Patents by Inventor Ravi Prasher

Ravi Prasher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260125807
    Abstract: An electrolyzer system includes stacks of electrolyzer cells configured receive steam and air, and output a hydrogen product stream and an oxygen exhaust stream, and a first heat pump configured to extract heat from the oxygen exhaust stream to generate a first portion of the steam provided to the stacks.
    Type: Application
    Filed: January 5, 2026
    Publication date: May 7, 2026
    Inventors: Ravi PRASHER, K.R. SRIDHAR, Michael PETRUCHA, David WEINGAERTNER
  • Patent number: 12555819
    Abstract: This disclosure provides systems, methods, and apparatus related to thermal energy storage with phase change materials having an adjustable transition temperature. In one aspect, a method includes providing a device. The devices includes a phase change material, a salt dissolved in the phase change material, and an anode and a cathode disposed in the phase change material. The phase change material changes from a solid to a liquid at a first temperature when the salt is dissolved in the phase change material. A voltage is applied to the anode and the cathode to substantially remove the salt from the phase change material. The phase change material changes from the solid to the liquid at a second temperature when the salt is substantially removed from the phase change material, with the first temperature being a lower temperature than the second temperature.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: February 17, 2026
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Ravi Prasher, Sumanjeet Kaur, Gao Liu, Christopher Dames, Jonathan Lau, Drew Lilley, Piyachai Khomein, Joseph Papp
  • Publication number: 20260029170
    Abstract: Disclosed herein are methods, systems, and devices heating and cooling via an ionocaloric cycle. Methods include providing a first material in a solid state, combining the first material with a second material, wherein the second material provides an electrochemical field to the first material to reduce the melting point of the first material, and allowing the first material to melt, wherein the first material extracts heat from a cold reservoir upon melting. The method further includes separating the first material from the second material by a separation technique using a voltage applied to a combination of the first material and the second material and allowing the first material to precipitate, wherein the first material releases heat to a hot reservoir during precipitation.
    Type: Application
    Filed: July 21, 2023
    Publication date: January 29, 2026
    Inventors: Drew LILLEY, Ravi PRASHER
  • Patent number: 12529153
    Abstract: An electrolyzer system includes stacks of electrolyzer cells configured receive steam and air, and output a hydrogen product stream and an oxygen exhaust stream, and a first heat pump configured to extract heat from the oxygen exhaust stream to generate a first portion of the steam provided to the stacks.
    Type: Grant
    Filed: November 18, 2024
    Date of Patent: January 20, 2026
    Assignee: BLOOM ENERGY CORPORATION
    Inventors: Ravi Prasher, K.R. Sridhar, Michael Petrucha, David Weingaertner
  • Publication number: 20260015293
    Abstract: This disclosure provides systems, methods, and apparatus related to high-temperature thermal energy storage. In one aspect, a composite material includes a ceramic and graphite flakes dispersed in the ceramic. The ceramic serves as a matrix of the composite material. The ceramic is an oxide, a carbide, a boride, or a nitride. The graphite flakes are about 20 weight % to 35 weight % of the composite material. The composite material has a porosity of about 5% to 40%.
    Type: Application
    Filed: October 2, 2023
    Publication date: January 15, 2026
    Inventors: Sean Lubner, Ravi Prasher, Lin Yang, Nathaniel Weger, Akanksha K. Menon, Hanna Breunig, Peng Peng
  • Publication number: 20250260234
    Abstract: The present disclosure is directed to a system that employs fuel cell-based power generation for decentralized data centers that perform large, processing intensive tasks, such as training processes for large artificial intelligence models. The system utilizes various modules, such as energy storage systems, load banks, and other types of loads, to supplement power output by the fuel cells, as well as store any excess power generated by the fuel cell systems. As a result, swings in the power output by the fuel cell systems are minimized and the life of the fuel cell systems may be extended.
