Abstract: An integrated circuit including a copper interconnection layer includes an aluminum distribution layer overlying the copper interconnection layer to distribute external electrical signals such as power, ground, and clock signals throughout the die of the device. The distribution layer overlies the copper interconnection layer in a grid pattern which connects to the copper interconnection layer through a plurality of vias. The distribution layer further includes a plurality of wire bond pads to permit wire bonding between the distribution layer and bonding pads of the integrated circuit package.

Abstract: An integrated circuit incorporates flip chip and wire bonding techniques to provide an improved integrated circuit device. The integrated circuit device includes a package having a first plurality of bonding pads and a semiconductor substrate within the integrated circuit package and including a second plurality of bonding pads. A semiconductor substrate has a surface area. A plurality of wire bonds connect the first plurality of bonding pads to the second plurality of bonding pads. The device further includes an interconnection substrate mounted on the semiconductor substrate. The interconnection substrate has a surface area smaller than the semiconductor substrate surface area.

Abstract: An electronic packaging module in which the inactive sides of integrated circuit chips are held in compression against a heat spreader by an elastomer pressed thereagainst by a multilayer flexible printed circuit board. A TAB frame, which may be demountable, interconnects integrated circuit chips to a multilayer flexible printed circuit board. A backing plate is fastened to a heat spreader so that it presses against the multilayer flexible printed circuit board. Contacts are compressed against the motherboard to interconnect the multilayer flexible printed circuit board thereto. Coaxial power connectors provide power and ground connections between non-peripheral portions of the multilayer flexible printed circuit board and the motherboard.