Patents by Inventor Ravindra Mohan Bhatkal

Ravindra Mohan Bhatkal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sintering materials and attachment methods using same
    Patent number: 11389865
    Abstract: Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: July 19, 2022
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Shamik Ghoshal, V. Sathish Kumar, Pavan Vishwanath, Ranjit S. Pandher, Remya Chandran, Sutapa Mukherjee, Siuli Sarkar, Bawa Singh, Ravindra Mohan Bhatkal
  • Sintering Materials and Attachment Methods Using Same
    Publication number: 20170144221
    Abstract: Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
    Type: Application
    Filed: June 12, 2015
    Publication date: May 25, 2017
    Inventors: Shamik GHOSHAL, V. Sathish KUMAR, Pavan VISHWANATH, Ranjit S. PANDHER, Remya CHANDRAN, Sutapa MUKHERJEE, Siuli SARKAR, Bawa SINGH, Ravindra Mohan BHATKAL
  • STENCIL PRINTING FRAME
    Publication number: 20120227597
    Abstract: The present invention provides a stencil printing frame comprising a border member (5) and a foil sheet (65) attached thereto, wherein the border member (5) is formed as a single piece having sides and corners that define the frame, the single piece having two ends interlocked to form a joint on one corner or side, and wherein at least one corner comprises abutting faces arranged to prevent relative movement of the faces. The invention further provides a method for forming the frame and for uses of the frame once formed.
    Type: Application
    Filed: August 27, 2010
    Publication date: September 13, 2012
    Applicant: ALPHA FRY LIMITED
    Inventors: Tom Clara Louis Meeus, Paul Wilem Godijn, Ravindra Mohan Bhatkal