Patents by Inventor Ravi Mullapudi
Ravi Mullapudi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10550464Abstract: A circular PVD chamber has a plurality of sputtering targets mounted on a top wall of the chamber. A pallet in the chamber is coupled to a motor for rotating the pallet about its center axis. The pallet has a diameter less than the diameter of the circular chamber. The pallet is also shiftable in an XY direction to move the center of the pallet beneath any of the targets so all areas of a workpiece supported by the pallet can be positioned directly below any one of the targets. A scanning magnet is in back of each target and is moved, via a programmed controller, to only be above portions of the workpiece so that no sputtered material is wasted. For depositing a material onto small workpieces, a cooling backside gas volume is created between the pallet and the underside of sticky tape supporting the workpieces.Type: GrantFiled: March 14, 2018Date of Patent: February 4, 2020Assignee: Tango Systems, Inc.Inventors: Ravi Mullapudi, Harish Varma Penmethsa, Harshal T. Vasa, Srikanth Dasaradhi, Lee LaBlanc
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Patent number: 10053771Abstract: A circular PVD chamber has a plurality of sputtering targets mounted on a top wall of the chamber. A pallet in the chamber is coupled to a motor for rotating the pallet about its center axis. The pallet has a diameter less than the diameter of the circular chamber. The pallet is also shiftable in an XY direction to move the center of the pallet beneath any of the targets so all areas of a workpiece supported by the pallet can be positioned directly below any one of the targets. A scanning magnet is in back of each target and is moved, via a programmed controller, to only be above portions of the workpiece so that no sputtered material is wasted. For depositing a material onto small workpieces, a cooling backside gas volume is created between the pallet and the underside of sticky tape supporting the workpieces.Type: GrantFiled: October 26, 2015Date of Patent: August 21, 2018Assignee: Tango Systems Inc.Inventors: Ravi Mullapudi, Manohar Korlapati
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Publication number: 20180202040Abstract: A circular PVD chamber has a plurality of sputtering targets mounted on a top wall of the chamber. A pallet in the chamber is coupled to a motor for rotating the pallet about its center axis. The pallet has a diameter less than the diameter of the circular chamber. The pallet is also shiftable in an XY direction to move the center of the pallet beneath any of the targets so all areas of a workpiece supported by the pallet can be positioned directly below any one of the targets. A scanning magnet is in back of each target and is moved, via a programmed controller, to only be above portions of the workpiece so that no sputtered material is wasted. For depositing a material onto small workpieces, a cooling backside gas volume is created between the pallet and the underside of sticky tape supporting the workpieces.Type: ApplicationFiled: March 14, 2018Publication date: July 19, 2018Inventors: Ravi Mullapudi, Harish Varma Penmethsa, Harshal T. Vasa, Srikanth Dasaradhi, Lee LaBlanc
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Patent number: 9957606Abstract: A circular PVD chamber has a plurality of sputtering targets mounted on a top wall of the chamber. A pallet in the chamber is coupled to a motor for rotating the pallet about its center axis. The pallet has a diameter less than the diameter of the circular chamber. The pallet is also shiftable in an XY direction to move the center of the pallet beneath any of the targets so all areas of a workpiece supported by the pallet can be positioned directly below any one of the targets. A scanning magnet is in back of each target and is moved, via a programmed controller, to only be above portions of the workpiece so that no sputtered material is wasted. For depositing a material onto small workpieces, a cooling backside gas volume is created between the pallet and the underside of sticky tape supporting the workpieces.Type: GrantFiled: October 26, 2015Date of Patent: May 1, 2018Assignee: Tango Systems Inc.Inventors: Ravi Mullapudi, Srikanth Dasaradhi, Lee LaBlanc, Suresh Palanisamy, Venkata Dora Chowdary Kakarla
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Patent number: 9932668Abstract: A circular PVD chamber has a plurality of sputtering targets mounted on a top wall of the chamber. A pallet in the chamber is coupled to a motor for rotating the pallet about its center axis. The pallet has a diameter less than the diameter of the circular chamber. The pallet is also shiftable in an XY direction to move the center of the pallet beneath any of the targets so all areas of a workpiece supported by the pallet can be positioned directly below any one of the targets. A scanning magnet is in back of each target and is moved, via a programmed controller, to only be above portions of the workpiece so that no sputtered material is wasted. For depositing a material onto small workpieces, a cooling backside gas volume is created between the pallet and the underside of sticky tape supporting the workpieces.Type: GrantFiled: October 26, 2015Date of Patent: April 3, 2018Assignee: Tango Systems Inc.Inventors: Ravi Mullapudi, Harish Varma Penmethsa, Harshal T. Vasa, Srikanth Dasaradhi, Lee LeBlanc
