Abstract: A method of using a conveyor system comprising capturing, with a first camera of the conveyor system, a first image of a server tray and a plurality of hard disks received along a first conveyor belt of the conveyor system, checking, with one or more processors of the conveyor system, a first serial number associated with the server tray and a second set of serial numbers associated with the plurality of hard disks against a reference list of serial numbers, capturing, with a second camera of the conveyor system, a second image of the server tray and the plurality of hard disks, and verifying an integrity status of the server tray and plurality of hard disks based on the second image.

Abstract: A method of using a conveyor system comprising capturing, with a first camera of the conveyor system, a first image of a server tray and a plurality of hard disks received along a first conveyor belt of the conveyor system, checking, with one or more processors of the conveyor system, a first serial number associated with the server tray and a second set of serial numbers associated with the plurality of hard disks against a reference list of serial numbers, capturing, with a second camera of the conveyor system, a second image of the server tray and the plurality of hard disks, and verifying an integrity status of the server tray and plurality of hard disks based on the second image.

Abstract: An electrical chemical plating process is provided. A semiconductor structure is provided in an electrical plating platform. A pre-electrical-plating step is performed wherein the pre-electrical-plating step is carried out under a fixed voltage environment and lasts for 0.2 to 0.5 seconds after the current is above the threshold current of the electrical plating platform. After the pre-electrical-plating step, a first electrical plating step is performed on the semiconductor structure.

Abstract: An electrical chemical plating process is provided. A semiconductor structure is provided in an electrical plating platform. A pre-electrical-plating step is performed wherein the pre-electrical-plating step is carried out under a fixed voltage environment and lasts for 0.2 to 0.5 seconds after the current is above the threshold current of the electrical plating platform. After the pre-electrical-plating step, a first electrical plating step is performed on the semiconductor structure.

Abstract: An electrical chemical plating process is provided. A semiconductor structure is provided in an electrical plating platform. A pre-electrical-plating step is performed wherein the pre-electrical-plating step is carried out under a fixed voltage environment and lasts for 0.2 to 0.5 seconds after the current is above the threshold current of the electrical plating platform. After the pre-electrical-plating step, a first electrical plating step is performed on the semiconductor structure.

Abstract: An electronic device having a stretchable USB receptacle is provided. An extending connecting cable is added to the USB receptacle on the electronic device. In normal condition, the connecting cable is accommodated in a cable reel to make the USB receptacle accommodated in an accommodating recess of the electronic device to keep consistency of the appearance. In using condition, the USB receptacle may be taken out and used in a needed place by drawing out the connecting cable. This overcomes the disadvantage that the conventional adjacent USB receptacles may be interfered with each other, and the scope of use also increases.

Abstract: An electronic device having a stretchable USB receptacle is provided. An extending connecting cable is added to the USB receptacle on the electronic device. In normal condition, the connecting cable is accommodated in a cable reel to make the USB receptacle accommodated in an accommodating recess of the electronic device to keep consistency of the appearance. In using condition, the USB receptacle may be taken out and used in a needed place by drawing out the connecting cable. This overcomes the disadvantage that the conventional adjacent USB receptacles may be interfered with each other, and the scope of use also increases.

Abstract: A method for expanding human corneal endothelial cells includes: (a) providing an amniotic membrane with or without amniotic cells, wherein the amniotic membrane has an extracellular matrix; (b) placing onto the amniotic membrane, a sheet of endothelial layer, or a cell suspension including human corneal endothelial stem cells; and (c) culturing the corneal endothelial cells on the amniotic membrane for a duration sufficient for the corneal endothelial stem cells to expand to an appropriate area. The invention also relates to a method for creating a surgical graft for a recipient site of a patient using the method for expanding human corneal endothelial cells, and the surgical graft prepared therefrom.

Abstract: A lamp having a planar light-emitting source includes a light-guiding structure, a light-emitting portion, and a shading supporting seat. The point-shaped lighting units of the light-emitting portion emit the point-shaped light beams toward the side plane of the light-guiding structure. Then, these beams enter the light-guiding structure. After turning approximately 90 degrees, a uniformly distributed planar light generated from the light-emitting plane of the light-guiding structure. So, a planar light source is obtained. In this invention, it has a planar light-emitting function with better lighting efficiency. The planar lighting is evenly distributed without shadow. Its energy consumption and heat generation are low. The product's life is prolonged. Its volume is small and it is portable.