Abstract: A photovoltaic solar panel includes a front glass, a back glass, and a photovoltaic (PV) power generating layer encapsulated between the front glass and the back glass. The PV power generating layer is configured to convert ambient electromagnetic energy, received through the front glass, to a direct current (DC) power output. The PV solar panel also includes at least one component, disposed behind the PV power generating layer, selected from the group consisting of: a direct current to alternating current (DC-AC) inverter configured to convert the DC power output from the PV power generator to an alternating current (AC) power output, a battery, and an antenna.

Abstract: This disclosure provides systems, methods, and apparatus for high capacitance density metal-insulator-metal capacitors. In one aspect, an apparatus may include a first base metal layer on a first side of a substrate. A first polymer layer may be disposed on the first base metal layer and on the first side of the substrate. The first polymer layer may define a first plurality of vias though the first polymer layer, the first plurality of vias exposing portions of the first base metal layer. A first electrode layer may be disposed on the first polymer layer. The first electrode layer may contact the portions of the first base metal layer. A first dielectric layer may be disposed on the first electrode layer. A second electrode layer may be disposed on the first dielectric layer. The first dielectric layer may electrically isolate the first electrode layer from the second electrode layer.

Abstract: This disclosure provides systems, methods and apparatus for interposers in compact three-dimensional (3-D) device packages. In one aspect, one or more methods of fabricating an interposer using an additive process are provided. The additive process can involve depositing flowable dielectric material around a plurality of metal interconnect posts after forming the plurality of metal interconnect posts on a carrier substrate. In another aspect, an interposer including through-glass vias and one or more passive devices is provided.

Abstract: This disclosure provides systems, methods and apparatus for glass electromechanical systems (EMS) electrostatic devices. In one aspect, a glass EMS electrostatic device includes sidewall electrodes. Structural components of a glass EMS electrostatic device such as stationary support structures, movable masses, coupling flexures, and sidewall electrode supports, can be formed from a single glass body. The glass body can be a photochemically etched. In some implementations, pairs of sidewall electrodes can be arranged in interdigitated comb or parallel plate configurations and can include plated metal layers and narrow capacitive gap spacing.

Abstract: This disclosure provides systems, methods and apparatus for providing packaged microelectromechanical systems (MEMS) devices. In one aspect, package can include a cover glass joined to a device substrate, the cover glass including integrated electrical connectivity and configured to encapsulate one or more MEMS devices on the device substrate. The cover glass can include one or more spin-on glass layers and electrically conductive routing and interconnects. The package can include a narrow seal surrounding the one or more encapsulated MEMS devices.

Abstract: This disclosure provides systems, methods and apparatus for batch fabrication of a rechargeable lithium-ion battery using a silicon substrate as an anode. In one aspect, a pre-formed silicon substrate is provided. A plurality of first openings can be formed on one side of the substrate, which can have a high height to width aspect ratio. A plurality of second openings can be formed alternatingly, or in interdigitated fashion, with the first openings on another side of the substrate that is opposite the first side. A solid electrolyte layer can be deposited on the second side of the substrate in the second openings, and a cathode material can be formed into the second openings and over the electrolyte layer on the second side of the substrate.

Abstract: This disclosure provides systems, methods and apparatus for microspeaker devices. In one aspect, a microspeaker element may include a deformable dielectric membrane that spans a speaker cavity. The deformable dielectric membrane can include a piezoactuator and a dielectric layer. Upon application of a driving signal to the piezoactuator, the dielectric layer can deflect, producing sound. In some implementations, an array of microspeaker elements can be encapsulated between a glass substrate and a cover glass. Sound generated by the microspeaker elements can be emitted through a speaker grill formed in the cover glass.

