Patents by Inventor Ray D. Harrison

Ray D. Harrison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170095872
    Abstract: A solderability alignment tool for aligning conductive interface surfaces of an IC with predetermined interface surfaces on a test board. The solderability tool includes a platen having a support surface for supporting a test board and an IC displacement assembly including an elongate tubular member in selective fluid communication with a vacuum source for precisely locating an IC on said test board. The tool may also include a microscope positioned opposite the platen support surface for precisely observing the position and alignment of the IC on said test board.
    Type: Application
    Filed: October 1, 2015
    Publication date: April 6, 2017
    Inventors: Ray D. Harrison, Somsack Vang
  • Publication number: 20080157320
    Abstract: Semiconductor devices and methods for their assembly are described in which IC packages may be combined in novel configurations. A multi-package semiconductor device system and associated methods for its construction include a plurality of packaged semiconductor devices, each provided with at least one lateral electrical contact. The plurality of packaged semiconductor devices so provided are fixed in a coplanar configuration and have the adjacent lateral contacts coupled for operation in concert.
    Type: Application
    Filed: December 29, 2006
    Publication date: July 3, 2008
    Inventors: Ray D. Harrison, Jianbai Zhu, Jeffrey J. Wolfe, Frank Stepniak
  • Patent number: 6521479
    Abstract: The present invention provides a system and method for preparing semiconductor integrated circuits (“ICs”), particularly ball grid arrays (“BGAs”), quad flat packs (“QFPs”) and dual in line packages (“DIPs”) for failure analysis (“FA”) using a variety of techniques, including emission microscopy (“EM”) and externally induced voltage alteration (“XIVA”). This system and method requires precision thinning and polishing of the semiconductor IC device to expose the backside of the die and mounting of the semiconductor device on a secondary package assembly.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: February 18, 2003
    Assignee: Texas Instruments Incorporated
    Inventors: Ray D. Harrison, Jianbai Zhu, Kendall S. Wills, Willmar Subido
  • Patent number: 5924761
    Abstract: The invention adds a camping tent to pickup trucks by taking advantage of already-installed rigid pickup bed covers. Flexible tent material is adapted to be attached to the inside of a raised rigid cover, so that a tent is formed when the cover is lifted to its raised position above the bed of a pickup truck. The attachment is by means of a bracket installed on the underside of the cover. The tent is adapted to be quickly unfolded and attached to the tailgate and side panels of the truck with quick-release fastening means. Care is taken to prevent rain water from entering the shelter thus formed by folding the tent over the edge of the tailgate, attaching it to the side panels of the truck to form a water-tight interface, and providing rain flaps to deflect rain water over the fenders of the truck and away from the interior of the bed.
    Type: Grant
    Filed: June 6, 1997
    Date of Patent: July 20, 1999
    Inventor: Ray D. Harrison