Patents by Inventor Ray Auyeung

Ray Auyeung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LASER-BASED TECHNIQUE FOR THE FABRICATION OF EMBEDDED ELECTROCHEMICAL CELLS AND ELECTRONIC COMPONENTS
    Publication number: 20060197194
    Abstract: A method is provided for embedding electronic components including electrochemical cells within a circuit board substrate. The method includes micromachining the printed circuit board substrate to a selective depth to form a recess. A component is inserted into the recess and an electrical connection is established between the electrical component and a metallized pattern of the circuit board substrate using, e.g., laser direct-write.
    Type: Application
    Filed: November 22, 2005
    Publication date: September 7, 2006
    Applicant: The Government of the USA, as represented by the Secretary of the Navy Naval Research Laboratory
    Inventors: Craig Arnold, Alberto Pique, Ray Auyeung, Michael Nurnberger
  • Laser-based technique for producing and embedding electrochemical cells and electronic components directly into circuit board materials
    Patent number: 6986199
    Abstract: A method is provided for embedding electronic components including electrochemical cells within a circuit board substrate. The method includes micromachining the printed circuit board substrate to a selective depth to form a recess. A component is inserted into the recess and an electrical connection is established between the electrical component and a metallized pattern of the circuit board substrate using, e.g., laser direct-write.
    Type: Grant
    Filed: June 9, 2004
    Date of Patent: January 17, 2006
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Craig B. Arnold, Alberto Pique, Ray Auyeung, Michael Nurnberger
  • Laser-based technique for producing and embedding electrochemical cells and electronic components directly into circuit board materials
    Publication number: 20050006136
    Abstract: A method is provided for embedding electronic components including electrochemical cells within a circuit board substrate. The method includes micromachining the printed circuit board substrate to a selective depth to form a recess. A component is inserted into the recess and an electrical connection is established between the electrical component and a metallized pattern of the circuit board substrate using, e.g., laser direct-write.
    Type: Application
    Filed: June 9, 2004
    Publication date: January 13, 2005
    Inventors: Craig Arnold, Alberto Pique, Ray Auyeung, Michael Nurnberger