Abstract: Various embodiments of systems and methods allow a tool inventory device and associated system. A user can retrieve and return tools and such interactions can be monitored by the system. The inventory device can be an add-on to a standalone tool cabinet and can provide this extra functionality. The inventory device can have a camera looking at the drawers and can use computer vision to determine when tools are retrieved and/or replaced.

Abstract: The present invention is directed to a method of forming a molded core component. A mat formed from cellulosic fiber and resin is provided. The mat is consolidated in a first press until the resin is substantially fully cured, and then removed from the first press. The consolidated mat is then placed in a second press having a mold cavity shaped to form at least one depression in at least one of the major surfaces. The consolidated mat is reformed in the second press to form a molded core component having at least one depression in at least one of the major surfaces. The molded core component has a variable density, preferably of between about 10 lbs/ft3 and 80 lbs/ft3.

Abstract: A method, system, and computer usable program product for adjusting processor utilization data in polling environments are provided in the illustrative embodiments. An amount of a computing resource consumed during polling performed by the polling application over a predetermined period is received at a processor in a data processing system from a polling application executing in the data processing system. The amount forms a polling amount of the computing resource. Using the polling amount of the computing resource, another amount of the computing resource consumed for performing meaningful task is determined. The other amount forms a work amount of the computing resource. Using the work amount of the computing resource, an adjusted utilization of the computing resource is computed over a utilization interval. The data of the adjusted utilization is saved.

Abstract: The present invention is directed to a method of forming a molded core component. A mat formed from cellulosic fiber and resin is provided. The mat is consolidated in a first press until the resin is substantially fully cured, and then removed from the first press. The consolidated mat is then placed in a second press having a mold cavity shaped to form at least one depression in at least one of the major surfaces. The consolidated mat is reformed in the second press to form a molded core component having at least one depression in at least one of the major surfaces. The molded core component has a variable density, preferably of between about 10 lbs/ft3 and 80 lbs/ft3.

Abstract: A drug therapy elution system and method for treating blood vessels. The system includes an enclosed receptacle containing the drug therapy for treating the damaged blood vessel. The system also includes one or more conduits that permit elution of the drug therapy from the enclosed receptacle into the damaged blood vessel wall. The system also includes one or more fixation mechanisms that can secure the enclosed receptacle to the blood vessel wall.

Abstract: The present invention is directed to a method of forming a molded core component. A mat formed from cellulosic fiber and resin is provided. The mat is consolidated in a first press until the resin is substantially fully cured, and then removed from the first press. The consolidated mat is then placed in a second press having a mold cavity shaped to form at least one depression in at least one of the major surfaces. The consolidated mat is reformed in the second press to form a molded core component having at least one depression in at least one of the major surfaces. The molded core component has a variable density, preferably of between about 10 lbs/ft3 and 80 lbs/ft3.

Abstract: The present invention is directed to a method of forming a molded core component. A mat formed from cellulosic fiber and resin is provided. The mat is consolidated in a first press until the resin is substantially fully cured, and then removed from the first press. The consolidated mat is then placed in a second press having a mold cavity shaped to form at least one depression in at least one of the major surfaces. The consolidated mat is reformed in the second press to form a molded core component having at least one depression in at least one of the major surfaces. The molded core component has a variable density, preferably of between about 10 lbs/ft3 and 80 lbs/ft3.

Abstract: A method for manufacturing a turbine nozzle assembly using a fixture includes providing a first position of the fixture, positioning at least one datum of the turbine nozzle assembly adjacent at least one datum location point on the fixture when the fixture is in the first position, coupling the turbine nozzle assembly to the fixture when the fixture is in the first position, rotating the fixture from the first position into a second position that facilitates manufacturing the turbine nozzle assembly, and performing a manufacturing process on the turbine nozzle assembly when the fixture is in the second position.

Abstract: A method, system, and computer usable program product for adjusting processor utilization data in polling environments are provided in the illustrative embodiments. An amount of a computing resource consumed during polling performed by the polling application over a predetermined period is received at a processor in a data processing system from a polling application executing in the data processing system. The amount forms a polling amount of the computing resource. Using the polling amount of the computing resource, another amount of the computing resource consumed for performing meaningful task is determined. The other amount forms a work amount of the computing resource. Using the work amount of the computing resource, an adjusted utilization of the computing resource is computed over a utilization interval. The data of the adjusted utilization is saved.

Abstract: The present invention is directed to a method of forming a molded core component. A mat formed from cellulosic fiber and resin is provided. The mat is consolidated in a first press until the resin is substantially fully cured, and then removed from the first press. The consolidated mat is then placed in a second press having a mold cavity shaped to form at least one depression in at least one of the major surfaces. The consolidated mat is reformed in the second press to form a molded core component having at least one depression in at least one of the major surfaces. The molded core component has a variable density, preferably of between about 10 lbs/ft3 and 80 lbs/ft3.

Abstract: The present invention is directed to a method of forming a molded core component. A mat formed from cellulosic fiber and resin is provided. The mat is consolidated in a first press until the resin is substantially fully cured, and then removed from the first press. The consolidated mat is then placed in a second press having a mold cavity shaped to form at least one depression in at least one of the major surfaces. The consolidated mat is reformed in the second press to form a molded core component having at least one depression in at least one of the major surfaces. The molded core component has a variable density, preferably of between about 10 lbs/ft3 and 80 lbs/ft3.

