Patents by Inventor Ray D. Rust

Ray D. Rust has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4915805
    Abstract: A hollow cathode type inverted cylindrical magnetron apparatus construction comprises two separate units each having a rectangular C shape cross section. The two C shaped units are positioned together to form a hollow rectangular parallelpiped like cavity and articles to be sputtered are passed through this cavity.Bolted construction of simple elements having simple geometry are used to produce a very inexpensive structure which is easily serviceable. This magnetron construction uses permanent magnets all having the same north south pole orientation located behind the target material and surrounded on three sides by magnetic permeable material to confine the magnetic flux path. Hence the lines of force tend to be parallel to the substrate surface of the article very near to that surface and heating of the substrate is minimized. Cooling is provided by coolant carrying tubes interspersed between the magnets and the target material.
    Type: Grant
    Filed: November 21, 1988
    Date of Patent: April 10, 1990
    Assignee: AT&T Bell Laboratories
    Inventor: Ray D. Rust
  • Patent number: 4820376
    Abstract: Disclosed is a method of fabricating conductive polymer interconnect (CPI) material which employs chains of electrically conductive particles within an elastomeric matrix. Contact resistance is improved by removing a thin layer is elastomeric material which remains after normal processing. The surface layer is removed by plasma etching so that the conductive particles protrude at both surfaces. The protruding particles can be plated to replace any conductive material removed by the etch.
    Type: Grant
    Filed: November 5, 1987
    Date of Patent: April 11, 1989
    Assignee: American Telephone and Telegraph Company AT&T Bell Laboratories
    Inventors: William R. Lambert, Neng-Hsing Lu, Ray D. Rust
  • Patent number: 4812217
    Abstract: A process and apparatus for cleaning then coating articles such as circuit board panels with a metallic coating encompasses an enclosed evacuated chamber having a controlled low pressure gaseous process environment. The articles to be cleaned, then coated with a metallic deposit are continuously fed into the enclosed chamber through an air lock mechanism that permits the evacuated chamber to remain at its predetermined pressure and gaseous composition. Included within the chamber are a plurality of transport paths or panel carrying tracks. The articles to be cleaned, then coated are continuously transported along the various tracks while being coated.The plurality of tracks are positioned to be substantially parallel with each other so that articles on each track follow paths similar in direction and substantially equidistant from one another. A plurality of bidirectional coating sources are sequentially positioned on both sides of each article transport track so that both sides of the panels are coated.
    Type: Grant
    Filed: April 27, 1987
    Date of Patent: March 14, 1989
    Assignee: American Telephone and Telegraph Company, AT&T Bell Laboratories
    Inventors: Carroll H. George, Ray D. Rust
  • Patent number: 4277321
    Abstract: Multilayer printed wiring boards are conventionally laminated using epoxy adhesives. When the boards are drilled, a residual smear often remains within the drilled holes. This smear prevents proper through plating of the holes and the layers are left without some of the intended interconnections. In the past, the residual smear was removed by wet etching. A technique is described using plasma etching with the conductive surface layers of the drilled boards as the electrodes to generate the plasma. The plasma forms directly within the holes and effectively removes the smear. A dielectric material in contact or close proximity to the perimeter of each board provides uniformity of treatment over the panels.
    Type: Grant
    Filed: January 17, 1980
    Date of Patent: July 7, 1981
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: Charles J. Bartlett, Ronald J. Rhodes, Ray D. Rust
  • Patent number: 4230553
    Abstract: Multilayer printed wiring boards are conventionally laminated using epoxy adhesives. When the boards are drilled, a residual smear often remains within the drilled holes. This smear prevents proper through plating of the holes and the layers are left without some of the intended interconnections. In the past, the residual smear was removed by wet etching. A technique is described using plasma etching with the conductive surface layers of the drilled boards as the electrodes to generate the plasma. The plasma forms directly within the holes and effectively removes the smear. A dielectric material in contact or close proximity to the perimeter of each board provides uniformity of treatment over the panels.
    Type: Grant
    Filed: April 23, 1979
    Date of Patent: October 28, 1980
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: Charles J. Bartlett, Ronald J. Rhodes, Ray D. Rust