Patents by Inventor RAVI PALANISWAMY
RAVI PALANISWAMY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240011679Abstract: The present invention is a thermal management device including a power source, a flexible thermoelectric module, and a first phase change material.Type: ApplicationFiled: December 2, 2021Publication date: January 11, 2024Inventors: Milind B. Sabade, Ravi Palaniswamy, Ryan J. Rogers, Diane L. Emslander, Dominic J. Julian
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Publication number: 20230019334Abstract: The present disclosure relates to a method of fabricating a thermoelectric device. The method includes disposing a metal layer on a dielectric layer to form a sub-assembly, forming patterned circuits on the metal layer, forming blind vias in the dielectric layer, fabricating first thermoelectric elements in a first series of blind vias, and fabricating second thermoelectric elements in a second series of blind vias to form thermoelectric units with the first thermoelectric elements and the patterned circuits. The sub-assembly is configured to be joined to an adjacent sub-assembly along a first direction, and the first and second thermoelectric elements of each thermoelectric unit are aligned in a second direction substantially perpendicular to the first direction. The present disclosure further relates to a thermoelectric device which includes a plurality of thermoelectric units forming a strip extending in a first direction.Type: ApplicationFiled: December 6, 2019Publication date: January 19, 2023Inventors: Ravi Palaniswamy, Antonny Flor, Sheldon B. Ruiz, Milind B. Sabade
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Publication number: 20220415752Abstract: A direct to chip cooling film for two-phase cooling. The film includes a dielectric layer having a first surface for attachment to a cold plate or circuits and having a second surface. A metal layer is on the second surface of the dielectric layer with a pattern of features on a side opposite the dielectric layer. This surface pattern provides increased surface area and multiple nucleation sites for bubbles formation for two-phase cooling. The features can also include metal nodules to further enhance the nucleation.Type: ApplicationFiled: December 1, 2020Publication date: December 29, 2022Inventors: Ravi Palaniswamy, Sung W. Moon, Brinda B. Badri, Siang Sin Foo
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Patent number: 11338236Abstract: Systems and methods for monitoring the status of air filters are provided. One or more thermoelectric sensors are provided to have an upstream sensing surface positioned adjacent the inlet surface of the air filter, and a downstream sensing surface positioned adjacent the outlet surface of the air filter. Sensing circuitry are connected to the thermoelectric sensors, configured to receive signals from the thermoelectric sensors and process the signals to obtain status information of the air filter.Type: GrantFiled: April 19, 2018Date of Patent: May 24, 2022Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Jae Yong Lee, Mahmut Aksit, Ravi Palaniswamy, Antonny E. Flor, James F. Poch, Michael A. Meis, Alejandro Aldrin A. Narag, II, Siang Sin Foo, Donato G. Caraig
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Patent number: 11324113Abstract: Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.Type: GrantFiled: April 8, 2020Date of Patent: May 3, 2022Assignee: 3M Innovative Properties CompanyInventors: Nicholas T. Gabriel, Ronald D. Jesme, Andrew J. Ouderkirk, Ravi Palaniswamy, Andrew P. Bonifas, Alejandro Aldrin A. Narag, II, Robert M. Jennings, Robin E. Gorrell
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Publication number: 20210202818Abstract: Flexible thermoelectric devices including an array of slot openings on a flexible substrate, and methods of making and using the same are provided. The slot openings on the flexible substrate can help remove the tension or compression induced during bending of the devices. Slot openings each extend along a cross direction substantially perpendicular to the longitudinal direction of the substrate.Type: ApplicationFiled: March 14, 2019Publication date: July 1, 2021Inventors: Ravi Palaniswamy, Donato G. Caraig, Jian Xia Gao, Alejandro Aldrin A. Narag, II, Siang Sin Foo, Antonny E. Flor
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Publication number: 20210195743Abstract: A flexible multilayer construction is configured for mounting an electronic device. The flexible multilayer construction includes electrically conductive spaced apart first and second pads for electrically connecting to corresponding electrically conductive first and second terminals of the electronic device. The first and second pads define a capillary groove therebetween that is at least partially filled with an electrically insulative reflective material by a capillary action.Type: ApplicationFiled: February 15, 2017Publication date: June 24, 2021Inventors: Donato G. Caraig, Choong Meng How, Ravi Palaniswamy, Alejandro Aldrin A. Narag, II, Bing Liu
