Patents by Inventor Ray-Iun Liu

Ray-Iun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes
    Publication number: 20030155050
    Abstract: A high-strength and high-conductivity copper alloy is disclosed which contains essentially of: (a) from 0.5 to 2.5 wt % of Ni; (b) from 0.5 to 2.5 wt % of Co; (c) from 0.5 to 0.8 wt % of Si; (d). from 0.05 to 0.15 wt % of either Mg or P or both; and (e) the balance of Cu. The amounts of Co, Ni, and Si satisfy the following equations: 2%≦(Ni+Co)≦4%, and 0.8≦(Ni/4+Co/6)/Si≦1.2. The new copper alloy exhibits substantially improved electrical conductivity, greater than 65% IACA, than the commercially available C7025 copper alloy, while maintaining a satisfactory tensile strength (greater than 600 MPa), and, thus, can be most advantageously used for preparing leadframes for use in high pin-number (greater than 100 pins) IC application.
    Type: Application
    Filed: April 21, 2003
    Publication date: August 21, 2003
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jin-Yaw Liu, Yu-Lian Sha, I-Ching Lee, Mao-Ying Teng, Ray-Iun Liu, Ren-Der Jean
  • High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes and method of making the same
    Patent number: 6506269
    Abstract: A high-strength and high-conductivity copper alloy is disclosed which contains essentially of: (a) from 0.5 to 2.5 wt % of Ni; (b) from 0.5 to 2.5 wt % of Co; (c) from 0.5 to 0.8 wt % of Si; (d) from 0.05 to 0.15 wt % of either Mg or P or both; and (e) the balance of Cu. The amounts of Co, Ni, and Si satisfy the following equations: 2%≦(Ni+Co)≦4%, and 0.8≦(Ni/4+Co/6)/Si≦1.2. The new copper alloy exhibits substantially improved electrical conductivity, greater than 65% IACA, than the commercially available C7025 copper alloy, while maintaining a satisfactory tensile strength (greater than 600 MPa), and, thus, can be most advantageously used for preparing leadframes for use in high pin-number (greater than 100 pins) IC application.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: January 14, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Jin-Yaw Liu, Yu-Lian Sha, I-Ching Lee, Mao-Ying Teng, Ray-Iun Liu, Ren-Der Jean
  • High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes and method of making the same
    Publication number: 20020029827
    Abstract: A high-strength and high-conductivity copper alloy is disclosed which contains essentially of: (a) from 0.5 to 2.5 wt % of Ni; (b) from 0.5 to 2.5 wt % of Co; (c) from 0.5 to 0.8 wt % of Si; (d) from 0.05 to 0.15 wt % of either Mg or P or both; and (e) the balance of Cu. The amounts of Co, Ni, and Si satisfy the following equations: 2%<(Ni+Co)<4%, and 0.8<(Ni/4+Co/6)/Si<1.2. The new copper alloy exhibits substantially improved electrical conductivity, greater than 65% IACA, than the commercially available C7025 copper alloy, while maintaining a satisfactory tensile strength (greater than 600 MPa), and, thus, can be most advantageously used for preparing leadframes for use in high pin-number (greater than 100 pins) IC application.
    Type: Application
    Filed: September 21, 2001
    Publication date: March 14, 2002
    Inventors: Jin-Yaw Liu, Yu-Lian Sha, I-Ching Lee, Mao-Ying Teng, Ray-Iun Liu, Ren-Der Jean