Abstract: An illumination module can comprise a circuit board, a semiconductor-based light source mounted to the circuit board, an encasing mounted to the circuit board, and one or more optical surfaces at least partially contained within the encasing. The semiconductor-based light source can emit light in a first illumination pattern. The one or more optical surfaces can be collectively configured to receive the light from the edge-emitting semiconductor-based light source. The one or more optical surfaces can further be collectively configured to condition and redirect the light, and to output the conditioned and redirected light from the illumination module in a second illumination pattern different from the first illumination pattern.

Abstract: A device for three-dimensional imaging includes a structured light illuminator and an imaging sensor. The structured light illuminator has one or more movable illuminator lenses positioned proximate an output of the illuminator that are configured to vary a field of illumination of the illuminator. The imaging sensor has one or more movable imaging lenses positioned proximate an input of the imaging sensor that are configured to vary a field of view of the imaging sensor.

Abstract: A time-of-flight 3D imaging system includes a time-of-flight measurement device, an illuminator, and an imaging sensor. The illuminator and the imaging sensor have adjustable optics to vary the field of illumination of the illuminator and the field of view of the imaging sensor.

Abstract: A system and method are disclosed for reducing light from one or more light sources from entering into an optical sensor by reflection off of a visor and/or waveguiding within the visor. In embodiments, a shroud may be provided around the light source to block light from reflecting off of the visor and entering the optical sensor. A pattern of one or more grooves may also be formed in the visor to block light from waveguiding into the visor and entering the optical sensor.

Abstract: This document describes techniques and apparatuses that implement an ultra-compact image sensor assembly. In some embodiments, a printed circuit board assembly comprises a multilayer printed circuit board (PCB) having an asymmetric core structure. A cavity extends from an exterior layer of the multilayer PCB to an exposed portion of an interior layer of the multilayer PCB. The interior layer can be formed on the asymmetric core structure or another PCB layer above the asymmetric core structure. An image sensor is mounted at least partially in the cavity and electrically connected to conductive pads embodied on the exposed portion of the interior layer of the multilayer PCB. By mounting the image sensor in the cavity, height and planar dimensions of the image sensor assembly can be reduced, thereby enabling thinner profile imaging devices.

Abstract: An enhanced illumination system is provided. In some configurations, an illumination system comprises one or more illuminators for emitting light. Light steering optical elements direct the light along diverging axes. In some configurations, the camera module assembly can cause an output to be tilted down or tilted up relative to a horizontal plane. In some configurations, the illumination system comprises diffusers positioned to receive light along the diverging axes, each diffuser producing a field of illumination having a predetermined angle. The illumination system can be mounted on a computing device, such as an HMD providing a field of view to a camera, sensor, and/or a user. By the use of the techniques disclosed herein, an illumination system can mitigate optical loss that may be caused by a curved visor positioned between the illumination system and an object in the field of view.

Abstract: This document describes techniques and apparatuses that implement a high thermal conductivity region for optoelectronic devices. In some embodiments, a printed circuit board (PCB) includes a high thermal conductivity region that extends through the PCB. The high thermal conductivity region has first and second surfaces that are approximately coplanar with exterior layers of the PCB. A side-emitting optoelectronic device is mounted to the first surface of the high thermal conductivity region via conductive material that enables conduction of the device's heat into the high thermal conductivity region. The high thermal conductivity region can then transfer the heat away from the device and toward the second surface of the high thermal conductivity region, thereby improving the device's thermal performance.

Abstract: A system and method are disclosed for reducing light from one or more light sources from entering into a light sensor by reflection off of a visor and/or waveguiding within the visor. In embodiments, a shroud may be provided around the light sensor to block light reflected off of the visor from entering the light sensor. In embodiments, pattern of one or more grooves may be formed in the visor to block light waveguided within the visor from entering the light sensor.

Abstract: A time-of-flight 3D imaging system includes a light source having a plurality of P-N junctions in electrical series, an imaging sensor, and a time measurement device configured to measure the elapsed time-of-flight between a pulse of output light being emitted from the plurality of P-N junctions in series and incoming light including the pulse of output light being detected at the imaging sensor.

Abstract: Structured light systems for three dimensional imaging are provided with a pulsed light source, an imaging sensor and an infrared band-pass filter to selectively pass filtered light to the imaging sensor, as well as a global shutter to control exposure of the imaging sensor to light.