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Publication number: 20210098678Abstract: Flexible thermoelectric devices including a flexible heat management layer on the hot side thereof, and methods of making and using the same, are provided. The flexible heat management layer includes a water harvesting material configured to absorb water or moisture and dissipate heat by evaporation of the absorbed water or moisture. In some cases, the water harvesting material includes a mixture of a superabsorbent polymer (SAP) material and a metal-organic framework (MOF) material.Type: ApplicationFiled: December 20, 2018Publication date: April 1, 2021Inventors: Ravi Palaniswamy, Antonny E. Flor, HongQian Bao, Jaime L. Angeles, Jae Yong Lee, Mahmut Aksit
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Patent number: 10818642Abstract: A flexible multilayer construction (1000) for mounting a plurality of light emitting semiconductor devices (LESDs 100, 110, 120) includes a flexible dielectric substrate (200) comprising top (210) and bottom (220) major surfaces, and pluralities of corresponding electrically conductive top (300, 310, 320, 330) and bottom (500, 510, 520, 530) pads disposed on the top and bottom major surfaces, respectively. An electrically conductive via (400, 410, 420, 430) connects each pair of corresponding top and bottom pads, a side of each top pad partially overlapping a side of the corresponding bottom pad and a side of the substrate, such that in a plan view, each top pad fully overlaps the corresponding bottom pad.Type: GrantFiled: July 12, 2017Date of Patent: October 27, 2020Assignee: 3M Innovative Properties CompanyInventors: Alejandro Aldrin Il A. Narag, Ravi Palaniswamy
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Publication number: 20200236780Abstract: Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.Type: ApplicationFiled: April 8, 2020Publication date: July 23, 2020Inventors: Nicholas T. Gabriel, Ronald D. Jesme, Andrew J. Ouderkirk, Ravi Palaniswamy, Andrew P. Bonifas, Alejandro Aldrin A. Narag, II, Robert M. Jennings, Robin E. Gorrell
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Patent number: 10692843Abstract: A flexible polymeric dielectric layer (12) having first and second major surfaces, the first major surface having a conductive layer (20) thereon, the dielectric layer having at least one conduit (10) extending from the second major surface to the first major surface, the conduit having at least one lateral dimension of at least about one centimeter and being at least partially filled with conductive material (18), the conductive layer including at least one conductive feature (21) substantially aligned with the conduit (10), the conductive feature (21) supporting a plurality of light emitting semiconductor devices (22).Type: GrantFiled: December 2, 2014Date of Patent: June 23, 2020Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Jian Xia Gao, Alejandro Aldrin A. Narag, II, Nathan P. Kreutter, Andrew J. Ouderkirk
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Patent number: 10653006Abstract: Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.Type: GrantFiled: December 14, 2015Date of Patent: May 12, 2020Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Nicholas T. Gabriel, Ronald D. Jesme, Andrew J. Ouderkirk, Ravi Palaniswamy, Andrew P. Bonifas, Alejandro Aldrin A. Narag, II, Robert M. Jennings, Robin E. Gorrell
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Patent number: 10580940Abstract: A flexible dielectric substrate (102) defines a LESD mounting region (120) including two conductive filled vias (105, 106) extending through the flexible dielectric substrate (102) and the LESD mounting region is substantially surrounded by two conductive frame portions (112, 116). The frame portions are in electrical connection with the conductive filled vias (105, 106), respectively. The conductive filled vias (105, 106) form conductive features in the mounting region (120) that are co-planar with each other.Type: GrantFiled: August 30, 2016Date of Patent: March 3, 2020Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Alejandro Aldrin A. Narag, II, Ravi Palaniswamy
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Publication number: 20200054979Abstract: Systems and methods for monitoring the status of air filters are provided. One or more thermoelectric sensors are provided to have an upstream sensing surface positioned adjacent the inlet surface of the air filter, and a downstream sensing surface positioned adjacent the outlet surface of the air filter. Sensing circuitry are connected to the thermoelectric sensors, configured to receive signals from the thermoelectric sensors and process the signals to obtain status information of the air filter.Type: ApplicationFiled: April 19, 2018Publication date: February 20, 2020Inventors: Jae Yong Lee, Mahmut Aksit, Ravi Palaniswamy, Antonny E. Flor, James F. Poch, Michael A. Meis, Alejandro Aldrin A. Narag, II, Siang Sin Foo, Donato G. Caraig
