Abstract: The present invention refers to a method for processing a wafer like substrate using a touching gripper and a touchless gripper. Furthermore, the present invention refers to an apparatus for processing a wafer-like substrate containing a touching gripper and a touchless gripper. Additionally, the present invention refers to the use of an inventive apparatus to process a wafer-like substrate.

Abstract: Device for vertical galvanic metal deposition on a substrate comprising a first and a second device, arranged vertically parallel to each other; the first device comprising a first anode having a plurality of through-going conduits and a first carrier having a plurality of through-going conduits; wherein said first anode and said first carrier are connected to each other; wherein the second device comprises a first substrate holder adapted to receive a first substrate to be treated, wherein said first substrate holder at least partially surrounds the first substrate along its outer frame, wherein the first device further comprises a plurality of plugs, each plug comprising a through-going channel, each plug arranged such that it runs from the backside of the first carrier through a through-going conduit of the first carrier and further through the conduit of the first anode element, and the plugs are detachably connected to the first device.

Abstract: The present invention refers to a method for processing a wafer like substrate using a touching gripper and a touchless gripper. Furthermore, the present invention refers to an apparatus for processing a wafer-like substrate containing a touching gripper and a touchless gripper. Additionally, the present invention refers to the use of an inventive apparatus to process a wafer-like substrate.

Abstract: Device for vertical galvanic metal deposition on a substrate comprising a first and a second device, arranged vertically parallel to each other; the first device comprising a first anode having a plurality of through-going conduits and a first carrier having a plurality of through-going conduits; wherein said first anode and said first carrier are connected to each other; wherein the second device comprises a first substrate holder adapted to receive a first substrate to be treated, wherein said first substrate holder at least partially surrounds the first substrate along its outer frame, wherein the first device further comprises a plurality of plugs, each plug comprising a through-going channel, each plug arranged such that it runs from the backside of the first carrier through a through-going conduit of the first carrier and further through the conduit of the first anode element, and the plugs are detachably connected to the first device.

Abstract: This invention concerns a method for galvanic metal deposition of a substrate using an anode and an electrolyte, wherein from each of a plurality of electrolyte nozzles a locally confined electrolyte stream is directed towards a part of a substrate surface which is to be treated, wherein a relative movement is carried out between the substrate and the electrolyte stream during deposition, characterized in that a first movement is carried out along a first path, wherein at least along a part of the first path a second movement is carried out along a second path, wherein the first and the second movement each are relative movements between the electrolyte stream and the substrate. Further, the invention concerns a substrate holder reception apparatus and an electrochemical treatment apparatus.

Abstract: This invention concerns a method for galvanic metal deposition of a substrate using an anode and an electrolyte, wherein from each of a plurality of electrolyte nozzles a locally confined electrolyte stream is directed towards a part of a substrate surface which is to be treated, wherein a relative movement is carried out between the substrate and the electrolyte stream during deposition, characterized in that a first movement is carried out along a first path, wherein at least along a part of the first path a second movement is carried out along a second path, wherein the first and the second movement each are relative movements between the electrolyte stream and the substrate. Further, the invention concerns a substrate holder reception apparatus and an electrochemical treatment apparatus.

Abstract: A method and device for vertical galvanic metal deposition on a substrate, the device including at least first and second device elements arranged vertically parallel to each other, the first device element including at least a first anode element having a plurality of through-going conduits and at least a first carrier element having a plurality of through-going conduits, the at least first anode element and the at least first carrier element firmly connected to each other; and the second device element including at least a first substrate holder adapted to receive at least one substrate to be treated, the at least one substrate holder at least partially surrounding the at least one substrate along its outer frame after receiving it; the distance between the first anode element and the at least first substrate holder ranging from 2 to 15 mm.

Abstract: The present invention is related to a device for vertical galvanic metal, preferably copper, deposition on a substrate, a container suitable for receiving such a device and a substrate holder, which is suitable for receiving a substrate to be treated, and the use of such a device inside of such a container for galvanic metal, in particular copper, deposition on a substrate.

Abstract: A method and device for vertical galvanic metal deposition on a substrate, the device including at least first and second device elements arranged vertically parallel to each other, the first device element including at least a first anode element having a plurality of through-going conduits and at least a first carrier element having a plurality of through-going conduits, the at least first anode element and the at least first carrier element firmly connected to each other; and the second device element including at least a first substrate holder adapted to receive at least one substrate to be treated, the at least one substrate holder at least partially surrounding the at least one substrate along its outer frame after receiving it; the distance between the first anode element and the at least first substrate holder ranging from 2 to 15 mm.

Abstract: A holding device for a treatment of a product (5), which holding device comprises a first holding part (41) and a second holding part (42). The first holding part (41) comprises at least one first electrical contact element (13) for establishing a contact with a first side (6) of the product (5). The second holding part (42) comprises at least one second electrical contact element (14) for establishing a contact with a second side (7) of the product (5), which second side that lies opposite the first side (6). The first holding part (41) and the second holding part (42) are arranged in such a way that they can be fastened to one another in a detachable manner for the purpose of holding the product (5). A product seal (15, 16) and a housing seal (17) provide a sealing arrangement to prevent the penetration of fluid into the at least one first electrical contact element (13) and the at least one second electrical contact element (14) in a treatment state.

Abstract: The present invention is related to a device for vertical galvanic metal, preferably copper, deposition on a substrate, a container suitable for receiving such a device and a substrate holder, which is suitable for receiving a substrate to be treated, and the use of such a device inside of such a container for galvanic metal, in particular copper, deposition on a substrate.

Abstract: A holding device for a treatment of a product (5), which holding device comprises a first holding part (41) and a second holding part (42). The first holding part (41) comprises at least one first electrical contact element (13) for establishing a contact with a first side (6) of the product (5). The second holding part (42) comprises at least one second electrical contact element (14) for establishing a contact with a second side (7) of the product (5), which second side that lies opposite the first side (6). The first holding part (41) and the second holding part (42) are arranged in such a way that they can be fastened to one another in a detachable manner for the purpose of holding the product (5). A product seal (15, 16) and a housing seal (17) provide a sealing arrangement to prevent the penetration of fluid into the at least one first electrical contact element (13) and the at least one second electrical contact element (14) in a treatment state.