    Type: Application
    Filed: February 5, 2025
    Publication date: August 14, 2025
    Applicant: Bloom Energy Corporation
    Inventors: Prasad PMSVVSV, Ranganathan GURUNATHAN, Razvan PANATI, Carlton COTTULI, Ravi PRASHER, KR SRIDHAR
  • Publication number: 20250210675
    Abstract: An integrated fuel cell and absorption chiller system includes a fuel cell system configured to generate electrical power and waste heat, and an absorption chiller operatively coupled to the fuel cell system. The absorption chiller is configured to provide cooling using the waste heat generated by the fuel cell system.
    Type: Application
    Filed: December 4, 2024
    Publication date: June 26, 2025
    Inventors: Rueben M. KEMPTON, Chad PEARSON, Lorenzo PENNA, Joseph TAVI, Ravi PRASHER, Prateek VYAS
  • Publication number: 20250163594
    Abstract: An electrolyzer system includes stacks of electrolyzer cells configured receive steam and air, and output a hydrogen product stream and an oxygen exhaust stream, and a first heat pump configured to extract heat from the oxygen exhaust stream to generate a first portion of the steam provided to the stacks.
    Type: Application
    Filed: November 18, 2024
    Publication date: May 22, 2025
    Inventors: Ravi PRASHER, K.R. SRIDHAR, Michael PETRUCHA, David WEINGAERTNER
  • Publication number: 20240183623
    Abstract: This disclosure provides systems, methods, and apparatus related to salt hydrate composites. In one aspect, a method includes mixing a salt hydrate, a matrix material, and a binder to form a mixture. The mixture is ball milled. The mixing operation and the ball milling operation are performed without water.
    Type: Application
    Filed: November 29, 2023
    Publication date: June 6, 2024
    Inventors: Sumanjeet Kaur, Ravi Prasher, Andrew Martin, Drew Lilley, Alondra Perez
  • Publication number: 20230187686
    Abstract: This disclosure provides systems, methods, and apparatus related to thermal energy storage with phase change materials having an adjustable transition temperature. In one aspect, a method includes providing a device. The devices includes a phase change material, a salt dissolved in the phase change material, and an anode and a cathode disposed in the phase change material. The phase change material changes from a solid to a liquid at a first temperature when the salt is dissolved in the phase change material. A voltage is applied to the anode and the cathode to substantially remove the salt from the phase change material. The phase change material changes from the solid to the liquid at a second temperature when the salt is substantially removed from the phase change material, with the first temperature being a lower temperature than the second temperature.
    Type: Application
    Filed: August 30, 2022
    Publication date: June 15, 2023
    Inventors: Ravi Prasher, Sumanjeet Kaur, Gao Liu, Christopher Dames, Jonathan Lau, Drew Lilley, Piyachai Khomein, Joseph Papp
  • Publication number: 20190294522
    Abstract: Devices and methods of monitoring network-connected client devices are provided. A device includes a processor, a communication subsystem coupled to the processor for transmitting a common electronic document, and a memory coupled to the processor. The device may be configured to receive a plurality of delivery reports from the client devices that received the common electronic document, the plurality of delivery reports including a first delivery report having first consumption data associated with the common electronic document at a first client device; generate an engagement vector from the plurality of delivery reports, the generated engagement vector includes a threshold metric for determining an extent of interaction with the common electronic document at respective client devices; and provide a compliance result for the first client device by comparing the engagement vector to the first consumption data of the first client device.
    Type: Application
    Filed: March 23, 2018
    Publication date: September 26, 2019
    Inventor: Ravi PRASHER
  • Publication number: 20180366629
    Abstract: A thermoelectric device may include a first substrate, a second substrate, and a plurality of thermoelectric elements positioned between the first and second substrates. The thermoelectric device may also include a first attachment material connecting each thermoelectric element of the plurality of thermoelectric elements to the first substrate, and a second attachment material connecting each thermoelectric element of the plurality of thermoelectric elements to the second substrate. The first attachment material may have a higher liquidus temperature than a liquidus temperature of the second attachment material.
