Abstract: The present disclosure is directed to an electronic assembly and method of forming thereof. The electronic assembly may include a package substrate with a top substrate surface and an interposer coupled to the package substrate at the top substrate surface. The interposer may include a plurality of through interposer vias and an opening extending through the interposer. A power module may be arranged in the opening in the interposer and coupled to the package substrate at the top substrate surface. The power module may include a plurality of interconnects including a first interconnect coupled to a first voltage and a second interconnect coupled to a second voltage.

Abstract: A stream of binary data is converted into a stream of symbols according to a three-phase encoding scheme and send the symbols on a physical link. The link includes one or more lanes, each lane including a set of three conductors. The set of three conductors are to be oriented so that each conductor in the set is equidistant from the other two conductors in the set.