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Publication number: 20170114448Abstract: A circular PVD chamber has a plurality of sputtering targets mounted on a top wall of the chamber. A pallet in the chamber is coupled to a motor for rotating the pallet about its center axis. The pallet has a diameter less than the diameter of the circular chamber. The pallet is also shiftable in an XY direction to move the center of the pallet beneath any of the targets so all areas of a workpiece supported by the pallet can be positioned directly below any one of the targets. A scanning magnet is in back of each target and is moved, via a programmed controller, to only be above portions of the workpiece so that no sputtered material is wasted. For depositing a material onto small workpieces, a cooling backside gas volume is created between the pallet and the underside of sticky tape supporting the workpieces.Type: ApplicationFiled: October 26, 2015Publication date: April 27, 2017Inventors: Ravi Mullapudi, Harish Varma Penmethsa, Harshal T. Vasa, Srikanth Dasaradhi, Lee LaBlanc
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Publication number: 20170114449Abstract: A circular PVD chamber has a plurality of sputtering targets mounted on a top wall of the chamber. A pallet in the chamber is coupled to a motor for rotating the pallet about its center axis. The pallet has a diameter less than the diameter of the circular chamber. The pallet is also shiftable in an XY direction to move the center of the pallet beneath any of the targets so all areas of a workpiece supported by the pallet can be positioned directly below any one of the targets. A scanning magnet is in back of each target and is moved, via a programmed controller, to only be above portions of the workpiece so that no sputtered material is wasted. For depositing a material onto small workpieces, a cooling backside gas volume is created between the pallet and the underside of sticky tape supporting the workpieces.Type: ApplicationFiled: October 26, 2015Publication date: April 27, 2017Inventors: Ravi Mullapudi, Srikanth Dasaradhi, Lee LaBlanc, Suresh Palanisamy, Venkata Dora Chowdary Kakarla
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Publication number: 20170114447Abstract: A circular PVD chamber has a plurality of sputtering targets mounted on a top wall of the chamber. A pallet in the chamber is coupled to a motor for rotating the pallet about its center axis. The pallet has a diameter less than the diameter of the circular chamber. The pallet is also shiftable in an XY direction to move the center of the pallet beneath any of the targets so all areas of a workpiece supported by the pallet can be positioned directly below any one of the targets. A scanning magnet is in back of each target and is moved, via a programmed controller, to only be above portions of the workpiece so that no sputtered material is wasted. For depositing a material onto small workpieces, a cooling backside gas volume is created between the pallet and the underside of sticky tape supporting the workpieces.Type: ApplicationFiled: October 26, 2015Publication date: April 27, 2017Inventors: Ravi Mullapudi, Manohar Korlapati
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Publication number: 20120085638Abstract: A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers can be transferred between the two chambers by a robotic arm without breaking a vacuum. The wafers are mounted one-by-one onto a rotating first pallet in the pre-cleaning chamber through a single entrance/exit port. After a batch cleaning, the robotic arm transfers the wafers one-by-one to a rotating second pallet in a sputtering chamber through a single entrance/exit, where the wafers are subjected to a batch sputtering process. After the sputtering process, the robotic arm transfers the wafers one-by-one to a load lock.Type: ApplicationFiled: December 16, 2011Publication date: April 12, 2012Applicant: TANGO SYSTEMS, INC.Inventors: Ravi Mullapudi, Dean Smith, Edward Strepka, Srikanth Dasaradhi
