Patents by Inventor Ravin Krishnan

Ravin Krishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microwave induced plasma decapsulation using a dielectric plasma discharge tube
    Patent number: 9548227
    Abstract: A microwave induced plasma decapsulation system and method for decapsulation a packaged semiconductor device applies a microwave induced plasma effluent along with etchant gases electrons, ions and free radicals that are chemically reactive to remove the epoxy molding compound encapsulating the semiconductor device. In one embodiment, the decapsulation system utilizes a microwave generator and a coaxial plasma source. In another embodiment, the decapsulation system utilizes a microwave generator, an electromagnetic surface wave plasma source, and a dielectric plasma discharge tube.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: January 17, 2017
    Assignee: Nisene Technology Group
    Inventors: Alan M. Wagner, Ravin Krishnan
  • MICROWAVE INDUCED PLASMA DECAPSULATION
    Publication number: 20150118855
    Abstract: A microwave induced plasma decapsulation system and method for decapsulation a packaged semiconductor device applies a microwave induced plasma effluent along with etchant gases electrons, ions and free radicals that are chemically reactive to remove the epoxy molding compound encapsulating the semiconductor device. In one embodiment, the decapsulation system utilizes a microwave generator and a coaxial plasma source. In another embodiment, the decapsulation system utilizes a microwave generator, an electromagnetic surface wave plasma source, and a dielectric plasma discharge tube.
    Type: Application
    Filed: October 15, 2014
    Publication date: April 30, 2015
    Inventors: Alan M. Wagner, Ravin Krishnan
  • MICROWAVE INDUCED PLASMA DECAPSULATION USING A DIELECTRIC PLASMA DISCHARGE TUBE
    Publication number: 20150118856
    Abstract: A microwave induced plasma decapsulation system and method for decapsulation a packaged semiconductor device applies a microwave induced plasma effluent along with etchant gases electrons, ions and free radicals that are chemically reactive to remove the epoxy molding compound encapsulating the semiconductor device. In one embodiment, the decapsulation system utilizes a microwave generator and a coaxial plasma source. In another embodiment, the decapsulation system utilizes a microwave generator, an electromagnetic surface wave plasma source, and a dielectric plasma discharge tube.
    Type: Application
    Filed: October 15, 2014
    Publication date: April 30, 2015
    Inventors: Alan M. Wagner, Ravin Krishnan