Abstract: A dry etch process is described for selectively etching silicon nitride from conductive oxide material for use in a semiconductor fabrication process. Adding an oxidant in the etch gas mixture could increase the etch rate for the silicon nitride while reducing the etch rate for the conductive oxide, resulting in improving etch selectivity. The disclosed selective etch process is well suited for ferroelectric memory device fabrication using conductive oxide/ferroelectric interface having silicon nitride as the encapsulated material for the ferroelectric.

Abstract: A dry etch process is described for selectively etching silicon nitride from conductive oxide material for use in a semiconductor fabrication process. Adding an oxidant in the etch gas mixture could increase the etch rate for the silicon nitride while reducing the etch rate for the conductive oxide, resulting in improving etch selectivity. The disclosed selective etch process is well suited for ferroelectric memory device fabrication using conductive oxide/ferroelectric interface having silicon nitride as the encapsulated material for the ferroelectric.

Abstract: A core component is molded to include surface depressions to compensate for varying widths and depths of the shell or framing of a building or structural member. The component includes two major surfaces defining respective front and rear sides of the component, and the rear side of the component is preferably the mirror image of the front side. The core component is preferably pre-formed and the surface layers are wetted to contain at least 2%, preferably about 4% to 20%, more moisture than at the thickness center of the mat to provide surfaces capable of adhesive coating for adherence to surrounding structural members, preferably two prefabricated molded doorskins. The core component is preferably made from a composite soft board material.

Abstract: A method of low-temperature oxidation of a silicon substrate includes placing a silicon wafer in a vacuum chamber; maintaining the silicon wafer at a temperature of between about room temperature and 400° C.; introducing an oxidation gas in the vacuum chamber; dissociating the oxidation gas into O(1D) radical oxygen and irradiating the surface of the silicon wafer with a xenon excimer lamp generating light at a wavelength of about 172 nm to eject electrons from the surface of the silicon wafer and forming the reactive oxidizing species over the silicon wafer; and forming an oxide layer on at least a portion of the silicon wafer.

Abstract: A core component is molded to include surface depressions to compensate for varying widths and depths of the shell or framing of a building or structural member. The component includes two major surfaces defining respective front and rear sides of the component, and the rear side of the component is preferably the mirror image of the front side. The core component is preferably pre-formed and the surface layers are wetted to contain at least 2%, preferably about 4% to 20%, more moisture than at the thickness center of the mat to provide surfaces capable of adhesive coating for adherence to surrounding structural members, preferably two prefabricated molded doorskins. The core component is preferably made from a composite soft board material.

Abstract: According to the present invention a technique for providing a planarized substrate with dendritic connections of solder balls, especially a multi-layer ceramic substrate is provided. In the case where the substrate has a raised central portion on the top surface on which are disposed top surface metallurgy pads, a layer of conformable photoimagable material is placed over the top surface.The photoimagable material is exposed and developed in a pattern corresponding to the pattern of the top surface metallurgy pads to form vias in the photoimagable material. Copper is plated in the vias in contact with the top surface metallurgy pads. The exposed surface of the photoimagable surface is then planarized, preferably by mechanical polishing to form a flat planar surface, with the ends of the vias exposed. Dendritic connector pads are then grown on the exposed ends of the vias to which solder ball connections of an I/C chip are releasably connected.

Abstract: According to the present invention a technique for providing a planarized substrate with dendritic connections of solder balls, especially a multi-layer ceramic substrate is provided. In the case where the substrate has a raised central portion on the top surface on which are disposed top surface metallurgy pads, a layer of conformable photoimagable material is placed over the top surface.The photoimagable material is exposed and developed in a pattern corresponding to the pattern of the top surface metallurgy pads to form vias in the photoimagable material. Copper is plated in the vias in contact with the top surface metallurgy pads. The exposed surface of the photoimagable surface is then planarized, preferably by mechanical polishing to form a flat planar surface, with the ends of the vias exposed. Dendritic connector pads are then grown on the exposed ends of the vias to which solder ball connections of an I/C chip are releasably connected.

Abstract: A method and apparatus for testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O contacts. The apparatus is provided with an interposer that has contacts corresponding to the contacts on the semiconductor chip. Both the chip and the interposer contacts can be any known type including metal ball, bumps, or tabs or may be provided with dendritic surfaces. The chip contacts are first brought into relative loose temporary contact with the contacts on the interposer and then a compressive force greater that 5 grams per chip contact is applied to the chip to force the chip contacts into good electrical contact with the interposer contacts. Testing of the chip is then performed. The tests may include heating of the chip as well as the application of signals to the chip contacts. After testing the chip is removed from the substrate.

Abstract: A method and apparatus for testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O contacts. The apparatus is provided with an interposer that has contacts corresponding to the contacts on the semiconductor chip. Both the chip and the interposer contacts can be any known type including metal ball, bumps, or tabs or may be provided with dendritic surfaces. The chip contacts are first brought into relative loose temporary contact with the contacts on the interposer and then a compressive force greater that 5 grams per chip contact is applied to the chip to force the chip contacts into good electrical contact with the interposer contacts. Testing of the chip is then performed. The tests may include heating of the chip as well as the application of signals to the chip contacts. After testing the chip is removed from the substrate.