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Publication number: 20120024694Abstract: A sputtering chamber contains a plurality of substantially triangular targets supported by a top wall. The targets have narrow ends pointing toward a center of the top wall. Above each target is a relatively small substantially triangular magnet. Each magnet is connected to a single central actuator that scans all magnets back and forth through an arc across its associated target. Each magnet is also movably connected to an arm connected to the central scanning actuator. A linear actuator moves each magnet up and down the arm simultaneously with the angular scanning movement. The combination of the simultaneous angular movement and linear movement (perpendicular to the arc) of the magnet causes each magnet to move only over a substantially triangular area corresponding to an area of an associated target. In one embodiment, the linear speed of the magnets is varied to achieve uniform erosion of the target.Type: ApplicationFiled: July 29, 2010Publication date: February 2, 2012Applicant: TANGO SYSTEMS, INC.Inventors: Ravi Mullapudi, Srikanth Dasaradhi, Edward Sterpka, Biju Ninan
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Patent number: 8092659Abstract: A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers can be transferred between the two chambers by a robotic arm without breaking a vacuum. The wafers are mounted one-by-one onto a rotating pallet in the pre-cleaning chamber and sputtering chamber. The pallet is firmly fixed to a rotatable table in the sputtering chamber. Copper tubing in the table couples RF energy to the wafers, and a liquid running through the copper tubing controls the temperature of the wafers. Multiple targets, of the same or different materials, may concurrently deposit material on the wafers as the pallet is rotating. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber oscillate over their respective targets for uniform target erosion and uniform deposition on the wafers.Type: GrantFiled: January 21, 2009Date of Patent: January 10, 2012Assignee: Tango Systems, Inc.Inventors: Ravi Mullapudi, Dean Smith, Edward Strepka, Srikanth Dasaradhi
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Patent number: 7799190Abstract: A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber oscillate over their respective targets for uniform target erosion and uniform deposition on the wafers. An electrically insulated target backing plate between each magnet and a target has a liquid channel running through it for controlling temperature, where the liquid channel has a wider cross-sectional area around the middle portion of the target backing plate to increase cooling of the middle portion of the target. The distance between the magnets and the targets is made very small by a thin aluminum plate fixed to the bottom segment of the target backing plate by a dip brazing process.Type: GrantFiled: April 14, 2005Date of Patent: September 21, 2010Assignee: Tango Systems, Inc.Inventors: Ravi Mullapudi, Dean Smith, Srikanth Dasaradhi
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Patent number: 7794574Abstract: A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers can be transferred between the two chambers by a robotic arm without breaking a vacuum. The wafers are mounted one-by-one onto a rotating pallet in the pre-cleaning chamber and sputtering chamber. The pallet is firmly fixed to a rotatable table in the sputtering chamber. Copper tubing in the table couples RF energy to the wafers, and a liquid running through the copper tubing controls the temperature of the wafers. Multiple targets, of the same or different materials, may concurrently deposit material on the wafers as the pallet is rotating. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber oscillate over their respective targets for uniform target erosion and uniform deposition on the wafers.Type: GrantFiled: April 14, 2005Date of Patent: September 14, 2010Assignee: Tango Systems, Inc.Inventors: Ravi Mullapudi, Dean Smith, Srikanth Dasaradhi
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Patent number: 7785455Abstract: A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers can be transferred between the two chambers by a robotic arm without breaking a vacuum. The wafers are mounted one-by-one onto a rotating pallet in the pre-cleaning chamber and sputtering chamber. The pallet is firmly fixed to a rotatable table in the sputtering chamber. Copper tubing in the table couples RF energy to the wafers, and a liquid running through the copper tubing controls the temperature of the wafers. Multiple targets, of the same or different materials, may concurrently deposit material on the wafers as the pallet is rotating. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber oscillate over their respective targets for uniform target erosion and uniform deposition on the wafers.Type: GrantFiled: April 14, 2005Date of Patent: August 31, 2010Assignee: Tango Systems, Inc.Inventors: Ravi Mullapudi, Dean Smith
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Patent number: 7744730Abstract: A processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. Multiple targets, of the same or different materials, may concurrently deposit material on the wafers as the pallet is rotating. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber oscillate back and forth across an arc over their respective targets for uniform target erosion and uniform deposition on the wafers.Type: GrantFiled: April 14, 2005Date of Patent: June 29, 2010Assignee: Tango Systems, Inc.Inventors: Ravi Mullapudi, Edward Strepka
