Abstract: The disclosure is and includes at least an apparatus, system and method for a rotary table suitable to receive surface mount technology (SMT) components onto a circuit board associated therewith. The apparatus, system and method may include a frame suitable for insertion into a pick and place machine, and having a receiving inset therein; a fixture suitable for removable insertion to the receiving inset; a plurality of roller bearings interactively associated with the fixture, and which impart a low friction roll to at least a perimeter portion of the fixture; and at least one guide on the frame suitable to at least partially positional maintain the circuit board associated with the fixture.

Abstract: An apparatus, system and method for placing components on a circuit board by a pick and place machine. The apparatus, system and method may include a rotational table suitable to receive and hold the circuit board for the pick and place machine; at least one sensor capable of sensing an off-center fiducial on the circuit board after association with the rotational table; and at least one processor connective with at least one computing memory having therein non-transitory computing code.

Abstract: An apparatus, system and method for dispensing underfill to components on a printed circuit board. The apparatus, system, and method includes a dispensing end effector suitable for dispensing underfill to components on a printed circuit board within an underfill chamber. The dispensing end effector may include: an electromechanical connection to at least one dispensing robot arm capable of physically situating the dispensing proximate to the circuit board; a communicative connection to a dispense controller capable of communicatively controlling at least the dispensing; a dispenser which includes an underfill output port, which is capable of the dispensing, and which is removably mounted to the electromechanical association; and a protective enclosure at least substantially about the dispenser.

Abstract: An apparatus, system and method for dispensing underfill to components on a printed circuit board. The apparatus, system and method may include an underfill chamber having an input through which the printed circuit board is received; at least one dispensing robot capable of dispensing the underfill to the components; a lower heater suitable to substantially evenly heat at least half of or the entirety of an underside of the printed circuit board once the printed circuit board is within the underfill chamber; and an overhead heater capable of heating up to half of a topside of the printed circuit board once the printed circuit board is within the underfill chamber.

Abstract: An apparatus, system and method for a carrier suitable to carry a circuit board through a semiconductor underfill process. The apparatus, system and method includes a modular carrier capable of supporting a printed circuit board during at least an underfill process, the modular carrier comprising: an outer frame having, at least about a center point thereof, at least one open aspect; and at least one frame inset suitable to be removably placed within the at least one open aspect, and capable of supporting at least a first type of the printed circuit board.