Patents by Inventor Raymon S. Anglin Williams

Raymon S. Anglin Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11844197
    Abstract: An embodiment of an electronic apparatus may include an electronic device package having a first surface, a heat conductive structure having a second surface, a reservoir structure positioned between the first surface of the electronic device package and the second surface of the heat conductive structure, and a thermal interface material disposed within the reservoir structure between the first surface of the electronic device package and the second surface of the heat conductive structure to place the first surface in thermal communication with the second surface. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: December 12, 2023
    Assignee: Intel Corporation
    Inventor: Raymon S. Anglin Williams
  • Publication number: 20200214175
    Abstract: An embodiment of an electronic apparatus may include an electronic device package having a first surface, a heat conductive structure having a second surface, a reservoir structure positioned between the first surface of the electronic device package and the second surface of the heat conductive structure, and a thermal interface material disposed within the reservoir structure between the first surface of the electronic device package and the second surface of the heat conductive structure to place the first surface in thermal communication with the second surface. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: March 6, 2020
    Publication date: July 2, 2020
    Applicant: Intel Corporation
    Inventor: Raymon S. Anglin Williams