    Type: Application
    Filed: August 28, 2018
    Publication date: December 20, 2018
    Applicant: Sheetak, Inc.
    Inventors: Uttam GHOSHAL, Ravi PRASHER, Ayan GUHA
  • Publication number: 20160372650
    Abstract: A thermoelectric device may include a first substrate, a second substrate, and a plurality of thermoelectric elements positioned between the first and second substrates. The thermoelectric device may also include a first attachment material connecting each thermoelectric element of the plurality of thermoelectric elements to the first substrate, and a second attachment material connecting each thermoelectric element of the plurality of thermoelectric elements to the second substrate. The first attachment material may have a higher liquidus temperature than a liquidus temperature of the second attachment material.
    Type: Application
    Filed: June 17, 2015
    Publication date: December 22, 2016
    Inventors: Uttam GHOSHAL, Ravi PRASHER, Ayan GUHA
  • Publication number: 20160133814
    Abstract: An apparatus and method configured to provide electric power from a thermal source. The apparatus may include a thermoelectric generator and a heat source. The apparatus may include a fuel source. The heat source may be combustive or non-combustive. The apparatus may also include a thermal battery. The heat source may be configured to combust a hydrocarbon fuel to generated heat. The apparatus may include one or more thermal diodes and/or a heat sink to remove waste heat. The method may include converting thermal energy into electrical energy using the apparatus. The method may also include powering a light or other electrical load using the apparatus. The present disclosure includes a method for manufacturing the apparatus.
    Type: Application
    Filed: April 10, 2013
    Publication date: May 12, 2016
    Applicant: SHEETAK, INC.
    Inventors: Uttam GHOSHAL, Ayan GUHA, Key KOLLE, Himanshu POKHARNA, Ravi PRASHER, Ankita GHOSHAL
  • Patent number: 7957137
    Abstract: A method includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The method also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The method further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.
    Type: Grant
    Filed: November 2, 2009
    Date of Patent: June 7, 2011
    Assignee: Intel Corporation
    Inventor: Ravi Prasher
  • Publication number: 20100046167
    Abstract: An apparatus includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The apparatus also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The apparatus further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.
    Type: Application
    Filed: November 2, 2009
    Publication date: February 25, 2010
    Inventor: Ravi Prasher
  • Patent number: 7633752
    Abstract: An apparatus includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The apparatus also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The apparatus further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: December 15, 2009
    Assignee: Intel Corporation
    Inventor: Ravi Prasher
  • Patent number: 7576432
    Abstract: An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.
    Type: Grant
    Filed: November 9, 2005
    Date of Patent: August 18, 2009
    Assignee: Intel Corporation
    Inventors: Sarah E. Kim, R. Scott List, James G. Maveety, Alan M. Myers, Quat T. Vu, Ravi Prasher, Ravi Mahajan, Gilroy Vandentop
  • Patent number: 7498672
    Abstract: An apparatus including a micropin thermal solution is described. The apparatus comprises a substrate and a number of micropins thermally coupled to the substrate.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: March 3, 2009
    Assignee: Intel Corporation
    Inventors: Alan M. Myers, Ravi Prasher
  • Patent number: 7435623
    Abstract: A method and apparatus for cooling an electronics chip with a cooling plate having integrated micro channels and manifold/plenum made in separate single-crystal silicon or low-cost polycrystalline silicon. Forming the microchannels in the cooling plate is more economical than forming the microchannels directly into the back of the chip being cooled. In some embodiments, the microchannels are high-aspect-ratio grooves formed (e.g., by etching) into a polycrystalline silicon cooling base, which is then attached to a cover (to contain the cooling fluid in the grooves) and to the back of the chip.
    Type: Grant
    Filed: November 22, 2005
    Date of Patent: October 14, 2008
    Assignee: Intel Corporation
    Inventors: Gregory M. Chrysler, Ravi Prasher