Patents by Inventor Ray Fredric Solis de ASIS

Ray Fredric Solis de ASIS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plated walls defining mold compound cavities
    Patent number: 11942387
    Abstract: In examples, a semiconductor package comprises a wafer chip scale package (WCSP) having circuitry formed in a device side and an insulative layer above the device side. The WCSP includes one or more plated walls extending vertically to form a defined space, the one or more plated walls configured to prevent mold compound from flowing into the defined space. The WCSP includes mold compound abutting surfaces of the one or more plated walls opposing the defined space. The WCSP includes a conductive terminal coupled to the circuitry and extending from the WCSP into the defined space.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: March 26, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: John Carlo Cruz Molina, Julian Carlo Concepcion Barbadillo, Ray Fredric Solis De Asis
  • PLATED WALLS DEFINING MOLD COMPOUND CAVITIES
    Publication number: 20230095185
    Abstract: In examples, a semiconductor package comprises a wafer chip scale package (WCSP) having circuitry formed in a device side and an insulative layer above the device side. The WCSP includes one or more plated walls extending vertically to form a defined space, the one or more plated walls configured to prevent mold compound from flowing into the defined space. The WCSP includes mold compound abutting surfaces of the one or more plated walls opposing the defined space. The WCSP includes a conductive terminal coupled to the circuitry and extending from the WCSP into the defined space.
    Type: Application
    Filed: September 30, 2021
    Publication date: March 30, 2023
    Inventors: John Carlo Cruz MOLINA, Julian Carlo Concepcion BARBADILLO, Ray Fredric Solis DE ASIS
  • Textured bond pads
    Patent number: 11600583
    Abstract: In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: March 7, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rafael Jose Lizares Guevara, Aniceto Tabangcura Rabilas, Jr., Ray Fredric Solis de Asis, Sylvester Tigno Sanchez, Alvin Lopez Andaya
  • Textured Bond Pads
    Publication number: 20210320074
    Abstract: In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 14, 2021
    Inventors: Rafael Jose Lizares Guevara, Aniceto Tabangcura Rabilas, JR., Ray Fredric Solis de Asis, Sylvester Tigno Sanchez, Alvin Lopez Andaya
  • Textured bond pads
    Patent number: 11081456
    Abstract: In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: August 3, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rafael Jose Lizares Guevara, Aniceto Tabangcura Rabilas, Jr., Ray Fredric Solis de Asis, Sylvester Tigno Sanchez, Alvin Lopez Andaya
  • TEXTURED BOND PADS
    Publication number: 20210066220
    Abstract: In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 4, 2021
    Inventors: Rafael Jose Lizares GUEVARA, Aniceto Tabangcura RABILAS, JR., Ray Fredric Solis de ASIS, Sylvester Tigno SANCHEZ, Alvin Lopez ANDAYA