Abstract: This disclosure provides systems, methods and apparatus for glass-encapsulated pressure sensors. In one aspect, a glass-encapsulated pressure sensor may include a glass substrate, an electromechanical pressure sensor, an integrated circuit device, and a cover glass. The cover glass may be bonded to the glass substrate with an adhesive, such as epoxy, glass frit, or a metal bond ring. The cover glass may have any of a number of configurations. In some configurations, the cover glass may partially define a port for the electromechanical pressure sensor at an edge of the glass-encapsulated pressure sensor. In some configurations, the cover glass may form a cavity to accommodate the integrated circuit device that is separate from a cavity that accommodates the electromechanical pressure sensor.

Abstract: This disclosure provides systems, methods and apparatus for fabricating encapsulated devices, including electromechanical systems devices. In one aspect, a cover plate including one or more encapsulation lids releasably attached to a carrier substrate is provided. The one or more encapsulation lids can be joined to a device substrate to encapsulate one or more devices on the device substrate in a batch process. After joining, the encapsulation lids are released from the carrier substrate resulting in the formation of encapsulated devices on the device substrate. In another aspect, encapsulated devices are provided.

Abstract: This disclosure provides systems, methods and apparatus for manufacturing display devices having electronic components mounted within a display device package. In one aspect, the electronic component connects to the exterior of the display device through pads that run below a seal that holds a substrate and a backplate of the display device together. In another aspect the electronic components also connect to an electromechanical device within the display device, as well as connecting to pads that are external to the display device.

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, fabricating a glass package includes joining a cover glass panel to a glass substrate panel, and singulating the joined panels to form individual glass packages, each including one or more encapsulated devices and one or more signal transmission pathways. In another aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass.

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.

Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass, one or more devices encapsulated between the glass substrate and the cover glass, and bond pads configured to attach to a flexible connector and in electrical communication with an encapsulated device. In some implementations, a flexible connector may be used to electrically connect a device within the glass package to an electrical component, such as an integrated circuit (IC) device or PCB, outside the glass package.

Abstract: This disclosure provides systems, methods and apparatus for bonding a device substrate formed of a substantially transparent material to a carrier substrate. A laser etch stop layer may be formed on the device substrate. The carrier substrate may be coated with a releasable layer, such as a polymer layer. Vias may be formed in the device substrate by laser drilling. The vias may be filled with conductive material, e.g., by electroplating or by filling the vias with a conductive paste. One or more types of devices may then be attached to the device substrate and configured for electrical communication with the vias. In some implementations, passive devices may be formed on the device substrate before the vias are formed. Before or after device fabrication, the substrates may be separated. The substrates may be separated by laser irradiation or chemical dissolution of the releasable layer.

Abstract: This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper flexible substrate has patterned conductive material on an extended portion to allow routing of signal lines, electrical ground, and power. One or more integrated circuits or passive components, which may include connecting sockets, may be mounted onto the flexible layer to reduce cost and complexity. Such implementations may eliminate a flex cable and may allow a bezel-less configuration.

Abstract: This disclosure provides systems, methods and apparatus for combining devices deposited on a first substrate, with integrated circuits formed on a second substrate such as a semiconducting substrate or a glass substrate. The first substrate may be a glass substrate. The first substrate may include conductive vias. A power combiner circuit may be deposited on a first side of the first substrate. The power combiner circuit may include passive devices deposited on at least the first side of the first substrate. The integrated circuit may include a power amplifier circuit disposed on and configured for electrical connection with the power combiner circuit, to form a power amplification system. The conductive vias may include thermal vias configured for conducting heat from the power amplification system and/or interconnect vias configured for electrical connection between the power amplification system and a conductor on a second side of the first substrate.

Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.

Abstract: A halide based stress reducing agent is added to the bath of a rhodium plating solution. The stress reducing agent reduces stress in the plated rhodium, increasing the thickness of the rhodium that can be plated without cracking. In addition, the stress reducing agent does not appreciably decrease the wear resistance or hardness of the plated rhodium.

Abstract: A halide based stress reducing agent is added to the bath of a rhodium plating solution. The stress reducing agent reduces stress in the plated rhodium, increasing the thickness of the rhodium that can be plated without cracking. In addition, the stress reducing agent does not appreciably decrease the wear resistance or hardness of the plated rhodium.

Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.