Abstract: An integrated circuit incorporates flip chip and wire bonding techniques to provide an improved integrated circuit device. The integrated circuit device includes a package having a first plurality of bonding pads and a semiconductor substrate within the integrated circuit package and including a second plurality of bonding pads. A semiconductor substrate has a surface area. A plurality of wire bonds connect the first plurality of bonding pads to the second plurality of bonding pads. The device further includes an interconnection substrate mounted on the semiconductor substrate. The interconnection substrate has a surface area smaller than the semiconductor substrate surface area.

Abstract: An integrated circuit including a copper interconnection layer includes an aluminum distribution layer overlying the copper interconnection layer to distribute external electrical signals such as power, ground, and clock signals throughout the die of the device. The distribution layer overlies the copper interconnection layer in a grid pattern which connects to the copper interconnection layer through a plurality of vias. The distribution layer further includes a plurality of wire bond pads to permit wire bonding between the distribution layer and bonding pads of the integrated circuit package.

Abstract: An optical port with directional control. The port includes a transmitter, receiver, and first actuator. The transmitter generates an outgoing light signal that propagates in a transmission direction in response to an outgoing electrical signal. The receiver receives an incoming light signal and generating an incoming electrical signal therefrom, the receiver having a reception direction aligned with the transmission direction. The first actuator alters the transmission direction of the outgoing light signal in response to a first control signal. In one embodiment, the first actuator determines the direction of the outgoing light signal in a first plane, and a second actuator controls the direction of the outgoing light signal by an amount determined by a second control signal. The second actuator controls the direction of the outgoing light signal in a second plane that is orthogonal to the first plane.

Abstract: An interconnection arrangement and technique for a single semiconductor chip containing incomplete electric circuitry and having electric surface terminations permitting said incomplete electric circuitry to be externally interconnected, the interconnection arrangement being mountable on the semiconductor chip and capable of electically communicating with the semiconductor chip through electric surface terminations on the top surface of the semiconductor chip and on the bottom surface of the interconnection arrangement.