Abstract: The present invention relates to a process for the rework of bottom terminated leadless devices as well as a pair of stencils for the manual reattachment of such devices (commonly known as a QFN, LGA or MLF packages). This process is used to remount these devices once they have been removed from the printed circuit board or placing new devices on an already populated PCB. It is also used to add bumps to the bottom side of an electronic device package or pads.

Abstract: The present invention relates to a method of applying solder paste, flux or adhesive to a component site on a printed circuit board in order to mount an electronic component on the printed circuit board. The method includes the steps of aligning a flexible stencil with the component site on the printed circuit board such that apertures in the stencil are aligned with desired contact locations at the component site and adhering the stencil to the printed circuit board using a permanent adhesive. Solder paste, flux or adhesive is applied onto the stencil such that the solder paste, flux or adhesive fills a plurality of the apertures in the stencil the electronic component is placed on the printed circuit board over the stencil. A method of applying new solder balls to a connection side of an electronic component is also provided.