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Publication number: 20100080928Abstract: A vacuum chamber has multiple wafer positions, and the wafers are positioned by a rotating pallet. Above a wafer position in the chamber there may be a sputtering target, a flat inductively coupled plasma (ICP) coil for etching the wafer and/or promoting sputtering, and a TEOS vapor outlet for forming an oxide film on the wafer. As the pallet rotates, a wafer may first have deposited a thin layer of oxide on walls of a via hole at the TEOS position. A metal layer may then be sputtered in the via hole at the sputtering position, and any pinch-off material may be etched away at an etching position. A magnet behind each target scans back and forth behind the target. Vertical magnet walls substantially surround a sputtering target for confining the sputtered material to an angle that is more normal to the wafer than prior art trajectories to fill narrower vias.Type: ApplicationFiled: September 26, 2008Publication date: April 1, 2010Applicant: TANGO SYSTEMS, INC.Inventors: Ravi Mullapudi, Biju Ninan
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Publication number: 20100078312Abstract: A vacuum chamber has multiple wafer positions, and the wafers are positioned by a rotating pallet. Above a wafer position in the chamber there may be a sputtering target, a flat inductively coupled plasma (ICP) coil for etching the wafer and/or promoting sputtering, and a TEOS vapor outlet for forming an oxide film on the wafer. As the pallet rotates, a wafer may first have deposited a thin layer of oxide on walls of a via hole at the TEOS position. A metal layer may then be sputtered in the via hole at the sputtering position, and any pinch-off material may be etched away at an etching position. A magnet behind each target scans back and forth behind the target. Vertical magnet walls substantially surround a sputtering target for confining the sputtered material to an angle that is more normal to the wafer than prior art trajectories to fill narrower vias.Type: ApplicationFiled: September 26, 2008Publication date: April 1, 2010Applicant: Tango Systems, Inc.Inventors: Ravi Mullapudi, Biju Ninan, Gabriel A. Calebotta
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Patent number: 7682495Abstract: A processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. Multiple targets, of the same or different materials, may concurrently deposit material on the wafers as the pallet is rotating. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber oscillate back and forth across an arc over their respective targets for uniform target erosion and uniform deposition on the wafers.Type: GrantFiled: April 14, 2005Date of Patent: March 23, 2010Assignee: Tango Systems, Inc.Inventors: Ravi Mullapudi, Dean Smith, Srikanth Dasaradhi
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Publication number: 20090127099Abstract: A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers can be transferred between the two chambers by a robotic arm without breaking a vacuum. The wafers are mounted one-by-one onto a rotating pallet in the pre-cleaning chamber and sputtering chamber. The pallet is firmly fixed to a rotatable table in the sputtering chamber. Copper tubing in the table couples RF energy to the wafers, and a liquid running through the copper tubing controls the temperature of the wafers. Multiple targets, of the same or different materials, may concurrently deposit material on the wafers as the pallet is rotating. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber oscillate over their respective targets for uniform target erosion and uniform deposition on the wafers.Type: ApplicationFiled: January 21, 2009Publication date: May 21, 2009Applicant: TANGO SYSTEMS, INC.Inventors: Ravi Mullapudi, Dean Smith, Edward Strepka, Srikanth Dasaradhi
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Patent number: 7479210Abstract: A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers can be transferred between the two chambers by a robotic arm without breaking a vacuum. The wafers are mounted one-by-one onto a rotating pallet in the pre-cleaning chamber and sputtering chamber. The pallet is firmly fixed to a rotatable table in the sputtering chamber. Copper tubing in the table couples RF energy to the wafers, and a liquid running through the copper tubing controls the temperature of the wafers. Multiple targets, of the same or different materials, may concurrently deposit material on the wafers as the pallet is rotating. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber oscillate over their respective targets for uniform target erosion and uniform deposition on the wafers.Type: GrantFiled: April 14, 2005Date of Patent: January 20, 2009Assignee: Tango Systems, Inc.Inventors: Ravi Mullapudi, Dean Smith, Edward Strepka