Patents by Inventor Ravi Pokhrel

Ravi Pokhrel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper electroplating compositions and methods of electroplating copper on substrates
    Patent number: 10927468
    Abstract: Copper electroplating compositions which include an imidazole compound enables the electroplating of copper having uniform morphology on substrates. The composition and methods of enable copper electroplating of photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: February 23, 2021
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: Ravi Pokhrel
  • COPPER PILLARS HAVING IMPROVED INTEGRITY AND METHODS OF MAKING THE SAME
    Publication number: 20200266165
    Abstract: The copper pillars have improved integrity such that they can readily withstand the harsh reflow conditions of post solder bump application without readily failing. The method of making the copper pillars having the improved integrity involves a two-step electroplating process of varying current densities.
    Type: Application
    Filed: May 5, 2020
    Publication date: August 20, 2020
    Inventors: Ravi POKHREL, Michael K. Gallagher
  • Copper electroplating compositions and methods of electroplating copper on substrates
    Patent number: 10612148
    Abstract: Copper electroplating compositions which include a diimidazole compound enables the electroplating of copper having uniform morphology on substrates. The composition and methods of enable copper electroplating of photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: April 7, 2020
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: Ravi Pokhrel
  • Copper electroplating compositions and methods of electroplating copper on substrates
    Patent number: 10533259
    Abstract: Copper electroplating compositions which include an imidazole compound enables the electroplating of copper having uniform morphology on substrates. The composition and methods of enable copper electroplating of photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: January 14, 2020
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: Ravi Pokhrel
  • COPPER ELECTROPLATING COMPOSITIONS AND METHODS OF ELECTROPLATING COPPER ON SUBSTRATES
    Publication number: 20200010970
    Abstract: Copper electroplating compositions which include an imidazole compound enables the electroplating of copper having uniform morphology on substrates. The composition and methods of enable copper electroplating of photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: September 16, 2019
    Publication date: January 9, 2020
    Inventor: Ravi Pokhrel
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides
    Patent number: 10508349
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: December 17, 2019
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Ravi Pokhrel, Matthew Thorseth, James Byrnes, Mark Scalisi, Zuhra Niazimbetova, Joanna Dziewiszek
  • COPPER PILLARS HAVING IMPROVED INTEGRITY AND METHODS OF MAKING THE SAME
    Publication number: 20190259722
    Abstract: The copper pillars have improved integrity such that they can readily withstand the harsh reflow conditions of post solder bump application without readily failing. The method of making the copper pillars having the improved integrity involves a two-step electroplating process of varying current densities.
    Type: Application
    Filed: January 23, 2019
    Publication date: August 22, 2019
    Inventors: Ravi Pokhrel, Michael K. Gallagher
  • COPPER ELECTROPLATING COMPOSITIONS AND METHODS OF ELECTROPLATING COPPER ON SUBSTRATES
    Publication number: 20190136395
    Abstract: Copper electroplating compositions which include an imidazole compound enables the electroplating of copper having uniform morphology on substrates. The composition and methods of enable copper electroplating of photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: October 22, 2018
    Publication date: May 9, 2019
    Inventor: Ravi POKHREL
  • COPPER ELECTROPLATING COMPOSITIONS AND METHODS OF ELECTROPLATING COPPER ON SUBSTRATES
    Publication number: 20190136396
    Abstract: Copper electroplating compositions which include a diimidazole compound enables the electroplating of copper having uniform morphology on substrates. The composition and methods of enable copper electroplating of photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: October 22, 2018
    Publication date: May 9, 2019
    Inventor: Ravi Pokhrel
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF PYRAZOLE COMPOUNDS AND BISEPOXIDES
    Publication number: 20170370014
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: June 13, 2017
    Publication date: December 28, 2017
    Inventors: Ravi Pokhrel, Matthew Thorseth, James Byrnes, Mark Scalisi, Zuhra Niazimbetova, Joanna Dziewiszek