Abstract: An illumination module can comprise a circuit board, a semiconductor-based light source mounted to the circuit board, an encasing mounted to the circuit board, and one or more optical surfaces at least partially contained within the encasing. The semiconductor-based light source can emit light in a first illumination pattern. The one or more optical surfaces can be collectively configured to receive the light from the edge-emitting semiconductor-based light source. The one or more optical surfaces can further be collectively configured to condition and redirect the light, and to output the conditioned and redirected light from the illumination module in a second illumination pattern different from the first illumination pattern.

Abstract: An illumination module can comprise a circuit board, a semiconductor-based light source mounted to the circuit board, an encasing mounted to the circuit board, and one or more optical surfaces at least partially contained within the encasing. The semiconductor-based light source can emit light in a first illumination pattern. The one or more optical surfaces can be collectively configured to receive the light from the edge-emitting semiconductor-based light source. The one or more optical surfaces can include a single optical surface configured to receive, condition, and redirect the light from the edge-emitting semiconductor-based light source. As such, the one or more optical surfaces can be collectively configured to output the conditioned and redirected light from the illumination module in a second illumination pattern different from the first illumination pattern.

Abstract: An image sensor comprising a substrate that includes a plurality of photodiodes and a shutter trigger contact is disclosed. The plurality of photodiodes collectively define at least part of a pixel area parallel to a surface of the substrate. The shutter trigger contact is coupled to provide a common shutter trigger signal to the plurality of photodiodes and includes a contiguous conductive region disposed on the substrate substantially coextensively with the pixel area.

Abstract: A light source module comprising a semiconductor light source mounted directly to a conducting trace of a multilayer printed circuit board having a core comprising a plurality of core layers electrically and thermally coupled by a plurality of buried vias wherein at least one of the core layers comprises a heat sink plane.

Abstract: A system and method are disclosed for reducing light from one or more light sources from entering into a light sensor by reflection off of a visor and/or waveguiding within the visor. In embodiments, a shroud may be provided around the light sensor to block light reflected off of the visor from entering the light sensor. In embodiments, pattern of one or more grooves may be formed in the visor to block light waveguided within the visor from entering the light sensor.

Abstract: A system and method are disclosed for shielding EMI in an electronic device such as a depth sensor used in a head mounted display device. In embodiments, the shield has a dual construction including a fence that may be surface mounted to a substrate over a first set of surface mounted components. The EMI shield may further comprise a cover, which may be glued to the fence after a second set of components is mounted to the substrate.

Abstract: An image sensor comprising a substrate that includes a plurality of photodiodes and a shutter trigger contact is disclosed. The plurality of photodiodes collectively define at least part of a pixel area parallel to a surface of the substrate. The shutter trigger contact is coupled to provide a common shutter trigger signal to the plurality of photodiodes and includes a contiguous conductive region disposed on the substrate substantially coextensively with the pixel area.

Abstract: An image capture device, such as a camera, has multiple modes including a light field image capture mode, a conventional 2D image capture mode, and at least one intermediate image capture mode. By changing position and/or properties of the microlens array (MLA) in front of the image sensor, changes in 2D spatial resolution and angular resolution can be attained. In at least one embodiment, such changes can be performed in a continuous manner, allowing a continuum of intermediate modes to be attained.

Abstract: A dual-mode light field camera or plenoptic camera is enabled to perform both 3D light field imaging and conventional high-resolution 2D imaging, depending on the selected mode. In particular, an active system is provided that enables the microlenses to be optically or effectively turned on or turned off, allowing the camera to selectively operate as a 2D imaging camera or a 3D light field camera.

Abstract: A light-field camera may have a light-field capture configuration in which the light-field camera captures light-field images, and a conventional capture configuration in which the light-field camera captures conventional images. User input may be received; in response to receipt of the user input, the light-field camera may move from an initial configuration in which the light-field camera is in one of the light-field capture configuration, and the conventional capture configuration, to a selected configuration in which the light-field camera is in the other of the light-field capture configuration, and the conventional capture configuration. The light-field camera may be used to capture a first image in the selected configuration. The light-field camera may have a sensor, a microlens array, an actuator, and a guide mechanism by which the microlens array may be moved relative to the sensor to move the light-field camera into the selected configuration.