Patents by Inventor Ravi Radhakrishnan

Ravi Radhakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240228532
    Abstract: Provided is, inter alia, a method, comprising: complexing a peptide-comprising surfactant (PEPS) to a rare earth element (REE) cation in a solution so as to form a PEPS-REE complex, the PEPS comprising a REE-binding region that preferentially binds to one or more REEs; and optionally recovering the REE cation from an air-liquid interface. Also provided is a composition, comprising: a complex comprising (i) a peptide-comprising surfactant (PEPS), the PEPS comprising at least one lanthanide binding tag (LBT), the at least one LBT comprising one or more residues arranged in a binding region that coordinates with an REE cation so as to form a PEPS-REE cation complex, and (ii) an REE cation, the REE cation of the complex coordinated with the binding region of the PEPS. Further provided is a method, comprising application of at least one of molecular dynamics, artificial intelligence, and a genetic algorithm to design a PEPS that comprises an LBT and preferentially binds one REE over at least one other REE.
    Type: Application
    Filed: August 11, 2023
    Publication date: July 11, 2024
    Inventors: Kathleen J. Stebe, Daeyeon Lee, Ravi Radhakrishnan, César de la Fuente-Nunez, Ivan Julian Dmochowski, E. James Petersson, Jason G. Marmorstein, Stephen Crane, Eshe Jael Hummingbird, Yiming Wang, Elizabeth J. Biddinger, Charles Maldarelli, Robert J. Messinger, Raymond S. Tu, Luis Ortuno Macias, Surabh S. KT, Mark L. Schlossman, Bikash Sapkota, Pan Sun, Monica Olvera de la Cruz, Felipe Jiménez-Ángeles, Baofu Qiao
  • Patent number: 10806054
    Abstract: An electronic subassembly includes an enclosure, a circuit board, a plurality of electronic components, and a plurality of flexible elastic thermal elements. Each flexible elastic thermal bridge is disposed in the gap between a different one of the electronic components and a first wall of the enclosure. Each flexible elastic thermal bridge includes a first thermally conductive metallic structure, a second thermally conductive metal structure, and an elastically deflectable thermal element. The first thermally conductive metallic structure contacts the first wall. The second thermally conductive metallic structure contacts the top surface of the electronic component and is spaced apart from the first thermally conductive metallic structure to define a void. The elastically deflectable thermal element is disposed in the void and directly contacts both the first thermally conductive metallic structure and the second thermally conductive metallic structure.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: October 13, 2020
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Saravanakumar Mahalingam, NSV Sarveswara Sarma A, D Chandra Mohan Vyas, Ravi Radhakrishnan, Mathews Kuriakose