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Patent number: 10438897Abstract: A flexible multilayer construction (100) for mounting a light emitting semiconductor device (200) (LESD), includes a flexible dielectric substrate (110) having an LESD mounting region (120), first and second electrically conductive pads (130, 140) disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD (200) received in the LESD mounting region, and a first fiducial alignment mark (150) for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.Type: GrantFiled: August 30, 2016Date of Patent: October 8, 2019Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Siang Sin Foo, Hiromitsu Kosugi, Alejandro Aldrin A. Narag, II, Ravi Palaniswamy
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Patent number: 10424707Abstract: Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.Type: GrantFiled: September 19, 2018Date of Patent: September 24, 2019Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Ravi Palaniswamy, Alejandro Aldrin II Agcaoili Narag, Siang Sin Foo, Hiromitsu Kosugi
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Publication number: 20190269016Abstract: A flexible multilayer construction (1000) for mounting a plurality of light emitting semiconductor devices (LESDs 100, 110, 120) includes a flexible dielectric substrate (200) comprising top (210) and bottom (220) major surfaces, and pluralities of corresponding electrically conductive top (300, 310, 320, 330) and bottom (500, 510, 520, 530) pads disposed on the top and bottom major surfaces, respectively. An electrically conductive via (400, 410, 420, 430) connects each pair of corresponding top and bottom pads, a side of each top pad partially overlapping a side of the corresponding bottom pad and a side of the substrate, such that in a plan view, each top pad fully overlaps the corresponding bottom pad.Type: ApplicationFiled: July 12, 2017Publication date: August 29, 2019Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Alejandro Aldrin II A. Narag, Ravi Palaniswamy
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Publication number: 20190181323Abstract: At least some aspects of the present disclosure direct to a flexible thermoelectric module. The thermoelectric module includes a flexible substrate, a plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements, a first set of connectors, and a second set of connectors. The substrate includes a plurality of vias filled with an electrically conductive material or thermoelectric elements. In some cases, the plurality of p-type thermoelectric elements and the plurality of n-type thermoelectric elements are disposed on the flexible substrate.Type: ApplicationFiled: June 13, 2017Publication date: June 13, 2019Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Jae Yong Lee, Roger W. Barton, Emily L. Bowen, Donato G. Caraig, Gareth A. Hughes, Ravi Palaniswamy, James F. Poch, Michael W. Dolezal
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Publication number: 20190181321Abstract: At least some aspects of the present disclosure direct to a flexible thermoelectric module. The thermoelectric module includes a flexible substrate, a plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements, a first set of connectors, and a second set of connectors. The substrate includes a plurality of vias filled with an electrically conductive material or thermoelectric elements. In some cases, the plurality of p-type thermoelectric elements and the plurality of n-type thermoelectric elements are disposed on the flexible substrate.Type: ApplicationFiled: June 22, 2017Publication date: June 13, 2019Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Jae Yong Lee, Roger W. Barton, Donato G. Caraig, Ankit Mahajan, Ravi Palaniswamy, James F. Poch, Michael W. Dolezal
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Publication number: 20190181322Abstract: At least some aspects of the present disclosure direct to a thermoelectric tape. The thermoelectric tape comprises a substrate having a plurality of vias, a series of flexible thermoelectric modules connected in parallel, and two conductive buses running longitudinally along the thermoelectric tape. Each flexible thermoelectric module includes a plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements. The series of flexible thermoelectric modules are electrically connected to the conductive buses.Type: ApplicationFiled: June 12, 2017Publication date: June 13, 2019Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Jae Yong Lee, Roger W. Barton, Donato G. Caraig, Ankit Mahajan, Ravi Palaniswamy, James F. Poch