy, Kamel Salama