Patents by Inventor Ravichandra V. Palaparthi

Ravichandra V. Palaparthi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing pad and methods of making and using same
    Patent number: 8535119
    Abstract: A method of making shape memory chemical mechanical polishing pads is provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided is a method for using the shape memory chemical mechanical polishing pads to polish substrates.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: September 17, 2013
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Ravichandra V Palaparthi, Richard D Hreha, Benjamin John Vining
  • Chemical Mechanical Polishing Pad and Methods of Making and Using Same
    Publication number: 20120252324
    Abstract: A method of making shape memory chemical mechanical polishing pads is provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided is a method for using the shape memory chemical mechanical polishing pads to polish substrates.
    Type: Application
    Filed: June 12, 2012
    Publication date: October 4, 2012
    Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Richard D. Hreha, Ravichandra V. Palaparthi, Benjamin John Vining
  • Chemical mechanical polishing method
    Patent number: 8257142
    Abstract: Shape memory chemical mechanical polishing methods are provided that use shape memory chemical mechanical polishing pads having a polishing layer in a densified state, wherein the polishing pad thickness and/or groove depth is monitored and the polishing layer is selectively exposed to an activating stimulus causing a transition from the densified state to a recovered state.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: September 4, 2012
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Gregory P. Muldowney, Ravichandra V. Palaparthi
  • Chemical mechanical polishing pad and methods of making and using same
    Patent number: 8221196
    Abstract: Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods of making the shape memory chemical mechanical polishing pads and for using them to polish substrates.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: July 17, 2012
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Richard D. Hreha, Ravichandra V. Palaparthi, Benjamin John Vining
  • Chemical Mechanical Polishing Method
    Publication number: 20090258573
    Abstract: Shape memory chemical mechanical polishing methods are provided that use shape memory chemical mechanical polishing pads having a polishing layer in a densified state, wherein the polishing pad thickness and/or groove depth is monitored and the polishing layer is selectively exposed to an activating stimulus causing a transition from the densified state to a recovered state.
    Type: Application
    Filed: April 15, 2008
    Publication date: October 15, 2009
    Inventors: Gregory P. Muldowney, Ravichandra V. Palaparthi
  • Chemical Mechanical Polishing Pad and Methods of Making and Using Same
    Publication number: 20090258575
    Abstract: Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods of making the shape memory chemical mechanical polishing pads and for using them to polish substrates.
    Type: Application
    Filed: April 15, 2008
    Publication date: October 15, 2009
    Inventors: Richard D Hreha, Ravichandra V. Palaparthi, Benjamin John Vining
  • Chemical mechanical polishing pad with controlled wetting
    Patent number: 7530887
    Abstract: Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising a polishing texture that exhibits a dimensionless roughness, R, is between 0.01 and 0.75. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates.
    Type: Grant
    Filed: August 16, 2007
    Date of Patent: May 12, 2009
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Bo Jiang, Gregory P. Muldowney, Ravichandra V. Palaparthi
  • Chemical mechanical polishing pad with controlled wetting
    Publication number: 20090047876
    Abstract: Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising a polishing texture that exhibits a dimensionless roughness, R, is between 0.01 and 0.75. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates.
    Type: Application
    Filed: August 16, 2007
    Publication date: February 19, 2009
    Inventors: Bo Jiang, Gregory P. Muldowney, Ravichandra V. Palaparthi
  • Chemical mechanical polishing pad and methods of making and using same
    Patent number: 7458885
    Abstract: Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods of making the shape memory chemical mechanical polishing pads and for using them to polish substrates.
    Type: Grant
    Filed: August 15, 2007
    Date of Patent: December 2, 2008
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventor: Ravichandra V. Palaparthi
  • Polishing pad with oscillating path groove network
    Patent number: 7270595
    Abstract: A polishing pad (20) for polishing a wafer (32) or other article, the pad having a groove network (60) configured to increase the residence time polishing medium (46) on the pad. The groove network has a first portion (72) that may extend substantially radially outwardly and an oscillating portion (74) that begins at a transition point (76) and is configured to slow the radially outward flow of the polishing medium.
    Type: Grant
    Filed: May 27, 2004
    Date of Patent: September 18, 2007
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Carolina L. Elmufdi, Ravichandra V. Palaparthi
  • Polishing pad with flow modifying groove network
    Patent number: 7156721
    Abstract: A polishing pad (20) for polishing a wafer (32) or other article, the pad having a groove network (60) configured to vary the residence time across the wafer track of the reaction products formed by the interaction of reactants in the polishing medium (46) with structure on the wafer. The groove network has a first portion (72) that may extend substantially radially outward and a second portion (74) that is configured to vary the speed of the radially outward flow of the polishing medium.
    Type: Grant
    Filed: June 7, 2005
    Date of Patent: January 2, 2007
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventor: Ravichandra V. Palaparthi
  • Polishing pad with flow modifying groove network
    Patent number: 6958002
    Abstract: A polishing pad (20) for polishing a wafer (32) or other article, the pad having a groove network (60) configured to vary the residence time across the wafer track of the reaction products formed by the interaction of reactants in the polishing medium (46) with structure on the wafer. The groove network has a first portion (72) that may extend substantially radially outward and a second portion (74) that is configured to vary the speed of the radially outward flow of the polishing medium.
    Type: Grant
    Filed: July 19, 2004
    Date of Patent: October 25, 2005
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventor: Ravichandra V. Palaparthi