Patents by Inventor Ray Hirt

Ray Hirt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5883830
    Abstract: The CMOS image sensing device includes, on one integrated circuit, a sensor array and compensation circuitry for adjusting signals output from the sensor array to compensate for output signal variations, such as variations caused by voltage, temperature, process or manufacturing variations. The integrated circuit also includes logic circuitry for performing image processing operations on signals output from the sensor array including, for example, pattern recognition operations or filtering operations. In one embodiment, the integrated circuit includes a flash programmable memory array for storing compensation values corresponding to individual pixel elements of the sensor array. In use, the sensor array is illuminated by a flat light source, variations among the magnitude of analog output signals from the elements are detected and corresponding compensation values are calculated. The compensation values are flash programmed into the memory array.
    Type: Grant
    Filed: May 13, 1997
    Date of Patent: March 16, 1999
    Assignee: Intel Corporation
    Inventors: Ray Hirt, Matthew Rollender
  • Patent number: 5824571
    Abstract: A method for securing confidential circuitry from observation by unauthorized inspection, and a secure circuit immune from unauthorized inspection according to the method. In one embodiment, confidential data or circuitry is placed on a face of separate silicon layers, each silicon layer having part of a circuit. Neither silicon layer is intelligible without the other, yet neither can be observed without destroying the other. The two silicon layers are juxtaposed, the face of the first silicon layer flush against and fused to the face of the second silicon layer, the confidential circuits on each silicon layer connecting directly with circuits on the other silicon layer without external connectors. Data stored on each face is erased or destroyed when the silicon layers are separated or one of the silicon layers is destroyed.
    Type: Grant
    Filed: December 20, 1995
    Date of Patent: October 20, 1998
    Assignee: Intel Corporation
    Inventors: Matthew Rollender, Ray Hirt