Abstract: An example test system has resources that are distributed for access by a device under test (DUT). The example test system includes a device interface board (DIB) having sites to connect to devices to test, and a tester having slots configured to hold test instruments. Each test instrument has resources that are distributed over a dimension of the DIB. The resources are distributed to enable the devices in the sites equal access to the resources.

Abstract: An example test system has resources that are distributed for access by a device under test (DUT). The example test system includes a device interface board (DIB) having sites to connect to devices to test, and a tester having slots configured to hold test instruments. Each test instrument has resources that are distributed over a dimension of the DIB. The resources are distributed to enable the devices in the sites equal access to the resources.

Abstract: A system includes electronics for testing a device, a reservoir to store coolant, where the reservoir includes a bellows that is compressible, a pump system to move coolant out of the reservoir to cool the electronics, and means to compress the bellows and thereby pressurize the coolant stored in the reservoir so that the coolant remains substantially flush with an interface to the pump system.

Abstract: A system includes electronics for testing a device, a reservoir to store coolant, where the reservoir includes a bellows that is compressible, a pump system to move coolant out of the reservoir to cool the electronics, and means to compress the bellows and thereby pressurize the coolant stored in the reservoir so that the coolant remains substantially flush with an interface to the pump system.

Abstract: An apparatus is provided to cool high-performance instruments within a semiconductor test head using direct facility water. The direct facility water cooling apparatus consists of an air chamber, a first base to receive and removably mount the instrument within the air chamber, a test head inlet in fluid communication with the first base and a facility water supply, a test head discharge in fluid communication with the first base and a facility drain, and a fan in fluid communication with the air chamber inlet to induce the flow of air from the air chamber inlet to the air chamber outlet.

Abstract: An apparatus is provided to cool high-performance instruments within a semiconductor test head using direct facility water. The direct facility water cooling apparatus consists of an air chamber, a first base to receive and removably mount the instrument within the air chamber, a test head inlet in fluid communication with the first base and a facility water supply, a test head discharge in fluid communication with the first base and a facility drain, and a fan in fluid communication with the air chamber inlet to induce the flow of air from the air chamber inlet to the air chamber outlet.

Abstract: Automatic test equipment is disclosed including a console and a testhead cooled by a hybrid cooling system. The testhead includes a card cage assembly having a plurality of slots disposed in spaced-apart relationship and adapted for receiving a plurality of electronic board assemblies. The hybrid cooling system includes a first cooling assembly coupled to the card cage assembly for distributing a first cooling medium proximate the electronic board assemblies and a second cooling assembly. The second cooling assembly is disposed proximate the card cage assembly and includes user-activatable cooling ports for selective access to a second cooling medium for the electronic board assemblies.

Abstract: Automatic test equipment is disclosed including a console and a testhead cooled by a hybrid cooling system. The testhead includes a card cage assembly having a plurality of slots disposed in spaced-apart relationship and adapted for receiving a plurality of electronic board assemblies. The hybrid cooling system includes a first cooling assembly coupled to the card cage assembly for distributing a first cooling medium proximate the electronic board assemblies and a second cooling assembly. The second cooling assembly is disposed proximate the card cage assembly and includes user-activatable cooling ports for selective access to a second cooling medium for the electronic board assemblies.