Abstract: A microwave device includes a circuit element and a chromium layer disposed over the circuit element. The circuit element may have an electrolytically plated gold surface. The microwave device further includes a bump disposed over the circuit element. The bump may include silver, while the chromium layer may include a portion extending from the bump to form a solder dam. A native oxide forms on the portion of the chromium layer to inhibit solder contamination and/or silver migration. The native oxide may also act as an adhesion agent for a subsequently deposited dielectric passivation layer.