Abstract: A process for synthesizing an aminosilane compound such as bis(tertiarybutylamino)silane is provided. In one aspect of the present invention, there is provided a process for making bis(tertiarybutylamino)silane comprising reacting a stoichiometric excess of tert-butylamine with dichlorosilane under anhydrous conditions sufficient such that a liquid comprising the bis(tertiarybutylamino)silane product is produced.

Abstract: A process for synthesizing an aminosilane compound such as bis(tertiarybutylamino)silane is provided. In one aspect of the present invention, there is provided a process for making bis(tertiarybutylamino)silane comprising reacting a stoichiometric excess of tert-butylamine with dichlorosilane under anhydrous conditions sufficient such that a liquid comprising the bis(tertiarybutylamino)silane product is produced.

Abstract: Thin films possessing low dielectric constants (e.g., dielectric constants below 3.0) are formed on integrated circuits or other substrates. Caged-siloxane precursors are linked in such a way as to form dielectric layers, which exhibit low dielectric constants by virtue of their silicon dioxide-like molecular structure and porous nature. Supercritical fluids may be used as the reaction medium and developer both to the dissolve and deliver the caged-siloxane precursors and to remove reagents and byproducts from the reaction chamber and resultant porous film created.

Abstract: A chemical vapor deposition (CVD) process uses a precursor gas, such as with a siloxane or alkylsilane, and a carbon-dioxide-containing gas, such as CO2 with O2 or CO2 with CxH(2x+1)OH where 1≦x≦5, to deposit a dielectric layer with no photoresist “footing”, a low dielectric constant, and high degrees of adhesion and hardness. Because nitrogen is not used in the deposition process (the carbon-dioxide-containing gas replaces nitrogen-containing gases in conventional processes), amines do not build into the deposited layer, thereby preventing photoresist “footing”.

Abstract: A process for the chemical vapor deposition of silicon dioxide and silicon oxynitride from reactant gases O.sub.2, O.sub.3, N.sub.2 O, NO, NO.sub.2, NH.sub.3 and a silane of the formula: (t-C.sub.4 H.sub.9 NH).sub.2 SiH.sub.2. A process whereby a stack of silicon containing dielectrics ranging from silicon nitride to silicon oxide may be deposited successively (at the same pressure and temperature) by changing the reactants O.sub.2, O.sub.3, N.sub.2 O, NO, NO.sub.2, NH.sub.3 while maintaing a constant flow of (t-C.sub.4 H.sub.9 NH).sub.2 SiH.sub.2. The films are suitable for use in the semiconductor and related industries.

Abstract: A process for removal of Group 13 and/or 15 elements from an organosilane containing Group 13 and/or 15 elements as contaminants comprising contacting the organosilane with a reagent substantially soluble in the organosilane and capable of forming a complex with the Group 13 and/or Group 15 element which is less volatile than the organosilane, wherein the reagent is selected from the group consisting of thiols, alcohols, carboxylic acids, amines or mixtures thereof and separating the organosilane from the complex by distillation.

Abstract: A process for the low pressure chemical vapor deposition of silicon nitride from ammonia and a silane of the formula: (t-C.sub.4 H.sub.9 NH).sub.2 SiH.sub.2 provides improved properties of the resulting film for use in the semiconductor industry.

Abstract: The present invention is a process for very low temperature chemical vapor deposition of silicon dioxide, comprising the steps ofa) heating a substrate upon which silicon dioxide is to be deposited to a temperature in the range of approximately 150 to 500.degree. C. in a vacuum maintained at a pressure in the range of approximately 50 to 750 mTorr;b) introducing into said vacuum an organosilane containing feed and an oxygen containing feed, said organosilane containing feed consisting essentially of one or more compounds having the general formula: ##STR1## wherein R.sup.1 and R.sup.2 are independently alkyl, alkenyl, alkynyl, or aryl, having C.sub.1 to C.sub.6, or R.sup.1 and R.sup.2 are combined to form an alkyl chain C.sub.x (R.sup.3).sub.2, where R.sup.3 is independently H, C.sub.x H.sub.2x+1, and x=1-6, and R.sup.4 is independently H, C.sub.y H.sub.2y+1 where y=1-6; andc) maintaining said temperature and vacuum thereby causing a thin film of silicon dioxide to deposit on the substrate.