Patents by Inventor Ray G. Spiecker

Ray G. Spiecker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4760948
    Abstract: A leadless ceramic chip carrier (LCCC) is soldered to mating conductor pads on a circuit board by depositing a layer of solder paste on peripheral contact pads and on an array of central pads on the board. The same solder paste type and melt temperature are used for both peripheral and central pads. the contact pads of the LCCC are placed on the solder layers and the assembly exposed to infrared radiation from above or other energy source. The LCCC body shades the solder on the central pads resulting in the solder layers at the peripheral pads melting first. The solder on the central pads then melts and balls up due to surface tension lifting the LCCC away from the board stretching the melted solder at the peripheral pads which make the electrical connections to the LCCC contacts.
    Type: Grant
    Filed: June 23, 1987
    Date of Patent: August 2, 1988
    Assignee: RCA Corporation
    Inventor: Ray G. Spiecker