Patents by Inventor Ravindra M. Bhatkal
Ravindra M. Bhatkal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12084583Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.Type: GrantFiled: November 12, 2021Date of Patent: September 10, 2024Assignee: Alpha Assembly Solutions Inc.Inventors: Narahari Pujari, Jayaprakash Sundaramurthy, Siuli Sarkar, Ravindra M. Bhatkal
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Patent number: 11411150Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.Type: GrantFiled: January 25, 2019Date of Patent: August 9, 2022Assignee: Alpha Assembly Solutions Inc.Inventors: Morgana de Avila Ribas, Pritha Choudhury, Siuli Sarkar, Ranjit Pandher, Nicholas G Herrick, Amit Patel, Ravindra M Bhatkal, Bawa Singh
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Publication number: 20220064466Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuity and devices.Type: ApplicationFiled: November 12, 2021Publication date: March 3, 2022Applicant: Alpha Assembly Solutions Inc.Inventors: Narahari PUJARI, Jayaprakash SUNDARAMURTHY, Siuli SARKAR, Ravindra M. BHATKAL
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Patent number: 11193031Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.Type: GrantFiled: May 14, 2018Date of Patent: December 7, 2021Assignee: Alpha Assembly Solutions Inc.Inventors: Narahari Pujari, Jayaprakash Sundaramurthy, Siuli Sarkar, Ravindra M. Bhatkal
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Publication number: 20200190347Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.Type: ApplicationFiled: May 14, 2018Publication date: June 18, 2020Inventors: Narahari PUJARI, Jayaprakash SUNDARAMURTHY, Siuli SARKAR, Ravindra M. BHATKAL
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Publication number: 20190157535Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.Type: ApplicationFiled: January 25, 2019Publication date: May 23, 2019Inventors: Morgana de Avila Ribas, Pritha Choudhury, Siuli Sarkar, Ranjit Pandher, Nicholas G. Herrick, Amit Patel, Ravindra M. Bhatkal, Bawa Singh
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Publication number: 20180102464Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.Type: ApplicationFiled: October 6, 2016Publication date: April 12, 2018Inventors: Morgana de Avila Ribas, Pritha Choudhury, Siuli Sarkar, Ranjit Pandher, Nicholas G. Herrick, Amit Patel, Ravindra M Bhatkal, Bawa Singh
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Publication number: 20140199115Abstract: A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.Type: ApplicationFiled: August 2, 2012Publication date: July 17, 2014Applicant: ALPHA METALS, INC.Inventors: Morgana de Avila Ribas, Dominic Lodge, Ranjit Pandher, Bawa Singh, Ravindra M. Bhatkal, Rahul Raut, Siuli Sarkar, Kamanio Chattopadhyay, Proloy Nandi
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Patent number: 7749883Abstract: A method for providing metallization upon a semiconductor substrate utilizing a stencil having at least one aperture extending from the contact side to the fill side, the contact side of the stencil being substantially flat and forming a sharp edge with a wall of the at least one aperture, the at least one aperture being tapered such that an area of a cross-section of the at least one aperture at the fill side is larger than an area of the cross-section of the at least one aperture at the contact side. A method of forming a stencil for depositing metallization lines on a semiconductor substrate is also disclosed.Type: GrantFiled: August 29, 2008Date of Patent: July 6, 2010Assignee: Fry's Metals, Inc.Inventors: Thomas Meeus, Hans Korsse, Ravindra M. Bhatkal
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Publication number: 20090081823Abstract: A method for providing metallization upon a semiconductor substrate utilizing a stencil having at least one aperture extending from the contact side to the fill side, the contact side of the stencil being substantially flat and forming a sharp edge with a wall of the at least one aperture, the at least one aperture being tapered such that an area of a cross-section of the at least one aperture at the fill side is larger than an area of the cross-section of the at least one aperture at the contact side. A method of forming a stencil for depositing metallization lines on a semiconductor substrate is also disclosed.Type: ApplicationFiled: August 29, 2008Publication date: March 26, 2009Applicant: FRY'S METALS, INC.Inventors: Thomas Meeus, Hans Korsse, Ravindra M. Bhatkal